公开(公告)号：US20120280706A1

公开(公告)日：2012-11-08

申请号：US13464861

申请日：2012-05-04

申请人： Daisuke Uenda ,  Makoto Namikawa ,  Takeshi Matsumura

发明人： Daisuke Uenda ,  Makoto Namikawa ,  Takeshi Matsumura

IPC分类号： G01R1/067 ,  B08B1/00 ,  A47L25/00 ,  A47L13/10

CPC分类号： B08B1/006

摘要： Provided is a cleaning unit for removing foreign matter adhering to a probe needle of a probe card for a continuity test, the cleaning unit being capable of effectively removing the foreign matter adhering to the probe needle without abrading the probe needle. A cleaning sheet of the present invention is a cleaning sheet, including a cleaning layer for removing foreign matter adhering to a probe needle of a probe card for a continuity test, in which the cleaning layer has an arithmetic average roughness Ra in conformity with JIS-B-0601 of 100 nm or less.

摘要翻译： 提供一种用于除去附着在用于连续性试验的探针卡的探针上的异物的清洁单元，该清洁单元能够有效地除去附着在探针上的异物而不会磨损探针。 本发明的清洁片是清洁片，其具有用于除去附着在用于连续性试验的探针卡的探针上的异物的清洁层，其中清洁层的算术平均粗糙度Ra符合JIS- B-0601为100nm以下。

公开(公告)号：US20050244632A1

公开(公告)日：2005-11-03

申请号：US11014779

申请日：2004-12-20

申请人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

发明人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

IPC分类号： B08B7/00 ,  B32B27/06

CPC分类号： B08B1/00 ,  B08B7/00 ,  B08B7/0028 ,  Y10T428/2848 ,  Y10T428/31721

摘要： A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.

摘要翻译： 提供了一种用于清除离开基板处理设备内部的异物的清洁片。 清洁片包括基本上没有粘性并且根据JIS K7127测定的拉伸模量不低于0.98N / mm 2的清洁层。 或者，清洁片包括维氏硬度不低于10MPa的清洁层。

公开(公告)号：US07793668B2

公开(公告)日：2010-09-14

申请号：US11014779

申请日：2004-12-20

申请人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

发明人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

IPC分类号： B08B3/00

CPC分类号： B08B1/00 ,  B08B7/00 ,  B08B7/0028 ,  Y10T428/2848 ,  Y10T428/31721

摘要： A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.

摘要翻译： 提供了一种用于清除离开基板处理设备内部的异物的清洁片。 清洁片包括基本上没有粘性并且根据JIS K7127测定的拉伸模量不低于0.98N / mm 2的清洁层。 或者，清洁片包括维氏硬度不低于10MPa的清洁层。

公开(公告)号：US20100319151A1

公开(公告)日：2010-12-23

申请号：US12851797

申请日：2010-08-06

申请人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

发明人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

IPC分类号： A47L25/00

CPC分类号： B08B1/00 ,  B08B7/00 ,  B08B7/0028 ,  Y10T428/2848 ,  Y10T428/31721

摘要： A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.

摘要翻译： 提供了一种用于清除离开基板处理设备内部的异物的清洁片。 清洁片包括基本上没有粘性并且根据JIS K7127测定的拉伸模量不低于0.98N / mm 2的清洁层。 或者，清洁片包括维氏硬度不低于10MPa的清洁层。

公开(公告)号：US07575812B2

公开(公告)日：2009-08-18

申请号：US11252800

申请日：2005-10-19

申请人： Yoshio Terada ,  Hirofumi Fujii ,  Makoto Namikawa ,  Daisuke Uenda ,  Yasuhiro Amano

发明人： Yoshio Terada ,  Hirofumi Fujii ,  Makoto Namikawa ,  Daisuke Uenda ,  Yasuhiro Amano

IPC分类号： B32B27/06 ,  B32B7/12 ,  B08B7/00

CPC分类号： B32B27/28 ,  B32B27/06 ,  B32B27/34 ,  B32B27/36 ,  B32B2307/31 ,  B32B2307/54 ,  B32B2432/00 ,  Y10T428/28 ,  Y10T428/2896 ,  Y10T428/31504 ,  Y10T428/31721

摘要： The present invention provides a cleaning substrate of a substrate processing equipment, which comprises a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20° C. up to 150° C. being 5×107 Pa to 1×109 Pa on at least one face of the substrate; and a polyimide resin suitable as the heat resistant resin for the cleaning layer and usable under circumstances possibly involving the generation of serious disadvantages due to silicone contamination, such as for HDD application and some semiconductor applications.

