公开(公告)号：US06992862B2

公开(公告)日：2006-01-31

申请号：US10650557

申请日：2003-08-28

申请人： William W. Childers ,  Drew B. Lawson ,  Tzong-Shii Pan ,  Surya Pattanaik

发明人： William W. Childers ,  Drew B. Lawson ,  Tzong-Shii Pan ,  Surya Pattanaik

IPC分类号： G11B5/60

CPC分类号： G11B5/4853 ,  G11B5/4826 ,  G11B5/486

摘要： The pitch static attitude of a slider in an integrated lead suspension head gimbal assembly of a disk drive is controlled at the manufacturing stage. The integrated lead suspension includes a load beam, a mount plate, a hinge and a flexure made out of a multi-layer material. The flexure legs and the outrigger leads are simultaneously plastically deformed to define the pitch static attitude. The flexure legs and the outrigger leads are deformed at approximately the same longitudinal location.

摘要翻译： 在制造阶段，控制磁盘驱动器的集成式引线悬架头万向节组件中的滑块的节距静态。 集成引线悬架包括负载梁，安装板，铰链和由多层材料制成的挠曲件。 弯曲腿和外伸支架引线同时塑性变形以限定俯仰静止姿态。 弯曲腿和外伸支架引线在大致相同的纵向位置处变形。

公开(公告)号：US06785094B2

公开(公告)日：2004-08-31

申请号：US10131553

申请日：2002-04-24

申请人： Satya Prakash Arya ,  Tzong-Shii Pan ,  Surya Pattanaik ,  Victor Wing Chun Shum

发明人： Satya Prakash Arya ,  Tzong-Shii Pan ,  Surya Pattanaik ,  Victor Wing Chun Shum

IPC分类号： G11B548

CPC分类号： G11B5/484

摘要： A suspension assembly is designed to carry a slider and read/write head elements in a magnetic data storage device. The suspension assembly is formed from a composite laminate structure that includes first, second, third, fourth and fifth material layers. The layers are arranged such that the second layer is disposed between the first and third layers, and the fourth layer is disposed between the third and fifth layers. The laminate structure is configured using a suitable removal process, such as partial chemical etching, to define a mount plate, a hinge, a load beam functional end, and an electrical lead system. The laminate structure may be further formed with a flexure gimbal system that comprises the third, fourth and fifth layers.

摘要翻译： 悬挂组件被设计成在磁数据存储装置中携带滑块和读/写头元件。 悬挂组件由包括第一，第二，第三，第四和第五材料层的复合层压结构形成。 这些层被布置成使得第二层设置在第一和第三层之间，并且第四层设置在第三层和第五层之间。 使用合适的去除工艺（例如部分化学蚀刻）来构造层压结构以限定安装板，铰链，负载梁功能端和电引线系统。 层压结构可以进一步形成有包括第三层，第四层和第五层的弯曲万向节系统。

公开(公告)号：US06336581B1

公开(公告)日：2002-01-08

申请号：US09629481

申请日：2000-06-19

申请人： Tatsumi Tuchiya ,  Tatsushi Yoshida ,  Yasuhiro Mita ,  Tadaaki Tomiyama ,  Takao Kidachi ,  Surya Pattanaik

发明人： Tatsumi Tuchiya ,  Tatsushi Yoshida ,  Yasuhiro Mita ,  Tadaaki Tomiyama ,  Takao Kidachi ,  Surya Pattanaik

IPC分类号： B23K100

CPC分类号： B23K3/0623 ,  B23K3/0615 ,  H01L2224/11334 ,  H01L2224/742 ,  H05K3/3478

摘要： A capillary tube for a solder ball connection device connects a first connection surface of a pad to a second connection surface of a pad with a solder ball. The first connection surface is formed at a slider held by a slider holder in a disk unit. The second connection surface is formed at an end of a lead wired to the slider holder. The capillary tube has a ball regulator with a substantially conic, hollow portion. The solder ball regulator has an opening at its top that opens to the tip of the hollow portion. The center axes of the hollow portion and the opening are common. The solder ball regulator also has a pair of projections along the center axis around the opening, where the projections face each other with the center axis therebetween. The projections regulate the movement of the solder ball. The tip of the hollow portion is tapered when viewed from a line connecting the pair of projections and the extreme tips of the tapered tip portions.

