公开(公告)号：US20140227813A1

公开(公告)日：2014-08-14

申请号：US14177329

申请日：2014-02-11

Applicant: NICHIA CORPORATION

Inventor： Akinori YONEDA ,  Shinji NAKAMURA ,  Akiyoshi KINOUCHI ,  Yoshiyuki AIHARA ,  Hirokazu SASA

IPC: H01L21/78 ,  H01L33/00

CPC classification number: H01L33/387 ,  H01L33/0095 ,  H01L33/44 ,  H01L33/62

Abstract: A light emitting element for flip-chip mounting having a flat mounting surface which allows a decrease in the width of the streets of a wafer. In the light emitting element, the insulating member filling around the bumps and flattening the upper surface is formed with a margin of a region with a width which is equal to or larger than the width of the streets on the dividing lines, so that at the time of dividing the wafer along the dividing lines, the insulating member is not processed, which allows designing of the streets with a small width.

Abstract translation: 一种用于倒装芯片安装的发光元件，其具有平坦的安装表面，其允许晶片的街道宽度的减小。 在发光元件中，填充凸起并使上表面变平的绝缘构件形成有宽度等于或大于分界线上的街道宽度的区域的边缘，使得在 分割晶片沿着分割线的时间，绝缘构件不被处理，这允许以小的宽度设计街道。