公开(公告)号：US20230368535A1

公开(公告)日：2023-11-16

申请号：US17923288

申请日：2022-05-14

Applicant: NEC Corporation

Inventor： Yaeko YONEZAWA ,  Katsumi KIKUCHI ,  Soma SHIRAISHI ,  Yu NABETO

IPC: G06V20/50 ,  G06T7/73

CPC classification number: G06V20/50 ,  G06T7/73 ,  G06T2207/10144

Abstract: A product identification apparatus (20) includes an acquisition unit (210), and an image processing unit (220). The acquisition unit (210) acquires a plurality of images captured by an image capturing apparatus (10). These plurality of images are generated by capturing an image of a same product shelf (40) while changing a parameter. The image processing unit (220) determines a product (50) located on the product shelf (40) by processing these plurality of images, and outputs a result of the determination. The determination result is, for example, the one in which product identification information (e.g., a JAN code) of the product (50), and a position of the product (50) on the product shelf (40) are associated with each other.

公开(公告)号：US20230345844A1

公开(公告)日：2023-10-26

申请号：US18007772

申请日：2020-06-05

Applicant: NEC Corporation

Inventor： Katsumi KIKUCHI ,  Akira MIYATA ,  Suguru WATANABE ,  Takanori NISHI ,  Hideyuki SATOU ,  Kenji NANBA ,  Ayami YAMAGUCHI

IPC: H10N60/81 ,  H01P7/08 ,  G06N10/40

CPC classification number: H10N60/815 ,  H01P7/082 ,  G06N10/40

Abstract: Provided is a quantum device capable of improving cooling performance. A quantum device includes a quantum chip configured to perform information processing using a quantum state, and an interposer on which the quantum chip is mounted, and the quantum chip is arranged inside a recess 31 formed in a sample stage having a cooling function, and a part of the interposer is in contact with the sample stage. The quantum chip may have a first surface mounted on the interposer and a second surface opposite to the first surface, and at least a part of the second surface may be in contact with an inner surface of the recess.

公开(公告)号：US20230237362A1

公开(公告)日：2023-07-27

申请号：US18007769

申请日：2020-06-05

Applicant: NEC Corporation

Inventor： Akira MIYATA ,  Katsumi KIKUCHI ,  Suguru WATANABE ,  Takanori NISHI ,  Hideyuki SATOU ,  Tomohiro YAMAJI ,  Tsuyoshi YAMAMOTO ,  Yoshihito HASHIMOTO

IPC: G06N10/40 ,  G01R33/035

CPC classification number: G06N10/40 ,  G01R33/0354

Abstract: Provided is a quantum device capable of suppressing reduction in performance of quantum bit even when a quantum chip is flip-chip mounted on an interposer. A quantum chip (10) is flip-chip mounted on an interposer (20) by a bump (30). A coplanar line (12) coupling adjacent quantum bits is formed on the quantum chip (10). A gap (22) is provided, in the interposer (20), at a location facing a center conductor (12a) of the coplanar line (12). A second ground electrode (24) is formed around gap (22). The interposer (20) has a connection electrode (40) connecting the second ground electrode (24) around the gap (22). A bump (30A) formed in the vicinity of the connection electrode (40) is connected to the first ground electrode (12b) and the second ground electrode (24).

公开(公告)号：US20230162080A1

公开(公告)日：2023-05-25

申请号：US17974744

申请日：2022-10-27

Applicant: NEC Corporation

Inventor： Katsumi KIKUCHI ,  Akira MIYATA ,  Kunihiko ISHIHARA ,  Yoshihito HASHIMOTO

IPC: G06N10/40

CPC classification number: G06N10/40

Abstract: A quantum device includes a first quantum chip, a second quantum chip, and one or more interposer substrates mounting the first quantum chip and the second quantum chip. The first quantum chip and the second quantum chip mounted on a same or different interposer substrates, have surfaces with at least partial regions thereof opposing each other, and electrical connection is made between opposing connection terminals arranged in at least partial regions of the surfaces, opposed to each other, of the first quantum chip and the second quantum chip.

公开(公告)号：US20230087980A1

公开(公告)日：2023-03-23

申请号：US17908392

申请日：2020-03-09

Applicant: NEC Corporation

Inventor： Yu NABETO ,  Katsumi KIKUCHI ,  Takami SATO ,  Soma SHIRAISHI

IPC: G06Q30/02 ,  G06T7/00

Abstract: A product detection apparatus (10) includes an acquisition unit (110), an image processing unit (120), and an output unit (130). The acquisition unit (110) acquires a plurality of images (one example of a first image) generated by an image capture unit (20) in association with a date and a time when the image is generated. These plurality of images are generated at different timings from each other. The image processing unit (120) detects a state (hereinafter, described as a first state) in which a new product is present on a product shelf (40) continuously for a reference time or longer by processing the plurality of images. The output unit (130) performs a first output when the first state is detected. The first output indicates that a product (50) has been returned to the product shelf (40) after the product (50) is taken out of the product shelf (40) by a customer.

