公开(公告)号：US20230418101A1

公开(公告)日：2023-12-28

申请号：US18243136

申请日：2023-09-07

Applicant: Manufacturing Resources International, Inc.

Inventor： William Dunn ,  Marcos Diaz ,  Tim Hubbard ,  Matt Dosch

IPC: G02F1/1333 ,  H05K7/20

CPC classification number: G02F1/133385 ,  H05K7/202 ,  G02F1/133308

Abstract: A method of increasing thermal conduction in an electronic display assembly includes securing a panel forming part of a thermal management substructure for the electronic display assembly, depositing a structural adhesive to at least one of an electronic component for operating the electronic display assembly and the panel, securing said electronic component directly to a first side of the panel by way of the adhesive, and securing the thermal management substructure within a housing of the electronic display assembly such that a second side of said panel defines, at least in part, at least a portion of an airflow pathway of the electronic display assembly of which the thermal management substructure forms a part.

公开(公告)号：US11013142B2

公开(公告)日：2021-05-18

申请号：US16933932

申请日：2020-07-20

Applicant: Manufacturing Resources International, Inc.

Inventor： William Dunn ,  Tim Hubbard

IPC: H05K7/20 ,  G02F1/1333 ,  F28D9/00 ,  F28F3/02

Abstract: Systems and methods for cooling an electronic image assembly are provided. A transparent panel forms a front portion of a housing for the electronic image assembly. The transparent panel is located forward of, and at least some distance from the electronic image assembly. An airflow pathway passes through the housing between said electronic image assembly and said transparent panel. An air circulation device forces air through the airflow pathway. At least one polarizer located at the transparent panel is configured to reduce solar energy entering said airflow pathway.

公开(公告)号：US10524384B2

公开(公告)日：2019-12-31

申请号：US14201221

申请日：2014-03-07

Applicant: Manufacturing Resources International, Inc.

Inventor： William Dunn ,  Tim Hubbard ,  Ryan DeMars

IPC: H05K7/20 ,  G02F1/1335 ,  G02F1/1333

Abstract: The exemplary embodiments herein provide a system for cooling an electronic display where a plate is positioned behind the electronic display, the space between the plate and the electronic display defining a first channel. A first fan is preferably positioned to force a first flow of external air through the first channel. A heat exchanger is preferably positioned adjacent to the plate where the space between the heat exchanger and the plate defines a second channel; and a second fan is preferably positioned to force a second flow of external air through the second channel and through the heat exchanger. A continuous heat sink may be placed within the first channel. Pass through gaskets may be used to ensure the external air may cross paths with the circulating gas without permitted the external air and circulating gas to mix.

公开(公告)号：US20190289754A1

公开(公告)日：2019-09-19

申请号：US16430195

申请日：2019-06-03

Applicant: Manufacturing Resources International, Inc.

Inventor： Tim Hubbard

IPC: H05K7/20 ,  G02F1/1333

Abstract: An apparatus for cooling an electronic image assembly with ambient gas and circulating gas is disclosed. A first fan may be positioned to force the circulating gas around the electronic image assembly in a closed loop while a second fan may be positioned to cause a flow of ambient gas. A structure is preferably positioned to allow the circulating gas to cross the flow of the ambient gas while substantially prohibiting the circulating gas from mixing with the ambient gas. A pair of manifolds may be placed along the sides of the electronic image assembly and may be in gaseous communication with a plurality of channels placed behind the electronic image assembly. A heat exchanger may be used in some exemplary embodiments.

公开(公告)号：US20170245400A1

公开(公告)日：2017-08-24

申请号：US15589932

申请日：2017-05-08

Applicant: Manufacturing Resources International, Inc.

Inventor： William Dunn ,  Tim Hubbard ,  Kevin O'Connor

IPC: H05K7/20

CPC classification number: H05K7/20909 ,  G11B33/06 ,  H05K7/20 ,  H05K7/20145 ,  H05K7/202 ,  H05K7/209 ,  H05K7/20972

Abstract: The exemplary embodiments disclosed herein are directed to a heat exchanger assembly for cooling power module bricks, the heat exchanger assembly having a plurality of spaced apart heat exchanger layers between which external air and a closed loop gas are separately circulated. A series of metallic plates may be located within the spaces between some or all of the heat exchanger layers to conduct heat from the power modules. Circulating fans may be employed to circulate external air and circulating gas through the heat exchanger. Pass through junctions may be positioned near edges of the heat exchanger to permit the circulating gas to cross paths with the external air without allowing the two gas flows to mix with one another.

