摘要:
A solder paste comprising a solder alloy powder and a flux. The volumetric expansion at the time of melting of the solder alloy is at most 0.5%. The flux contains a bisphenol A epoxy resin and a curing agent selected from a carboxylic anhydride and a dicarboxylic acid. The solder paste can be used in applications suitable for high-temperature solders. The solder alloy has an alloy composition comprising, in mass percent, 70-98% of Bi, a total of 0-0.5% of at least one substance selected from Ag, Cu, Sb, In, Zn, Ni, Cr, Fe, Mo, P, Ge, and Ga, and a remainder of Sn.
摘要:
An external electrode structure for a monolithic ceramic capacitor provided with a function as a resistance element is capable of preventing a reduction of the external electrode due to baking in a reducing atmosphere, so that Ni or a Ni alloy can be used in an internal electrode and a good electrical connection between the internal electrode and the external electrode is achieved. The external electrodes disposed on an outer surface of a capacitor main body include an electrically conductive layer and a metal plating layer disposed thereon, and the electrically conductive layer includes a compound oxide, e.g., an In—Sn compound oxide, which reacts with Ni or the Ni alloy, and a glass component.
摘要:
The invention provides an insulating paste, comprising: an organic vehicle containing an organic binder, a photo-polymerization initiator and a photosetting monomer; and a silicate glass powder having a softening point in a range of about 700° C. to 1,050° C. and having an average particle size in a range of about 0.1 to 5.0 &mgr;m, said silicate glass powder being dispersed into said organic vehicle. Preferably, the silicate glass powder of the above insulating paste comprises a composition represented by xSiO2—yB203—zK2O where x+y+z is 100 parts by weight and the values z, y and z are on lines or within a region enclosed by lines passing through four points A(65, 35, 0), B(65, 20, 15), C(85, 0, 15) and D(85, 15, 0) on a ternary diagram thereof.
摘要翻译:本发明提供了一种绝缘膏,其包括:含有有机粘合剂,光聚合引发剂和光固化性单体的有机载体; 和软化点在约700℃至1050℃的平均粒径在约0.1至5.0μm的范围内的硅酸盐玻璃粉末,所述硅酸盐玻璃粉末分散在所述有机载体中。 优选地,上述绝缘膏的硅酸盐玻璃粉末包含由xSiO 2 -yB 2 O 3 -zK 2 O表示的组合物,其中x + y + z为100重量份,并且z,y和z的值在线上或由线包围的区域内 在其三元图上通过四个点A(65,35,0),B(65,20,15),C(85,0,15)和D(85,15,0)。
摘要:
The formation of a resistive electrode layer as a portion of an external electrode of a monolithic ceramic capacitor by baking a resistive paste, which contains ITO, a glass frit, and an organic vehicle, to impart the function of a resistance element to the external electrode may lead to the occurrence of blisters or reduced denseness. This is modulated when the resistive paste further contains a densification promoting metal or oxide, which promotes densification of a sintered compact of the resistive paste, and a densification preventing metal oxide, which prevents the densification.
摘要:
Methods and apparatuses for efficiently forming a homogeneous glass layer having uniform thickness and a homogeneous metal layer having uniform thickness are provided. A workpiece is accommodated in a screened container which is rotatable in a predetermined direction. The workpiece in the container is sprayed with an atomized glass slurry or an atomized metal slurry while the container is rotated in order to form a green glass layer or a green metal layer on the workpiece. Simultaneously, hot air is supplied to the workpiece so as to dry the green glass layer or the green metal layer. Thus, the workpiece, typically a ferrite core, can be provided with a homogeneous layer having a uniform thickness. A method for manufacturing an electronic component using the above-described methods and apparatuses is also provided.
摘要:
A crystallized glass composition contains a principal ingredient comprising SiO2, MgO and Al2O3 and contains about 2 to 20 parts by weight of B2O3 relative to 100 parts by weight of the principal ingredient. In a ternary diagram, the weight ratio (SiO2, MgO, Al2O3) lies within a region surrounded by point A (44.0, 55.0, 1.0), point B (34.5, 64.5, 1.0), point C (35.0, 30.0, 35.0) and point D (44.5, 30.0, 25.5).
摘要翻译:结晶玻璃组合物含有主要成分包含SiO 2,MgO和Al 2 O 3,并且相对于100重量份的主要成分含有约2至20重量份的B 2 O 3。 在三元图中,重量比(SiO 2,MgO,Al 2 O 3)位于由点A(44.0,55.0,1.0),点B(34.5,64.5,1.0),点C(35.0,30.0,35.0)包围的区域内, 和D点(44.5,30.0,25.5)。
摘要:
A photosensitive insulating paste including an insulating material containing a borosilicate glass powder. The insulating material is dispersed in a photosensitive organic vehicle, and the borosilicate glass powder contains SiO2, B2O3 and K2O such that the compositional proportions by weight of the three components represented by (SiO2, B2O3, K2O) fall within a region formed by connecting points A (65, 35, 0), B (65, 25, 10), C (85, 5, 10) and D (85, 15, 0) in a ternary diagram thereof. A thick-film multi-layer circuit substrate including the paste is also disclosed.
摘要翻译:一种感光绝缘膏,其包含含有硼硅酸盐玻璃粉末的绝缘材料。 绝缘材料分散在感光性有机载体中,硼硅酸盐玻璃粉末含有SiO 2,B 2 O 3和K 2 O,使得由(SiO 2,B 2 O 3,K 2 O)表示的三种成分的组成比例落在由连接点形成的区域内 A(65,35,0),B(65,25,10),C(85,5,10)和D(85,15,0)。 还公开了包括该糊状物的厚膜多层电路基板。
摘要:
Resistive paste comprises at least one metal hexaboride and a vitreous binder suspended in an organic vehicle, and is characterized in that said vitreous binder is composed of a glass frit consisting essentially of 0.5 to 5.0 mol % of niobium oxide and the balance of alkaline earth metal borosilicate. The resistive paste may further contain at least one nitride selected from the group consisting of aluminum nitride and boron nitride, the content of aluminum nitride or boron nitride in the inorganic solid component composed of metal hexaboride, vitreous binder and aluminum or boron nitride in the paste being 5 to 30 wt %.
摘要:
The formation of a resistive electrode layer as a portion of an external electrode of a monolithic ceramic capacitor by baking a resistive paste, which contains ITO, a glass frit, and an organic vehicle, to impart the function of a resistance element to the external electrode may lead to the occurrence of blisters or reduced denseness. This is modulated when the resistive paste further contains a densification promoting metal or oxide, which promotes densification of a sintered compact of the resistive paste, and a densification preventing metal oxide, which prevents the densification.
摘要:
A method for forming a conductive pattern includes: applying a photosensitive conductive paste to a support 1 to thereby form a film 2, which paste contains an organic binder having an acidic functional group, a photosensitive organic component, a multivalent metallic powder, and a mono-ol compound having a boiling point of about 178° C. or more, an anion-adsorbing material and/or a thixotropic agent; exposing and developing the film 2 to thereby form conductive patterns 3a and 3b; and transferring the conductive patterns 3a and 3b, which are formed on the support 1, onto a ceramic green sheet 6. The invention also discloses a method for producing a ceramic multi-layer substrate.