利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

31 条记录 (耗时 0.045 秒)

    Low-staining adhesive sheets and method for removing resist material
    12.
    发明授权
    Low-staining adhesive sheets and method for removing resist material 有权
    低污染粘合片和去除抗蚀材料的方法

    公开(公告)号：US06602599B1

    公开(公告)日：2003-08-05

    申请号：US09590131

    申请日：2000-06-09

    申请人： Eiji Toyoda ,  Makoto Namikawa ,  Yoshio Terada

    发明人： Eiji Toyoda ,  Makoto Namikawa ,  Yoshio Terada

    IPC分类号： B32B2730

    CPC分类号： H01L21/6836 ,  C09J7/20 ,  C09J2203/31 ,  C09J2203/326 ,  H01L2221/68327 ,  Y10T428/1452 ,  Y10T428/1462 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2891

    摘要： A low-staining adhesive sheet provided with an adhesive layer containing as the main component a pressure-sensitive adhesive polymer on a base film, wherein the pressure-sensitive adhesive polymer is substantially free from oligomeric low-molecular weight matters; and a method for removing a resist material by using this low-staining adhesive sheet. This low-staining adhesive sheet gives no organic staining matters remaining on the surface of article (for example, substrate) to be used as an adherend and is useful in removing a resist material and foreign matters, and re-peeling surface-protectors, masking materials, and other materials.

    摘要翻译： 一种低染色粘合片，其具有在基膜上含有压敏粘合剂聚合物作为主要成分的粘合剂层，其中该粘合剂聚合物基本上不含低聚物低分子量物质; 以及通过使用该低色粘接片除去抗蚀剂材料的方法。 这种低染色粘合片不会在用作被粘物的物品（例如基材）的表面上残留有机染色物质，并且可用于除去抗蚀剂材料和异物，并且再剥离表面保护剂，掩蔽 材料等材料。

    Cleaning sheet and method of cleaning substrate processing equipment
    13.
    发明授权
    Cleaning sheet and method of cleaning substrate processing equipment 有权
    清洗板及清洗基板加工设备的方法

    公开(公告)号：US07846258B2

    公开(公告)日：2010-12-07

    申请号：US10535842

    申请日：2003-11-10

    申请人： Yoshio Terada ,  Makoto Namikawa ,  Eiji Toyoda

    发明人： Yoshio Terada ,  Makoto Namikawa ,  Eiji Toyoda

    IPC分类号： B08B7/00 ,  B08B7/12

    CPC分类号： B08B1/00 ,  B08B3/08 ,  G02F2001/1316 ,  Y10T428/14 ,  Y10T428/28

    摘要： A cleaning sheet comprises a cleaning layer provided on one side of a base material, from which cleaning layer F−, Cl−, Br−, NO2−, NO3−, PO43−, SO42−, Na+, NH4+ and K+ are extractable with pure water each in an amount of not greater than 20 ppm, when extracted under boiling at 120° C. for 1 hour, and a pressure-sensitive adhesive layer provided on the other side of the base material, a carrying material with cleaning capacity comprising the aforementioned cleaning sheet laminated on a carrying material with a pressure-sensitive adhesive layer. The present disclosure also relates to a method for cleaning a substrate processing equipment which comprises conveying the aforementioned carrying material with cleaning capacity into the substrate processing equipment.

    摘要翻译： 清洁片包括设置在基材一侧上的清洁层，清洁层F-，Cl-，Br-，NO2-，NO3-，PO43-，SO42-，Na +，NH4 +和K +可从其中纯化 当在120℃下沸腾提取1小时时，各自的量不大于20ppm，并且设置在基材另一侧的压敏粘合剂层，具有清洁能力的载体材料包括 上述清洁片层压在携带材料上的压敏粘合剂层。 本公开还涉及一种用于清洁基板处理设备的方法，其包括将具有清洁能力的上述携带材料输送到基板处理设备中。

    Cleaning sheet and method for cleaning substrate processing apparatus
    15.
    发明申请
    Cleaning sheet and method for cleaning substrate processing apparatus 有权

