Lot-to-lot rapid thermal processing (RTP) chamber preheat optimization
    11.
    发明授权
    Lot-to-lot rapid thermal processing (RTP) chamber preheat optimization 有权
    批量快速热处理(RTP)室预热优化

    公开(公告)号:US06268270B1

    公开(公告)日:2001-07-31

    申请号:US09429790

    申请日:1999-10-29

    IPC分类号: H01C21265

    CPC分类号: G01J5/0003 G01J1/32

    摘要: Methods of optimizing a preheat recipe for rapid thermal processing workpieces are provided. In one aspect, a method of manufacturing is provided that includes preheating a rapid thermal processing chamber according to a preheating recipe and processing a first plurality of workpieces in the rapid thermal processing chamber. Parameter measurements are performed on a first workpiece and a second workpiece of the first plurality of workpieces. The parameter measurements are indicative of processing differences between the first and second workpieces. An output signal is formed corresponding to the parameter measurements and a control signal based on the output signal is used to adjust the preheating recipe for preheating the rapid thermal processing chamber for processing a second plurality of workpieces in the rapid thermal processing chamber to reduce processing differences between first and second workpieces of the second plurality of workpieces.

    摘要翻译: 提供了优化用于快速热处理工件的预热配方的方法。 一方面,提供一种制造方法,其包括根据预热配方预热快速热处理室并在快速热处理室中处理第一多个工件。 在第一工件和第一工件的第二工件上执行参数测量。 参数测量表示第一和第二工件之间的加工差异。 对应于参数测量形成输出信号,并且使用基于输出信号的控制信号来调节用于预热快速热处理室的预热配方,用于处理快速热处理室中的第二多个工件以减少加工差异 在第二多个工件的第一和第二工件之间。

    E10 reporting tool
    12.
    发明授权
    E10 reporting tool 失效
    E10报表工具

    公开(公告)号:US5740429A

    公开(公告)日:1998-04-14

    申请号:US499220

    申请日:1995-07-07

    IPC分类号: G01R31/28 G06Q10/06 G06F17/30

    摘要: Method and system for automatically and accurately generating E10 reports based on a user-selected set of parameters, including date range, equipment and other parameters, are disclosed. In a preferred embodiment, the system of the present invention performs three primary functions; namely, a mapping function, a data extraction function and a reporting application function. The mapping function enables users to map WorkStream events into E10 defined states outside of the WorkStream database. The reporting application function provides several major functional capabilities, particularly, enabling a user to formulate restriction information, or "E10 data requests," for data extraction and reporting purposes. Each E10 data request identifies, as a function of facility (or manufacturing area), module, family and/or equipment, the equipment list for which data is to be accumulated, as well as a time period for reporting and duration type to report on. In addition, the reporting application function enables the user to display all E10 calculations for each piece of equipment in the extracted data set and to generate and display via a video terminal, printer and/or plotter, standard and custom graphic reports from the extracted E10 data calculations. The data extraction function provides the necessary data extraction capabilities and E10 data request management by managing and executing the requests submitted by users and purging old requests from the queue. In one aspect of the invention, the system comprises a user interface for facilitating the user's formulation of requests, mapping of WorkStream events to E10 states and substates, and viewing and/or printing reports in textual and graphical formats.

    摘要翻译: 公开了基于用户选择的一组参数(包括日期范围,设备和其他参数)自动准确生成E10报告的方法和系统。 在优选实施例中,本发明的系统执行三个主要功能; 即映射功能,数据提取功能和报告应用功能。 映射功能使用户能够将WorkStream事件映射到WorkStream数据库外的E10定义状态。 报告应用功能提供了几个主要的功能功能,特别是使用户能够制定限制信息或“E10数据请求”,用于数据提取和报告。 每个E10数据请求根据设施(或制造区域),模块,家庭和/或设备的功能,识别要累积数据的设备清单以及报告和持续时间类型报告的时间段 。 此外,报告应用功能使用户能够显示提取的数据集中的每个设备的所有E10计算,并通过视频终端,打印机和/或绘图仪,提取的E10的标准和自定义图形报告生成和显示 数据计算。 数据提取功能通过管理和执行用户提交的请求并从队列中清除旧请求,提供必要的数据提取功能和E10数据请求管理。 在本发明的一个方面,该系统包括用户界面,用于方便用户对请求的制定,将WorkStream事件映射到E10状态和子状态,并以文本和图形格式查看和/或打印报告。

