Abstract:
A chip electronic component includes spacers that each have a predetermined thickness direction dimension on a mounting surface in a direction perpendicular to the mounting surface. The spacers each contain, as a main component, an intermetallic compound containing at least one high-melting-point metal selected from Cu and Ni, and Sn defining a low-melting-point metal.
Abstract:
An electronic component includes a multilayer capacitor and an interposer including a substrate main body with an electric insulation property, the multilayer capacitor being mounted on one main surface side of the substrate main body. The multilayer capacitor includes a multilayer body, a first outer electrode, and a second outer electrode. The multilayer body includes an effective region and a non-effective region surrounding the effective region. A width of the effective region is larger than a width of the substrate main body, when a width of the multilayer body is represented by W11, a thickness of the multilayer body is represented by T11, and a thickness of the substrate main body is represented by T21, a value of W11/(T11+T21) is not less than about 0.90 and not more than about 1.10.
Abstract:
A monolithic ceramic capacitor includes a plurality of first and second inner electrodes in a ceramic body. A direction in which the first and second inner electrodes are stacked is a stacking direction, a direction perpendicular or substantially perpendicular to the stacking direction in the ceramic body is a length direction, and a direction perpendicular or substantially perpendicular to the stacking direction and the first direction is a width direction. The ceramic body includes an effective portion, a first outer layer portion, a second outer layer portion, a first side portion, and a second side portion. A ratio A/B is about 0.04 or less when a dimension of each of the first side portion and the second side portion in the width direction is A and a dimension of the effective portion in the stacking direction is B.
Abstract:
A multi-terminal multilayer capacitor includes first vias and second vias extending in first and second internal electrodes in a stacking direction, a first slit extending between the first via and a first insulating portion that insulates the second via and the first internal electrode from each other, and a second slit extending between the second via and a second insulating portion that insulates the first via and the second internal electrode from each other. The first via electrically connects regions of the first internal electrode split by the first slit, and the second via electrically connects regions of the second internal electrode divided by the second slit.
Abstract:
A multilayer capacitor includes a capacitor body including dielectric layers, first and second internal electrodes, and first and second main surfaces, first and second external electrodes on at least one of the first and second main surfaces, first via conductors to electrically connect the first external electrode and the first internal electrodes, and second via conductors to electrically connect the second external electrode and the second internal electrodes, a direction in which the dielectric layer, the first internal electrode, and the second internal electrode are laminated is a height direction of the capacitor body, and a height of the capacitor body is about 100%, and a height of the first and second external electrodes is equal to or larger than about 50% with respect to the height of the capacitor body.
Abstract:
A chip electronic component includes spacers that each have a predetermined thickness direction dimension on a mounting surface in a direction perpendicular to the mounting surface. The spacers each contain, as a main component, an intermetallic compound containing at least one high-melting-point metal selected from Cu and Ni, and Sn defining a low-melting-point metal.
Abstract:
A multilayer ceramic capacitor includes a capacitor body including dielectric layers, first and second inner electrodes, first and second via conductors, and first and second outer electrodes. In a reference layout in which m×n (m and n are each a natural number of 4 or more) virtual lattice points are set in a view of the capacitor body seen in a lamination direction, and in which the first and second via conductors are arranged at all the virtual lattice points, the first and second via conductors are not arranged at least in a portion of (m-2)×(n-2) of the virtual lattice points located inside outermost peripheral virtual lattice points.
Abstract:
A chip electronic component includes spacers that each have a predetermined thickness direction dimension on a mounting surface in a direction perpendicular to the mounting surface. The spacers each contain, as a main component, an intermetallic compound containing at least one high-melting-point metal selected from Cu and Ni, and Sn defining a low-melting-point metal.
Abstract:
A multilayer capacitor built-in substrate includes a core substrate, a multilayer capacitor mounted on one principal surface of the core substrate, and a burying layer provided on the one principal surface of the core substrate to bury the multilayer capacitor. The multilayer capacitor includes a laminated body in which dielectric layers and internal electrode layers are laminated, and first and second external electrodes. The laminated body includes an effective region in which internal electrode layers respectively connected to the first external electrode and the second external electrode are laminated with a dielectric layer located therebetween, and a non-effective region surrounding the effective region. The core substrate includes, on the one principal surface, a first land electrode electrically connected to the first external electrode and a second land electrode electrically connected to the second external electrode.
Abstract:
A monolithic ceramic capacitor includes a plurality of first and second inner electrodes in a ceramic body. A direction in which the first and second inner electrodes are stacked is a stacking direction, a direction perpendicular or substantially perpendicular to the stacking direction in the ceramic body is a length direction, and a direction perpendicular or substantially perpendicular to the stacking direction and the first direction is a width direction. The ceramic body includes an effective portion, a first outer layer portion, a second outer layer portion, a first side portion, and a second side portion. A ratio A/B is about 0.04 or less when a dimension of each of the first side portion and the second side portion in the width direction is A and a dimension of the effective portion in the stacking direction is B.