    公开(公告)号：US20060151004A1

    公开(公告)日：2006-07-13

    申请号：US10535842

    申请日：2003-11-10

    申请人： Yoshio Terada ,  Makoto Namikawa ,  Eiji Toyoda

    发明人： Yoshio Terada ,  Makoto Namikawa ,  Eiji Toyoda

    IPC分类号： B08B7/00

    CPC分类号： B08B1/00 ,  B08B3/08 ,  G02F2001/1316 ,  Y10T428/14 ,  Y10T428/28

    摘要： An aim of the invention is to provide a cleaning member which causes no contamination of a substrate processing equipment by ionic impurities in the removal of foreign matters attached to the interior of the equipment through cleaning by the conveyance thereof into the equipment, a cleaning member which causes little contamination of a substrate processing equipment by metal impurities attributed to a protective film in the removal of foreign matters attached to the interior of the equipment through cleaning by the conveyance thereof into the equipment and a cleaning member which causes no contamination of a substrate processing equipment by metal impurities in the removal of foreign matters attached to the interior of the equipment through cleaning by the conveyance thereof into the equipment. The means for solving the aims of the invention concerns a cleaning sheet comprising a cleaning layer provided on one side of a base material, from which cleaning layer F−, Cl−, Br−, NO2−, NO3−, PO43−, SO42−, Na+, NH4+ and K+ are extractable with pure water each in an amount of not greater than 20 ppm (as extracted under boiling at 120° C. for 1 hour), and a pressure-sensitive adhesive layer provided on the other, a carrying material with cleaning capacity comprising the aforementioned cleaning sheet laminated on a carrying material with a pressure-sensitive adhesive layer and a method for cleaning a substrate processing equipment which comprises conveying the aforementioned carrying material with cleaning capacity into the substrate processing equipment; a cleaning sheet comprising a releasable protective film laminated on a cleaning layer, wherein the protective film is formed by a material from which metal elements such as Na, K, Ca, Mg, Al, Ti, Cr, Mn, Fe, Co, Ni, Cu and Zn or compounds thereof are transferred to a silicon wafer each in an amount of not greater than 1×1012 atoms/cm2 as calculated in terms of metal element when the protective film is brought into contact with (the mirror surface of) the silicon wafer at 23° C. for 1 minute, a carrying material with cleaning capacity comprising the aforementioned cleaning sheet laminated on a carrying material with a pressure-sensitive adhesive layer and a method for cleaning a substrate processing equipment which comprises conveying the aforementioned carrying material with cleaning capacity into the substrate processing equipment with the releasable protective film peeled off the cleaning layer; and a cleaning sheet comprising a cleaning layer provided on one side of a base material, which cleaning layer containing metal elements such as Na, K, Mg, Al, Ca, Ti, Cr, Mn, Fe, Co, Ni, Cu and Zn or compounds thereof each in an amount of not greater than 5 ppm (μg/g) as calculated in terms of metal element, and a pressure-sensitive adhesive layer provided on the other, a carrying material with cleaning capacity comprising the aforementioned cleaning sheet laminated on a carrying material with a pressure-sensitive adhesive layer and a method for cleaning a substrate processing equipment which comprises conveying the aforementioned carrying material with cleaning capacity into the substrate processing equipment.

    Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them
    16.
    发明授权
    Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them 有权
    清洁片，使用其的输送部件，以及使用它们的基板处理设备清洗方法

    公开(公告)号：US06821620B2

    公开(公告)日：2004-11-23

    申请号：US10311065

    申请日：2002-12-13

    申请人： Makoto Namikawa ,  Yoshio Terada ,  Eiji Toyoda

    发明人： Makoto Namikawa ,  Yoshio Terada ,  Eiji Toyoda

    IPC分类号： B32B2730

    CPC分类号： B08B1/00 ,  B08B7/00 ,  B08B7/0028 ,  Y10T428/1462 ,  Y10T428/1476 ,  Y10T428/1481 ,  Y10T428/28 ,  Y10T428/2839 ,  Y10T428/2891

    摘要： A cleaning sheet has a cleaning layer having a surface resistivity not less than 1×1013 &OHgr;/□. In a method of manufacturing a conveying member with a cleaning function, for sticking the cleaning sheet, in which the cleaning layer formed of an adhesive that is polymerized/cured by an active energy is provided onto one surface of a base material and an ordinary adhesive layer is provided onto the other surface thereof, onto the conveying member via an ordinary adhesive layer to have a shape larger than the shape of the conveying member and then cutting the cleaning sheet along a shape of the conveying member, wherein a polymerizing/curing reaction of the cleaning layer is carried out after the cleaning sheet is cut out into the shape of the conveying member.

