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公开(公告)号：US20230343892A1
公开(公告)日：2023-10-26
申请号：US18343078
申请日：2023-06-28
Applicant: NICHIA CORPORATION
Inventor： Yoshiki INOUE , Shun KITAHAMA , Yoshiyuki AIHARA , Yoshiki MATSUSHITA , Keisuke HIGASHITANI
CPC classification number: H01L33/0095 , H01L33/007 , H01L33/507 , H01L33/22 , H01L2933/0041
Abstract: A method for manufacturing a light-emitting element includes: forming a semiconductor structure comprising a light-emitting layer on a first surface of a substrate, wherein the first surface comprising a plurality of protrusions and a second region; dividing the semiconductor structure into a plurality of light-emitting portions by removing a portion of the semiconductor structure so as to form an exposed region of the substrate, wherein the second region is exposed from under the semiconductor structure in the exposed region; bonding a light-transmitting body to a second surface of the substrate that is opposite the first surface so as to form a bonded body, wherein the light-transmitting body comprises a fluorescer; forming a plurality of modified regions along the exposed region; removing a portion of the light-transmitting body that overlaps the plurality of modified regions in a plan view; and singulating the bonded body along the modified regions.
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公开(公告)号：US20210193867A1
公开(公告)日：2021-06-24
申请号：US17113583
申请日：2020-12-07
Applicant: NICHIA CORPORATION
Inventor： Yoshiki INOUE , Shun KITAHAMA , Yoshiyuki AIHARA , Yoshiki MATSUSHITA , Keisuke HIGASHITANI
Abstract: A method for manufacturing a light-emitting element includes dividing a semiconductor structure into a plurality of light-emitting portions by removing a portion of the semiconductor structure so as to form an exposed region, a first surface being exposed from under the semiconductor structure in the exposed region; etching protrusions formed in the exposed region; bonding a light-transmitting body to a second surface so as to form a bonded body; forming a plurality of modified regions along the exposed region inside the substrate by irradiating a laser beam on the exposed region from the first surface side; removing a portion of the light-transmitting body that overlaps the plurality of modified regions in a plan view; and singulating the bonded body along the modified regions.
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公开(公告)号：US20240113263A1
公开(公告)日：2024-04-04
申请号：US18466070
申请日：2023-09-13
Applicant: NICHIA CORPORATION
Inventor： Yoshiyuki AIHARA
CPC classification number: H01L33/405 , H01L33/44
Abstract: A light-emitting device includes a light-emitting element a semiconductor structure body including an n-side layer, a p-side layer, and an active layer, the n-side layer including an n-side exposed surface exposed from the active layer and the p-side layer in a plan view. The semiconductor structure body includes a side surface connecting the n-side exposed surface and an upper surface of the p-side layer. An insulating film includes a first opening exposing the n-side exposed surface, and a second opening positioned above the upper surface of the p-side layer. An n-side electrode includes a first part positioned above the upper surface of the p-side layer with the insulating film interposed, a second part electrically connected with the n-side exposed surface in the first opening and electrically connected with the first part located at the insulating film covering the side surface, and a third opening that exposes the insulating film covering the side surface of the semiconductor structure body. A light-reflective member contacts the insulating film in the third opening.
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公开(公告)号：US20180159007A1
公开(公告)日：2018-06-07
申请号：US15886656
申请日：2018-02-01
Applicant: NICHIA CORPORATION
Inventor： Akinori YONEDA , Yoshiyuki AIHARA
CPC classification number: H01L33/62 , H01L33/0095 , H01L33/38 , H01L33/486 , H01L33/507 , H01L33/52 , H01L33/54 , H01L2224/4813 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0066
Abstract: A method of manufacturing one or more light emitting devices includes: forming one or more emitting elements, each including a first conductive type semiconductor layer, a second conductive type semiconductor layer, a first electrode, and a second electrode, on a growth substrate; forming a first metal layer electrically connected to each first electrode, and a second metal layer electrically connected to each second electrode; forming a first resin layer covering the one or more light emitting elements so as to expose an upper surface of each first metal layer and an upper surface of each second metal layer; connecting a first wire to the upper surface of each first metal layer, and connecting a second wire to the upper surface of each second metal layer; and forming a second resin layer on the first resin layer so as to expose an end portion of each first wire and second wire.
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公开(公告)号：US20170012174A1
公开(公告)日：2017-01-12
申请号：US15276449
申请日：2016-09-26
Applicant: NICHIA CORPORATION
Inventor： Akinori YONEDA , Shinji NAKAMURA , Akiyoshi KINOUCHI , Yoshiyuki AIHARA , Hirokazu SASA
CPC classification number: H01L33/387 , H01L33/0095 , H01L33/44 , H01L33/62
Abstract: A light emitting element for flip-chip mounting having a flat mounting surface which allows a decrease in the width of the streets of a wafer. In the light emitting element, the insulating member filling around the bumps and flattening the upper surface is formed with a margin of a region with a width which is equal to or larger than the width of the streets on the dividing lines, so that at the time of dividing the wafer along the dividing lines, the insulating member is not processed, which allows designing of the streets with a small width.