公开(公告)号：US08988647B2

公开(公告)日：2015-03-24

申请号：US14300869

申请日：2014-06-10

Applicant: Manufacturing Resources International, Inc.

Inventor： Tim Hubbard

IPC: G02F1/1333 ,  G02F1/1335 ,  H05K5/00 ,  B29C47/88 ,  H05K7/20

CPC classification number: H05K7/20954 ,  G02F1/133308 ,  G02F2001/13332 ,  G02F2001/133628 ,  G02F2201/36 ,  H05K7/20127 ,  H05K7/20145 ,  H05K7/20172

Abstract: A method for cooling an electronic image assembly using ambient gas. Exemplary embodiments of the method include the steps of circulating a closed loop of circulating gas around the electronic image assembly, directing a flow of ambient air through a first manifold, allowing the flow of ambient air to cross the flow of circulating gas without allowing the two to mix, directing the flow of ambient air behind the electronic image assembly and directing the flow of ambient air through a second manifold. The circulating gas may be used to cool a front portion of the electronic image assembly. A cross through plate may be used to allow the ambient gas and circulating gas to cross paths without mixing. A heat exchanger may be included with some embodiments of the method.

Abstract translation: 一种使用环境气体冷却电子图像组件的方法。 该方法的示例性实施例包括以下步骤：在电子图像组件周围循环循环气体循环，引导周围空气流通过第一歧管，允许环境空气流通过循环气体流而不允许两个 将环境空气的流动引导到电子图像组件后面并引导环境空气流通过第二歧管。 循环气体可用于冷却电子图像组件的前部。 可以使用十字交叉板来使环境气体和循环气体交叉路径而不混合。 该方法的一些实施例可以包括热交换器。

公开(公告)号：US20140321103A1

公开(公告)日：2014-10-30

申请号：US14326053

申请日：2014-07-08

Applicant: MANUFACTURING RESOURCES INTERNATIONAL, INC.

Inventor： William Dunn ,  Ware Bedell ,  Tim Hubbard

IPC: F21V29/00 ,  F21V29/02 ,  G02F1/1335

CPC classification number: F21V29/503 ,  F21V29/502 ,  F21V29/673 ,  F21V29/74 ,  F21V29/83 ,  G02F1/133308 ,  G02F1/133603 ,  G02F2001/13332 ,  G02F2001/133628 ,  G02F2201/36

Abstract: A system for cooling various components of an electronic display. One or more heat-generating components are preferably placed in thermal communication with a plate and ribs. One or more fans are placed to draw cooling air along the ribs to remove the heat removed from the component. Some embodiments may place the electronic image assembly in thermal communication with the ribs to remove heat from the electronic image assembly. Exemplary embodiments have power modules and the electronic image assembly in thermal communication with the ribs. Conductive thermal communication is established between the ribs and the components in the exemplary embodiments.

Abstract translation: 一种用于冷却电子显示器的各种部件的系统。 优选地，一个或多个发热部件与板和肋热连通。 放置一个或多个风扇以沿着肋条抽取冷却空气以除去从部件移除的热量。 一些实施例可以将电子图像组件与肋部热连通以从电子图像组件移除热量。 示例性实施例具有与肋热连通的电源模块和电子图像组件。 在示例性实施例中的肋和部件之间建立导热性通信。

公开(公告)号：US20140295748A1

公开(公告)日：2014-10-02

申请号：US14300869

申请日：2014-06-10

Applicant: Manufacturing Resources International, Inc.

