Micromechanical component
    12.
    发明授权
    Micromechanical component 有权
    微机械部件

    公开(公告)号:US07270868B2

    公开(公告)日:2007-09-18

    申请号:US10618791

    申请日:2003-07-14

    CPC classification number: B81C1/00595 Y10T428/24612 Y10T428/24628

    Abstract: A component having a surface micromechanical structure containing both movable elements and immovable elements, and a method of manufacturing same are described. The surface micromechanical structure of the component is produced in a functional layer, which is connected to a substrate via at least one electrically non-conductive first insulation layer and at least one first sacrificial layer. The movable elements of the surface micromechanical structure are exposed by removing the first sacrificial layer. The first insulation layer is made of a material which is not substantially attacked by the process of removing the first sacrificial layer. Thus the removal of the sacrificial layer may be limited in a design-controlled manner. At the same time, a reliable electrical insulation of the surface micromechanical structure with respect to the substrate of the component and a reliable mechanical fastening of the immovable elements of the surface micromechanical structure to the substrate are ensured.

    Abstract translation: 描述了具有包含可移动元件和不可移动元件的表面微机械结构的部件及其制造方法。 组件的表面微机械结构在功能层中产生,功能层通过至少一个不导电的第一绝缘层和至少一个第一牺牲层连接到基板。 通过去除第一牺牲层来暴露表面微机械结构的可移动元件。 第一绝缘层由不会被去除第一牺牲层的过程基本上受到攻击的材料制成。 因此,可以以设计控制的方式限制牺牲层的去除。 同时,确保表面微机械结构相对于部件的基板的可靠的电绝缘以及表面微机械结构的不动元件到基板的可靠的机械紧固。

    Method of manufacturing a micromechanical component
    14.
    发明授权
    Method of manufacturing a micromechanical component 失效
    微机械部件的制造方法

    公开(公告)号:US06905615B2

    公开(公告)日:2005-06-14

    申请号:US10057455

    申请日:2002-01-24

    CPC classification number: B81C1/00896 B81C2201/053

    Abstract: A method of manufacturing a micromechanical component has the steps: providing a substrate having a front side and a back side; structuring the front side of the substrate; at least partially covering the structured front side of the substrate with a protective layer containing germanium; structuring the back of the substrate; and at least partially removing the protective layer containing germanium from the structured front side of the substrate.

    Abstract translation: 微机械部件的制造方法具有以下步骤:提供具有正面和背面的基板; 构造衬底的前侧; 至少部分地用包含锗的保护层覆盖所述基板的结构化正面; 构造衬底的背面; 并且从所述基板的结构化正面至少部分地去除含有锗的保护层。

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