摘要翻译： 用于焊球连接装置的毛细管用焊球将焊盘的第一连接表面连接到焊盘的第二连接表面。 第一连接表面形成在由盘单元中的滑块保持器保持的滑块上。 第二连接表面形成在连接到滑块保持器的引线的端部。 毛细管具有大致圆锥形的中空部分的球调节器。 焊球调节器在其顶部具有通向中空部分的尖端的开口。 中空部分和开口的中心轴是常见的。 焊球调节器还具有围绕开口的中心轴线的一对突起，其中突起彼此面对，其间具有中心轴线。 突起调节焊球的运动。 当从连接一对突起和锥形尖端部分的末端的线观察时，中空部分的尖端是锥形的。

公开(公告)号：US06282064B1

公开(公告)日：2001-08-28

申请号：US08643935

申请日：1996-05-07

申请人： Darrell D. Palmer ,  A. David Erpelding ,  Oscar J. Ruiz ,  Surya Pattanaik

发明人： Darrell D. Palmer ,  A. David Erpelding ,  Oscar J. Ruiz ,  Surya Pattanaik

IPC分类号： G11B548

CPC分类号： G11B5/486 ,  G11B5/4833 ,  H05K1/0271 ,  H05K1/056 ,  H05K1/09 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/09781 ,  H05K2201/2045

摘要： A single piece head gimbal assembly comprised of a load beam, a pair of flexure arms, a slider support member and a plurality of electrical lines. The head gimbal assembly is formed from a laminated material comprised of a support layer, a dielectric layer and a high strength electrically conductive layer. The electrical lines are formed in the high strength electrically conductive layer and extend along the backside of the load beam. The backside surface of a slider is accessible through an aperture formed between the flexure arms and the electrical lines are terminated to the backside of the slider. Alternatively, the electrical lines extend along the backside or frontside of the load beam and are terminated to the trailing edge of the slider.

摘要翻译： 包括负载梁，一对弯曲臂，滑块支撑构件和多个电线的单件头万向架组件。 头万向架组件由包括支撑层，电介质层和高强度导电层的叠层材料形成。 电线形成在高强度导电层中并且沿负载梁的背面延伸。 滑块的背面通过形成在弯曲臂之间的孔可接近，并且电线终止于滑块的背面。 或者，电线沿着负载梁的背侧或前侧延伸并且终止于滑块的后缘。

公开(公告)号：US5889636A

公开(公告)日：1999-03-30

申请号：US873777

申请日：1997-06-12

申请人： Satya Prakash Arya ,  A David Erpelding ,  Darrell Dean Palmer ,  Tzong-Shii Pan ,  Surya Pattanaik ,  Victor Wing Chun Shum ,  Yoshio Uematsu

发明人： Satya Prakash Arya ,  A David Erpelding ,  Darrell Dean Palmer ,  Tzong-Shii Pan ,  Surya Pattanaik ,  Victor Wing Chun Shum ,  Yoshio Uematsu

IPC分类号： G11B5/48

CPC分类号： G11B5/4833

摘要： Disclosed are an electrical connection assembly for a data storage device and a method of fabricating the electrical connection between a transducer termination pad formed on a slider and a suspension having a conductive lead structure. A compliant cantilevered conductive pad is formed at the end of the conductive lead structure. A solder bump is formed on the transducer termination pad, and may be formed subsequent to dicing the sliders. The slider is placed in mechanical contact with the suspension for mechanical support such that the solder bump contacts the cantilevered conductive pad, which cantilevered conductive pad complies with the solder bump to absorb positional errors. Then, the solder bump is heated, preferably by a laser, so as to reflow the solder bump to make an approximately right angle solder fillet joint electrical connection with the cantilevered conductive pad.

摘要翻译： 公开了一种用于数据存储装置的电连接组件和制造形成在滑块上的换能器终端焊盘和具有导电引线结构的悬架之间的电连接的方法。 在导电引线结构的端部处形成柔性悬臂导电焊盘。 在传感器端接垫上形成焊料凸块，并且可以在切割滑块之后形成焊料凸块。 滑块与用于机械支撑的悬架机械接触，使得焊料凸块接触悬臂导电焊盘，该悬臂导电焊盘符合焊料凸块以吸收位置误差。 然后，优选地通过激光加热焊料凸块，以便回流焊料凸块以与悬臂导电焊盘形成大致直角的焊接接头电连接。

公开(公告)号：US5815347A

公开(公告)日：1998-09-29

申请号：US246051

申请日：1994-05-19

申请人： Surya Pattanaik

发明人： Surya Pattanaik

IPC分类号： G11B5/31 ,  G11B5/48 ,  G11B5/60 ,  G11B21/21

CPC分类号： G11B5/6005 ,  G11B21/21 ,  G11B5/4853 ,  G11B5/486 ,  G11B5/3103 ,  G11B5/3183

摘要： A planar head-suspension assembly for an information storage system is provided. The assembly comprises a planar head being of the type having an air bearing surface and a back side opposite the air bearing surface. The head has a read and/or write transducer formed therein and electrical leads terminating on the back side at termination pads. The assembly also includes a multilayered suspension having an etched conductive lead structure formed in a conductive patterned layer and having one or more openings passing through the suspension. Portions of the conductive lead structure project into the openings, and the back side of the head is placed to the suspension such that the termination pads are properly aligned with the openings. Last, a solder region is formed within each of the openings making electrical contact between the conductive lead structure and the termination pads.