摘要翻译： 本发明提供了一种基板处理设备的清洁基板，其包括在20℃至150℃下具有储能模量（1Hz）的耐热树脂的清洁层，为5×10 7 Pa至1×10 9 Pa 底物的至少一个面; 以及适合用作清洁层的耐热树脂的聚酰亚胺树脂，并且可用于可能涉及由于硅氧烷污染而产生严重缺点的环境，例如用于HDD应用和一些半导体应用。

公开(公告)号：US20060141258A1

公开(公告)日：2006-06-29

申请号：US11252800

申请日：2005-10-19

申请人： Yoshio Terada ,  Hirofumi Fujii ,  Makoto Namikawa ,  Daisuke Uenda ,  Yasuhiro Amano

发明人： Yoshio Terada ,  Hirofumi Fujii ,  Makoto Namikawa ,  Daisuke Uenda ,  Yasuhiro Amano

IPC分类号： B32B27/00

CPC分类号： B32B27/28 ,  B32B27/06 ,  B32B27/34 ,  B32B27/36 ,  B32B2307/31 ,  B32B2307/54 ,  B32B2432/00 ,  Y10T428/28 ,  Y10T428/2896 ,  Y10T428/31504 ,  Y10T428/31721

摘要： The present invention provides a cleaning substrate of a substrate processing equipment, which comprises a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20° C. up to 150° C. being 5×107 Pa to 1×109 Pa on at least one face of the substrate; and a polyimide resin suitable as the heat resistant resin for the cleaning layer and usable under circumstances possibly involving the generation of serious disadvantages due to silicone contamination, such as for HDD application and some semiconductor applications.

摘要翻译： 本发明提供一种基板处理设备的清洁基板，其包括在20℃至150℃下具有储能模量（1Hz）的耐热树脂的清洁层，为5×10 7 / 在衬底的至少一个面上的SUP> Pa至1×10 9 Pa; 以及适合用作清洁层的耐热树脂的聚酰亚胺树脂，并且可用于可能涉及由于硅氧烷污染而产生严重缺点的环境，例如用于HDD应用和一些半导体应用。

公开(公告)号：US20060105164A1

公开(公告)日：2006-05-18

申请号：US11229586

申请日：2005-09-20

申请人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

发明人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

IPC分类号： C23G1/00 ,  B08B7/00 ,  B32B27/04 ,  B32B7/12

CPC分类号： B08B1/00 ,  B08B7/00 ,  B08B7/0028 ,  C08G73/12 ,  C08G73/16 ,  C08J7/047 ,  C08J2409/00 ,  C08J2479/00 ,  G11B5/41 ,  Y10T428/28 ,  Y10T442/2738

摘要： A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.

摘要翻译： 提供了一种用于清除离开基板处理设备内部的异物的清洁片。 清洁片包括基本上没有粘性并且根据JIS K7127测定的拉伸模量不低于0.98N / mm 2的清洁层。 或者，清洁片包括维氏硬度不低于10MPa的清洁层。

公开(公告)号：US20100175716A1

公开(公告)日：2010-07-15

申请号：US12377063

申请日：2007-06-28

申请人： Yuki Sugo ,  Yoshio Terada ,  Daisuke Uenda ,  Makoto Namikawa ,  Yoshinori Yoshida ,  Youhei Maeno

发明人： Yuki Sugo ,  Yoshio Terada ,  Daisuke Uenda ,  Makoto Namikawa ,  Yoshinori Yoshida ,  Youhei Maeno

IPC分类号： B08B7/02 ,  A46D1/00

CPC分类号： H01L21/67046 ,  B08B1/00 ,  B08B7/0028 ,  C23C16/4407

摘要： Provided is a cleaning member, which is capable of removing minute foreign matter, preferably foreign matter of a submicron level simply, exactly, and sufficiently, without contaminating a cleaning site. Further provided is a delivery member with a cleaning function having the cleaning member and a method of cleaning a substrate processing apparatus using the delivery member with a cleaning function. The cleaning member of the present invention includes a cleaning layer having a plurality of protrusions of a columnar structure on the surface, in which an aspect ratio of the protrusions of a columnar structure is 5 or more.