Inventor： Tim Hubbard

IPC: H05K7/20

CPC classification number: H05K7/20954 ,  G02F1/133308 ,  G02F2001/13332 ,  G02F2001/133628 ,  G02F2201/36 ,  H05K7/20127 ,  H05K7/20145 ,  H05K7/20172

Abstract: A method for cooling an electronic image assembly using ambient gas. Exemplary embodiments of the method include the steps of circulating a closed loop of circulating gas around the electronic image assembly, directing a flow of ambient air through a first manifold, allowing the flow of ambient air to cross the flow of circulating gas without allowing the two to mix, directing the flow of ambient air behind the electronic image assembly and directing the flow of ambient air through a second manifold. The circulating gas may be used to cool a front portion of the electronic image assembly. A cross through plate may be used to allow the ambient gas and circulating gas to cross paths without mixing. A heat exchanger may be included with some embodiments of the method.

Abstract translation: 一种使用环境气体冷却电子图像组件的方法。 该方法的示例性实施例包括以下步骤：在电子图像组件周围循环循环气体循环，引导周围空气流通过第一歧管，允许环境空气流通过循环气体流而不允许两个 将环境空气的流动引导到电子图像组件后面并引导环境空气流通过第二歧管。 循环气体可用于冷却电子图像组件的前部。 可以使用十字交叉板来使环境气体和循环气体交叉路径而不混合。 该方法的一些实施例可以包括热交换器。

公开(公告)号：US08649170B2

公开(公告)日：2014-02-11

申请号：US13759744

申请日：2013-02-05

Applicant: Manufacturing Resources International, Inc.

Inventor： William Dunn ,  Tim Hubbard ,  Ware Bedell

IPC: G06F1/16 ,  H05K5/00

CPC classification number: G02F1/13 ,  F28F3/12 ,  G02F1/133385 ,  G02F1/133603 ,  G02F2001/133628 ,  G02F2201/36 ,  G05D23/1934 ,  H05K7/20972

Abstract: A system and method for cooling an electronic image assembly having a plurality of cooling gas pathways place behind the electronic image assembly. A first fan may be used to force cooling gas through a first grouping of cooling gas pathways while a second fan may be used to force cooling gas through a second grouping of cooling gas pathways. Temperature sensing devices may be positioned so as to measure the temperature of the first and second groupings of cooling gas pathways. The speeds of the first and second fans may be adjusted based on the temperature measurements of the cooling gas pathway groupings. Additional fans with additional temperature sensing devices may be used for further accuracy and control over the temperature gradients of the electronic image assembly. Manifolds may be used to distribute/collect cooling gas to/from the cooling gas pathways.

Abstract translation: 用于冷却具有多个冷却气体通道的电子图像组件的系统和方法放置在电子图像组件的后面。 可以使用第一风扇来迫使冷却气体通过第一组冷却气体通道，而第二风扇可用于迫使冷却气体通过第二组冷却气体通道。 温度感测装置可以被定位成测量第一和第二组冷却气体通路的温度。 可以基于冷却气体通路组的温度测量来调节第一和第二风扇的速度。 可以使用具有附加温度感测装置的附加风扇来进一步精确地控制电子图像组件的温度梯度。 歧管可用于向/从冷却气体通道分配/收集冷却气体。

公开(公告)号：US20240292561A1

公开(公告)日：2024-08-29

申请号：US18657006

申请日：2024-05-07

Applicant: Manufacturing Resources International, Inc.

Inventor： William Dunn ,  Tim Hubbard

IPC: H05K7/20 ,  F28D9/00 ,  F28F3/02 ,  G02F1/1333

CPC classification number: H05K7/202 ,  G02F1/133385 ,  H05K7/20136 ,  H05K7/20163 ,  H05K7/20972 ,  F28D9/00 ,  F28F3/02

Abstract: Display assemblies with thermal management features are provided. The display assemblies include an image assembly, a housing for the image assembly having an intake and exhaust. A first, continuous airflow pathway is located within the housing, and includes a first portion located forward of the image assembly and a second portion located rearward of the image assembly. A second airflow pathway extends within the housing between the intake and the exhaust. A heat exchanger located within the housing and rearward of the image assembly includes a first set of ducted passageways forming part of the first airflow pathway and a second set of ducted passageways forming part of the second airflow pathway. The first set of ducted passageways extend alongside, in an alternating fashion with, the second set of ducted passageways.