摘要翻译： 提供了一种用于信息存储系统的平面头悬挂组件。 组件包括具有空气轴承表面和与空气轴承表面相对的后侧的类型的平面头部。 头部具有形成在其中的读取和/或写入传感器，并且在终端焊盘的背面端接电引线。 组件还包括多层悬架，其具有形成在导电图案层中并且具有穿过悬架的一个或多个开口的蚀刻导电引线结构。 导电引线结构的一部分突出到开口中，并且头部的后侧被放置到悬架上，使得终端焊盘与开口正确对准。 最后，在每个开口内形成焊接区域，使得导电引线结构和端接焊盘之间电接触。

公开(公告)号：US5781379A

公开(公告)日：1998-07-14

申请号：US816976

申请日：1997-03-13

申请人： A. David Erpelding ,  Oscar J. Ruiz ,  Darrell D. Palmer ,  Surya Pattanaik

发明人： A. David Erpelding ,  Oscar J. Ruiz ,  Darrell D. Palmer ,  Surya Pattanaik

IPC分类号： G11B5/48 ,  H05K1/05 ,  H05K1/09

CPC分类号： G11B5/486 ,  H05K1/09 ,  H05K1/056 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/09781 ,  H05K2201/2045

摘要： A flexure for use in a head gimbal assembly comprising a single narrow torsion beam that connects a suspension load beam to a slider support member. The flexure is centered underneath a read/write slider and may be comprised of a laminated material having a conductor layer, a dielectric layer and a support layer. A plurality of electrical leads may be formed in the conductor layer for attachment the slider. The slider is mechanically attached to the slider support member by a first set of solder balls the height of which create a space for accommodating deflections of the flexure and allowing the electrical leads to pass underneath the slider. Electrical connections to the slider are made using a plurality of right angle fillet joints between the slider and a second set of solder balls on the slider support member. The shape of the torsion beam may be varied to yield different levels of stiffness to pitch, roll and yaw movement of the flexure.

摘要翻译： 用于头万向架组件中的挠曲件，其包括将悬挂负载梁连接到滑动器支撑构件的单个窄扭力梁。 挠曲件位于读/写滑块下方，并且可以由具有导体层，电介质层和支撑层的层压材料构成。 可以在导体层中形成多个电引线用于附接滑块。 滑块通过第一组焊球机械地附接到滑块支撑构件，其第一组焊球的高度产生用于容纳弯曲部的挠曲并允许电引线通过滑块下方的空间。 与滑动件的电连接使用滑块和滑块支撑构件上的第二组焊球之间的多个直角圆角接头来制成。 扭转梁的形状可以变化以产生不同程度的刚度，以使挠曲件的俯仰，滚动和偏转运动。

公开(公告)号：US5530604A

公开(公告)日：1996-06-25

申请号：US246052

申请日：1994-05-19

申请人： Surya Pattanaik

发明人： Surya Pattanaik

IPC分类号： G11B5/60 ,  G11B5/48 ,  G11B21/10 ,  G11B21/21

CPC分类号： G11B5/4853 ,  G11B21/106

摘要： A method for the fabrication of a data recording disk file slider-suspension assembly, the slider being of the type having an air bearing surface, a back side opposite the air bearing surface and a trailing edge having a read or write transducer formed as a thin film thereon with electrical leads formed solely on the trailing edge and terminating adjacent the slider back side at termination pads, and a suspension having etched conductive lead structures and conductive contact pads connected to the lead structures. The method comprising the steps of forming a solder bump on each of the termination pads and each of the contact pads, wherein one or more solder bumps are selectively flattened, mechanically attaching the back side of the slider to the suspension such that the termination pads are properly aligned with the contact pads, and heating the solder bumps so as to reflow the termination pad and contact pad bumps such that they electrically connect, wherein a selectively flattened bump extends along an axis defined by a point on one pad and a point on another pad when heated to make contact with another bump.

摘要翻译： 一种用于制造数据记录盘文件滑块 - 悬挂组件的方法，该滑块具有空气轴承表面的类型，与空气轴承表面相对的后侧，以及具有形成为薄的读/写换能器的后缘 在其上具有仅在后缘形成并且在终止焊盘处邻近滑块后侧终止的电引线的电缆，以及具有蚀刻的导电引线结构和连接到引线结构的导电接触焊盘的悬架。 该方法包括以下步骤：在每个端接焊盘和每个接触焊盘上形成焊料凸块，其中一个或多个焊料凸块被选择性地平坦化，将滑块的背面机械地连接到悬架上，使得端接焊盘 与接触焊盘正确对准，并加热焊料凸块，以便回流端接焊盘和接触焊盘凸块，使其电连接，其中选择性平坦的凸起沿着由一个焊盘上的点和另一个点上的点限定的轴线延伸 加热时与另一个凸起接触。