    Method and apparatus for using tool state information to identify faulty wafers
    13.
    发明授权
    Method and apparatus for using tool state information to identify faulty wafers 有权
    使用工具状态信息来识别故障晶片的方法和装置

    公开(公告)号:US06738731B1

    公开(公告)日:2004-05-18

    申请号:US09815445

    申请日:2001-03-22

    IPC分类号: G01R3126

    CPC分类号: G01R31/2831

    摘要: A method for identifying faulty wafers includes processing a set of wafers in a tool; collecting tool state information during the processing of the set of wafers; generating a tool state information baseline; comparing the tool state information for each wafer to the tool state information baseline to identify any wafers with outlying tool state information; and designating a particular wafer in the set as suspect in response to identifying outlying tool state information for the particular wafer. A processing line includes a tool adapted to process a set of wafers, and a process controller. The process controller is adapted to collect tool state information during the processing of the set of wafers, generate a tool state information baseline, compare the tool state information for each wafer to the baseline tool state information to identify any wafers with outlying tool state information, and designate a particular wafer in the set as suspect in response to identifying outlying tool state information for the particular wafer.

    摘要翻译: 用于识别故障晶片的方法包括在工具中处理一组晶片; 在处理该组晶片期间收集工具状态信息; 生成工具状态信息基线; 将每个晶片的工具状态信息与工具状态信息基准进行比较,以识别具有外围工具状态信息的任何晶片; 以及响应于识别用于特定晶片的外部工具状态信息而将所述组中的特定晶片指定为可疑的。 处理线包括适于处理一组晶片的工具和过程控制器。 过程控制器适于在晶片组的处理期间收集工具状态信息,产生工具状态信息基线,将每个晶片的工具状态信息与基准工具状态信息进行比较,以识别具有外围工具状态信息的任何晶片, 并且响应于识别用于特定晶片的外部工具状态信息而将集合中的特定晶片指定为可疑。

    System and method for calculating cluster tool performance metrics using
a weighted configuration matrix

    公开(公告)号:US5914879A

    公开(公告)日:1999-06-22

    申请号:US886824

    申请日:1997-03-04

    IPC分类号: G06F19/00

    摘要: A system and method for calculating the performance of a cluster tool using a weighted configuration matrix. The system includes a computer system which maintains a database of entities corresponding to semiconductor wafer processing modules in a fab. A user "clusters" the entities, i.e., selects entities to reflect the relationship of the constituent modules physically linked together which form the cluster tool. The user also designates a main module against which the main performance events of the cluster tool, such as begin run and end run, are logged in the database. The computer system configures all of the "up" and "down" state configuration combinations of the cluster tool modules and displays the configurations for the user. The user specifies a weight for each of the configurations based upon an estimate of the performance the cluster tool while in the respective configuration relative to the performance of the cluster tool in a fully operable configuration. For example, the user may choose the weights based upon the throughput of wafers capable of being processed by the cluster tool in each of the respective configurations, the number of wafer processes capable of being performed by the cluster tool in each of the respective configurations, or the economic value added (EVA) by the wafer processes capable of being performed by the cluster tool in each of the respective configurations. The computer system compiles the configurations and received weights into a weighted configuration matrix which is used to calculate the performance of the cluster tool. In particular, the E10 metrics and OEE metric components are calculated as a measure of the reliability, availability, maintainability, operational efficiency and utilization aspects of performance of the cluster tool over a total period of time. Formulas for calculating various of the metrics using the configuration matrix are provided. The method is applicable to both sequential and parallel type cluster tools and does not require additional data tracking beyond currently tracked data.