摘要翻译： 本发明提供一种清洁部件，其能够简单，准确且充分地除去微小的异物，优选亚微米级的异物，而不会污染清洁部位。 还提供具有清洁功能的传送部件，其具有清洁部件，以及使用具有清洁功能的传送部件清洁基板处理设备的方法。 本发明的清洁部件具有在柱面结构的突起长宽比为5以上的表面上具有多个柱状结构的突起的清洗层。

公开(公告)号：US08841757B2

公开(公告)日：2014-09-23

申请号：US13298614

申请日：2011-11-17

申请人： Daisuke Uenda ,  Takeshi Matsumura ,  Koichi Inoue ,  Miki Morita

发明人： Daisuke Uenda ,  Takeshi Matsumura ,  Koichi Inoue ,  Miki Morita

IPC分类号： H01L21/00 ,  H01L23/552 ,  H01L21/683 ,  H01L21/56 ,  H01L23/544

CPC分类号： H01L23/552 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68386 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2224/83862 ,  H01L2924/01019 ,  H01L2924/01037 ,  H01L2924/01055 ,  H01L2924/01079 ,  Y10T428/28 ,  H01L2924/00

摘要： An electromagnetic wave shielding layer can be provided on the backside of a semiconductor element that is flip-chip connected to an adherend, and a semiconductor device having the electromagnetic wave shielding layer can be manufactured without deteriorating productivity. The present invention provides a film for the backside of a flip-chip type semiconductor to be formed on the backside of a semiconductor element that is flip-chip connected to an adherend, having an adhesive layer and an electromagnetic wave shielding layer.

摘要翻译： 可以在倒装芯片连接到被粘物的半导体元件的背面设置电磁波屏蔽层，并且可以制造具有电磁波屏蔽层的半导体器件，而不会降低生产率。 本发明提供了一种用于倒装芯片型半导体的背面的薄膜，该薄膜将形成在半导体元件的背面，该半导体元件倒装芯片连接到具有粘合剂层和电磁波屏蔽层的被粘物。

公开(公告)号：US20070163621A1

公开(公告)日：2007-07-19

申请号：US10591330

申请日：2005-03-07

申请人： Hitoshi Ishizaka ,  Daisuke Uenda ,  Daisuke Hanai

发明人： Hitoshi Ishizaka ,  Daisuke Uenda ,  Daisuke Hanai

IPC分类号： B08B9/00

CPC分类号： H01L21/6715 ,  H01L21/6708

摘要： An object is to provide a cleaning member for semiconductor apparatus which can easily remove, without fail, foreign matters adherent to inner parts of a semiconductor apparatus, can bear a clearly readable mark for lot management, and can be prevented from generating particles upon contact with the holding part of a wafer case. A cleaning member for semiconductor apparatus, characterized in that the cleaning member comprises a wafer 1 and formed on at least one side thereof a cleaning layer 2 made of a heat-resistant resin formed by thermally curing a poly(amic acid), and that the cleaning layer 2 has a part 12 where a wafer surface is exposed; and in particular a cleaning member for semiconductor apparatus having the constitution described above wherein that part 12 in the cleaning layer 2 in which a wafer surface is exposed is a part where the cleaning layer has been removed throughout the whole circular area having a given width ranging from the peripheral edge of the wafer toward the center thereof.

摘要翻译： 本发明的目的是提供一种用于半导体装置的清洁部件，其能够容易地去除附着于半导体装置的内部部件的异物，从而能够为批次管理提供清晰可读的标记，并且可以防止在接触时产生颗粒 晶片盒的保持部分。 一种用于半导体装置的清洁部件，其特征在于，所述清洁部件包括晶片1，并且在其至少一侧上形成由通过热固化聚（酰胺酸）形成的耐热树脂制成的清洁层2， 清洁层2具有暴露晶片表面的部分12; 特别是具有上述结构的半导体装置用清洁部件，其中，露出晶片表面的清洁层2中的部分12是在具有给定宽度范围的整个圆形区域中已经清除了清洁层的部分 从晶片的周缘朝向其中心。