    摘要翻译： 清洁片具有表面电阻率不小于1×10 13Ω/□的清洁层。 在制造具有清洁功能的输送部件的方法中，用于粘贴清洁片，其中将由活性能聚合/固化的粘合剂形成的清洁层设置在基材的一个表面上，并将普通粘合剂 层通过普通的粘合剂层被提供到其另一个表面上，以使其具有比输送构件的形状大的形状，然后沿着输送构件的形状切割清洁片，其中聚合/固化反应 在清洁片被切割成输送构件的形状之后进行清洁层。

    CLEANING SHEET, CLEANING MEMBER, CLEANING METHOD, AND CONTINUITY TEST APPARATUS
    17.
    发明申请
    CLEANING SHEET, CLEANING MEMBER, CLEANING METHOD, AND CONTINUITY TEST APPARATUS 审中-公开
    清洁表，清洁会员，清洁方法和连续测试装置

    公开(公告)号：US20120280706A1

    公开(公告)日：2012-11-08

    申请号：US13464861

    申请日：2012-05-04

    申请人： Daisuke Uenda ,  Makoto Namikawa ,  Takeshi Matsumura

    发明人： Daisuke Uenda ,  Makoto Namikawa ,  Takeshi Matsumura

    IPC分类号： G01R1/067 ,  B08B1/00 ,  A47L25/00 ,  A47L13/10

    CPC分类号： B08B1/006

    摘要： Provided is a cleaning unit for removing foreign matter adhering to a probe needle of a probe card for a continuity test, the cleaning unit being capable of effectively removing the foreign matter adhering to the probe needle without abrading the probe needle. A cleaning sheet of the present invention is a cleaning sheet, including a cleaning layer for removing foreign matter adhering to a probe needle of a probe card for a continuity test, in which the cleaning layer has an arithmetic average roughness Ra in conformity with JIS-B-0601 of 100 nm or less.

    摘要翻译： 提供一种用于除去附着在用于连续性试验的探针卡的探针上的异物的清洁单元，该清洁单元能够有效地除去附着在探针上的异物而不会磨损探针。 本发明的清洁片是清洁片，其具有用于除去附着在用于连续性试验的探针卡的探针上的异物的清洁层，其中清洁层的算术平均粗糙度Ra符合JIS- B-0601为100nm以下。

    Process and apparatus for the removal of resist
    20.
    发明授权
    Process and apparatus for the removal of resist 失效
    去除抗蚀剂的方法和设备

    公开(公告)号：US6040110A

    公开(公告)日：2000-03-21

    申请号：US129842

    申请日：1998-08-06

    申请人： Seiichirou Shirai ,  Toshihiko Onozuka ,  Takayuki Noishiki ,  Satoshi Sakai ,  Katsuhiro Sasajima ,  Eiji Toyoda ,  Makoto Namikawa

    发明人： Seiichirou Shirai ,  Toshihiko Onozuka ,  Takayuki Noishiki ,  Satoshi Sakai ,  Katsuhiro Sasajima ,  Eiji Toyoda ,  Makoto Namikawa

    IPC分类号： C09J7/00 ,  C09J5/00 ,  G03F7/34 ,  G03F7/42 ,  H01L21/027 ,  H01L21/311 ,  G03C11/12

    CPC分类号： H01L21/31127 ,  G03F7/42 ,  G03F7/34

    摘要： The present invention provides a process for the removal of a resist layer formed on a semiconductor substrate, which enables easy removal of a resist layer without causing any damage on a gate oxide layer, and an apparatus therefor. The process comprises the steps of forming a gate oxide layer on the semiconductor substrate; forming a resist layer as a resist pattern on the gate oxide layer; removing the gate oxide layer at unnecessary area utilizing the resist layer as a mask; applying a pressure-sensitive adhesive sheet to the semiconductor substrate such that the gate oxide layer left on the semiconductor substrate and the resist layer are masked, and peeling the pressure-sensitive adhesive sheet together with the resist layer off the semiconductor substrate to separate and remove the resist layer from the semiconductor substrate.

    摘要翻译： 本发明提供一种去除形成在半导体衬底上的抗蚀剂层的方法，其能够容易地除去抗蚀剂层而不会对栅极氧化物层造成任何损坏，以及其装置。 该方法包括在半导体衬底上形成栅极氧化层的步骤; 在栅极氧化物层上形成作为抗蚀剂图案的抗蚀剂层; 使用抗蚀剂层作为掩模去除不需要的区域的栅极氧化物层; 将压敏粘合片施加到半导体衬底上，使得残留在半导体衬底上的栅极氧化物层和抗蚀剂层被掩蔽，并将压敏粘合片与抗蚀剂层一起剥离出半导体衬底以分离和去除 来自半导体衬底的抗蚀剂层。