公开(公告)号：US4761699A

公开(公告)日：1988-08-02

申请号：US923932

申请日：1986-10-28

申请人： Norman G. Ainslie ,  Dwight W. Brede ,  A. David Erpelding ,  Surya Pattanaik

发明人： Norman G. Ainslie ,  Dwight W. Brede ,  A. David Erpelding ,  Surya Pattanaik

IPC分类号： G11B5/60 ,  G11B5/11 ,  G11B5/31 ,  G11B5/40 ,  G11B5/48 ,  G11B21/16 ,  H01R4/02

CPC分类号： G11B5/4853 ,  G11B21/16 ,  G11B5/3106 ,  G11B5/11 ,  G11B5/112 ,  G11B5/40 ,  Y10T29/49021

摘要： In a data disk file a slider is mechanically attached to the suspension by means of reflowed solder balls. A pattern of solder contact pads is formed on the back side of the slider and a similar pattern of solder-wettable regions is formed on the suspension. Solder balls are formed on either the solder contact pads or the solder-wettable regions, the slider is located on the suspension so that the solder balls are in registration between the solder contact pads and solder-wettable regions, and the solder is heated to reflow, thereby forming solder joints as a mechanical connection between the slider and suspension. When a thin film transducer is formed on the slider trailing edge and the suspension is a laminated type with patterned conductors, solder balls are also formed on the transducer lead terminations on the trailing edge and on a row of solder-wettable regions on the suspension near the location where the trailing edge of the slider is to be located. In this embodiment, when the slider with thin film transducer, with solder balls on the lead terminations, is located over the suspension then all of the solder balls are heated. The solder balls for providing mechanical connection collapse during reflow, thereby causing the solder balls on the transducer lead terminations to come in contact with and flow together with the solder balls formed on the row of solder-wettable regions on the suspension. Thus the mechanical attachment of the slider is made simultaneously with the electrical connection of the transducer lead to the disk file read/write electronics.

摘要翻译： 在数据盘文件中，滑块通过回流焊球机械地附接到悬架上。 在滑块的背面上形成焊接接触焊盘的图案，并且在悬浮液上形成类似的焊料可润湿区域。 焊球形成在焊接接触焊盘或焊料可润湿区域上，滑块位于悬架上，使得焊球在焊料接触焊盘和可焊接润湿区域之间对准，并且焊料被加热以回流 从而形成作为滑块和悬架之间的机械连接的焊点。 当在滑块后缘上形成薄膜换能器，并且悬架是具有图案化导体的层叠型时，焊球也形成在传感器引线端子上，后端和一排可靠接触的可焊接区域上 滑块后缘位于哪个位置。 在本实施例中，当具有薄膜换能器的滑块（在引线端子上具有焊球）位于悬架上方时，所有焊球都被加热。 用于在回流期间提供机械连接塌陷的焊球，从而导致换能器引线端子上的焊球与形成在悬架上的可焊锡润湿区域上的焊球接触并与其一起流动。 因此，滑块的机械连接与传感器引线与磁盘文件读/写电子装置的电连接同时进行。

公开(公告)号：US4357299A

公开(公告)日：1982-11-02

申请号：US250526

申请日：1981-04-02

申请人： Surya Pattanaik

发明人： Surya Pattanaik

IPC分类号： B23K35/30 ,  C22C9/05

CPC分类号： B23K35/302

摘要： A copper base brazing alloy consisting of, in percent by weight, 25 to 40 manganese, 0 to 10 nickel, 0 to 10 iron, 0 to 6 indium and 0 to 10 tin with the combination of tin and indium being not less than 2, and the balance essentially copper, is suitable for brazing cemented carbide to steel in a temperature range 815.degree.-900.degree. C. (1500.degree.-1650.degree. F.). The brazing temperature of these filler alloys are at least 100.degree. F. lower than those of non-precious brazing filler alloys of the prior art used for this application and are considerably less expensive than prior art precious metal brazing alloys currently being used. The resulting cemented carbide to steel joints have high shear strength and good ductility.

摘要翻译： 一种铜基钎焊合金，以重量百分比计含有25至40种锰，0至10种镍，0至10份铁，0至6份铟和0至10份锡，锡和铟的组合不小于2， 余量基本上为铜，适用于在815°-900℃（1500〜-1650°F）的温度范围内将硬质合金钎焊到钢上。 这些填充合金的钎焊温度比用于本申请的现有技术的非贵重钎焊料合金低至少100°F，并且比目前使用的现有技术的贵金属钎焊合金便宜得多。 所得到的硬质合金与钢接头具有高剪切强度和良好的延展性。