公开(公告)号：US06580143B2

公开(公告)日：2003-06-17

申请号：US09973530

申请日：2001-10-09

申请人： Koji Yoshida ,  Makoto Tose

发明人： Koji Yoshida ,  Makoto Tose

IPC分类号： H01L2900

CPC分类号： H05K3/381 ,  H01L21/4846 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/00

摘要： A surface modification layer having a surface modification coefficient of 0.1 to 0.5 is formed on the surface of an organic insulating film on a substrate. A metal wiring is provided on the surface of the organic insulating film having the surface modification layer formed at the surface thereof. Thus, the bonding strength between the metal wiring and the organic insulating film is enhanced. The surface modification coefficient is defined by the formula: SMC = the ⁢   ⁢ total ⁢   ⁢ number ⁢   ⁢ of ⁢   ⁢ functional ⁢   ⁢ groups the ⁢   ⁢ total ⁢   ⁢ number ⁢   ⁢ of ⁢   ⁢ C ⁢   ⁢ atoms ⁢   ⁢ present ⁢   ⁢ at ⁢   ⁢ the ⁢   surface ⁢   ⁢ of ⁢   ⁢ the ⁢   ⁢ organic ⁢   ⁢ insulating ⁢   ⁢ film . ( 1 )

摘要翻译： 在基板上的有机绝缘膜的表面上形成表面改性系数为0.1〜0.5的表面改性层。 在其表面上形成有表面改性层的有机绝缘膜的表面上设置有金属布线。 因此，提高了金属布线和有机绝缘膜之间的接合强度。 表面改性系数由下式定义：

公开(公告)号：US06504248B2

公开(公告)日：2003-01-07

申请号：US10059629

申请日：2002-01-29

申请人： Koji Yoshida ,  Makoto Tose

发明人： Koji Yoshida ,  Makoto Tose

IPC分类号： H01L2348

CPC分类号： H01L21/486 ,  H01L2924/0002 ,  H05K3/467 ,  H01L2924/00

摘要： A thin film circuit substrate is manufactured by forming a lower thin film electrode on a substrate, forming an organic insulating film with via holes on the lower thin film electrode, and irradiating the substrate with an inert gas ion to remove an oxidized surface film on the lower thin film electrode, and to generate functional groups, such that a modified surface layer with a surface modification coefficient of about 0.1 to about 0.5 is formed on the surface of the organic insulating film, and such that the oxidized surface film on the lower thin film electrode is removed at the same time. Accordingly, a thin film circuit substrate having excellent adhesion strength between the organic insulating film and the upper thin film electrode as well as excellent reliability of electroconductivity between the upper and the lower thin film electrodes is efficiently manufactured.

公开(公告)号：US06403694B1

公开(公告)日：2002-06-11

申请号：US09496159

申请日：2000-02-01

申请人： Makoto Tose ,  Hiromichi Kawakami ,  Shizuharu Watanabe

发明人： Makoto Tose ,  Hiromichi Kawakami ,  Shizuharu Watanabe

IPC分类号： C08K334

CPC分类号： C03C8/14 ,  C03C8/16 ,  G03F7/0047 ,  H05K1/0306 ,  H05K3/0023 ,  H05K3/4667 ,  Y10T428/24926 ,  Y10T428/252 ,  Y10T428/259

摘要： A photosensitive insulating paste contains a borosilicate glass powder and a crystalline SiO2 powder, wherein the powders are dispersed in a photosensitive organic vehicle and the paste contains the crystalline SiO2 component in an amount of about 3-40 wt. % after sintering. A thick-film multi-layer circuit substrate (e.g., chip inductor) comprising an insulating substrate on which insulating layers are formed, wherein the insulating layers are formed through exposure, development and sintering, after the application of the photosensitive insulating paste.

摘要翻译： 感光绝缘膏含有硼硅酸盐玻璃粉末和结晶SiO 2粉末，其中粉末分散在光敏有机载体中，糊状物含有约3-40重量％的结晶SiO 2组分。 ％烧结后。 包括绝缘基板的厚膜多层电路基板（例如，芯片电感器），其上形成有绝缘层，其中在施加感光绝缘膏之后，通过曝光，显影和烧结形成绝缘层。

公开(公告)号：US06270904B1

公开(公告)日：2001-08-07

申请号：US09677105

申请日：2000-09-29

申请人： Makoto Tose ,  Shizuharu Watanabe

发明人： Makoto Tose ,  Shizuharu Watanabe

IPC分类号： B32B1504

CPC分类号： H01B3/006 ,  C03C8/02 ,  C03C8/16 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/31696

摘要： The invention provides an insulating paste, comprising: an organic vehicle containing an organic binder, a photo-polymerization initiator and a photosetting monomer; and a silicate glass powder having a softening point in a range of about 700° C. to 1,050° C. and having an average particle size in a range of about 0.1 to 5.0 &mgr;m, said silicate glass powder being dispersed into said organic vehicle. Preferably, the silicate glass powder of the above insulating paste comprises a composition represented by xSiO2-yB2O3-zK2O where x+y+z is 100 parts by weight and the values z, y and z are on lines or within a region enclosed by lines passing through four points A(65, 35, 0), B(65, 20, 15), C(85, 0, 15) and D(85, 15, 0) on a ternary diagram thereof.

摘要翻译： 本发明提供了一种绝缘膏，其包括：含有有机粘合剂，光聚合引发剂和光固化性单体的有机载体; 和软化点在约700℃至1050℃的平均粒径在约0.1至5.0μm的范围内的硅酸盐玻璃粉末，所述硅酸盐玻璃粉末分散在所述有机载体中。 优选地，上述绝缘膏的硅酸盐玻璃粉末包含由xSiO 2 -yB 2 O 3 -zK 2 O表示的组合物，其中x + y + z为100重量份，并且z，y和z的值在线上或由线包围的区域内 在其三元图上通过四个点A（65,35,0），B（65,20,15），C（85,0,15）和D（85,15,0）。