公开(公告)号：US20210262886A1

公开(公告)日：2021-08-26

申请号：US17276296

申请日：2019-09-17

Applicant: NEC Corporation

Inventor： Junichiro MATAGA ,  Shigeki SHINODA ,  Katsumi KIKUCHI

IPC: G01M3/00

Abstract: A fluid leakage diagnosis device includes: an identification unit for using wave measurement information expressing a wave measured in a pipe to identify a position of an origin of the wave; a detection unit for using structural information of the pipe to detect a structural factor of the wave at the position of the origin identified by the identification unit; a determination unit for determining whether a time shift in the wave measurement information satisfies a condition; and a diagnosis unit for diagnosing fluid leakage in the pipe based on a detection result from the detection unit and a determination result from the determination unit, and this fluid leakage diagnosis device enhances the accuracy of fluid leakage diagnosis for a pipe accomplished through measurement of a wave produced in the pipe.

公开(公告)号：US20230325138A1

公开(公告)日：2023-10-12

申请号：US17923275

申请日：2020-05-14

Applicant: NEC Corporation

Inventor： Yaeko YONEZAWA ,  Katsumi KIKUCHI ,  Soma SHIRAISHI ,  Yu NABETO

IPC: G06F3/14 ,  G06T5/50 ,  G06T7/13 ,  G06T7/70

CPC classification number: G06F3/14 ,  G06T5/50 ,  G06T7/13 ,  G06T7/70 ,  G06T2207/20221

Abstract: An image capturing apparatus includes an image acquisition unit, a display processing unit, and a storage processing unit. The display processing unit displays, on a display, an image acquired by the image acquisition unit. After the storage processing unit stores a first image in an image storage unit, the display processing unit repeatedly displays a latest image (a real-time image) generated by an image capturing unit, in a second display region being adjacent to a first display region, which is a part of the display, of the display, while displaying at least an edge of the first image in the first display region. Then, the storage processing unit performs processing for storing the real-time image or an image generated thereafter, in the image storage unit as a second image, when continuity of an edge of the first image and the real-time image in the display satisfies a criterion.

公开(公告)号：US20230309419A1

公开(公告)日：2023-09-28

申请号：US18123038

申请日：2023-03-17

Applicant: NEC Corporation

Inventor： Katsumi KIKUCHI ,  Akira Miyata ,  Takanori Nishi ,  Kenji Nanba ,  Ayami Yamaguchi

IPC: H10N60/81 ,  H01L23/00

CPC classification number: H10N60/81 ,  H01L24/16 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/16227 ,  H01L2224/13147 ,  H01L2224/13186 ,  H01L2924/05442 ,  H01L2924/0504 ,  H01L2924/059 ,  H01L2224/1413

Abstract: A quantum device includes a chip including a superconducting circuit, a first wiring substrate, a second wiring substrate, first connection portions connecting the chip and a wiring layer on a first surface of the first wiring substrate and second connection portions connecting the second wiring substrate and a wiring layer on a second surface of the first wiring substrate, wherein one or more second connection portions arranged in a first row as viewed from the edge of the first substrate are provided at positions corresponding respectively to one or more of the first connection portions arranged in a first row as viewed from the edge and are arranged closer to the edge than the first connection portions arranged in the first row.

公开(公告)号：US20230205815A1

公开(公告)日：2023-06-29

申请号：US17926731

申请日：2020-05-26

Applicant: NEC Corporation

Inventor： Haruna WATANABE ,  Katsumi KIKUCHI ,  Soma SHIRAISHI ,  Yu NABETO

IPC: G06F16/75 ,  G06F16/65

CPC classification number: G06F16/75 ,  G06F16/65

Abstract: The information processing device 1X mainly includes a pair determination means 15X and a relevance degree calculation unit 16X. The pair determination means 15X is configured to determine a pair of data at least one member of which is a first digest candidate that is a candidate of a digest, the data including at least one of video data or audio data. The relevance degree calculation means 16X is configured to calculate a degree of relevance indicating a degree of probability that the pair determined by the pair determination means 15X is included in the digest at a time.

公开(公告)号：US20230021345A1

公开(公告)日：2023-01-26

申请号：US17788084

申请日：2019-12-26

Applicant: NEC Corporation

Inventor： Akane ARUGA ,  Yasunori BABAZAKI ,  Katsumi KIKUCHI

IPC: G06T7/70 ,  G02B27/01

Abstract: The information processing device 4 includes an acquisition unit 40A, a structural feature point extraction unit 41A, a common coordinate system transformation unit 42A, and a structural feature point integration unit 43A. The acquisition unit 40A is configured to acquire captured images Im generated by plural image acquisition devices 5 and positional relation information Ip indicative of a positional relation among the plural image acquisition device 5. The structural feature point extraction unit 41A is configured to extract, from each of the captured images Im, intra-image coordinate values Pi for structural feature points, which are structural feature points of a target structure of observation through a display device, the display device displaying a virtual object superimposed on a view. The common coordinate system transformation unit 42A is configured to convert, based on the positional relation information Ip, the intra-image coordinate values Pi for each of the structural feature points extracted from each of the captured images Im into individual coordinate values Pc indicating coordinate values in a common coordinate system which is a common three-dimensional coordinate system. The structural feature point integration unit 43A is configured to determine, for each of the structural feature points, a representative coordinate value Pcr in the common coordinate system based on the individual coordinate values Pc in the common coordinate system.