Abstract translation: 一种用于倒装芯片安装的发光元件，其具有平坦的安装表面，其允许晶片的街道宽度的减小。 在发光元件中，填充凸起并使上表面变平的绝缘构件形成有宽度等于或大于分界线上的街道宽度的区域的边缘，使得在 分割晶片沿着分割线的时间，绝缘构件不被处理，这允许以小的宽度设计街道。
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Patent Agency Ranking
公开(公告)号：US20170301844A1
公开(公告)日：2017-10-19
申请号：US15641231
申请日：2017-07-04
Applicant: NICHIA CORPORATION
Inventor： Akinori YONEDA , Yoshiyuki AIHARA , Shinji NAKAMURA
CPC classification number: H01L33/62 , H01L33/0095 , H01L33/54 , H01L2224/94 , H01L2933/0033
Abstract: A manufacturing method of a light emitting device includes preparing a wafer that is provided by arranging a plurality of semiconductor light emitting elements including semiconductor stacks and electrodes provided on first surfaces of the semiconductor stacks. A metal wire is wired in an arc shape between the electrodes of the plurality of semiconductor light emitting elements that are arranged in one direction on the wafer so as to connect each of the electrodes and the metal wire. A resin layer is provided on a side of the first surfaces of the semiconductor stacks in such a way that the metal wire is accommodated inside the resin layer. The wafer is cut along a boundary line to segment the plurality of semiconductor light emitting elements so as to singulate the plurality of semiconductor light emitting elements.
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公开(公告)号：US20170279018A1
公开(公告)日：2017-09-28
申请号：US15466780
申请日：2017-03-22
Applicant: NICHIA CORPORATION
Inventor： Masatsugu ICHIKAWA , Yoshiki INOUE , Yoshiyuki AIHARA , Takehito SHIMATSU
CPC classification number: H01L33/62 , H01L25/0753 , H01L27/153 , H01L33/0079 , H01L33/44 , H01L2224/16225 , H01L2224/8192 , H01L2224/97 , H01L2933/0025 , H01L2933/0033 , H01L2933/0066
Abstract: A method for manufacturing a semiconductor device includes: providing a support with a semiconductor light-emitting element including a first electrode and a second electrode; providing a base including a first interconnect terminal and a second interconnect terminal; forming a first metal layer on the support to cover the first and the second electrodes; forming a second metal layer on the base to cover the first and the second interconnect terminals; arranging the first and second electrodes and the first and second interconnect terminals to respectively face each other, and providing electrical connection therebetween by atomic diffusion; and rendering electrically insulative or removing portions of the first metal layer and the second metal layer that are outside thereof defined between the first and second electrodes and the first and second interconnect terminals.
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8.发明申请METHOD OF MANUFACTURING LIGHT EMITTING DEVICE WITH EXPOSED WIRE END PORTIONS 审中-公开用暴露的电线端部制造发光器件的方法公开(公告)号：US20160276562A1
公开(公告)日：2016-09-22
申请号：US15169066
申请日：2016-05-31
Applicant: Nichia Corporation
Inventor： Akinori YONEDA , Yoshiyuki AIHARA
CPC classification number: H01L33/62 , H01L33/0095 , H01L33/38 , H01L33/486 , H01L33/507 , H01L33/52 , H01L33/54 , H01L2224/4813 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0066
Abstract: A light emitting device is constituted with a semiconductor light emitting element on which a support member is disposed on one surface provided with a p-side electrode and an n-side electrode and a fluorescent material layer is disposed on the other surface which is an opposite side of the one surface. The support member includes a resin layer, an electrode for p-side external connection and an electrode for n-side external connection disposed exposed at a surface opposite side of a surface where the resin layer is in touch with a light emitting element, and internal wirings disposed in the resin layer and electrically connecting between a p-side electrode and the electrode for p-side external connection respectively. The internal wirings include a metal wire and a metal plated layer, and a metal wire and a metal plated layer respectively connected in series.
Abstract translation: 发光装置由在其上设置有p侧电极和n侧电极的一个表面上设置有支撑构件的半导体发光元件构成，并且荧光材料层设置在相反的另一个表面上 一面。 支撑构件包括树脂层，用于p侧外部连接的电极和用于n侧外部连接的电极，暴露在树脂层与发光元件接触的表面的相反侧的表面处，以及内部 布线设置在树脂层中，分别电连接p侧电极和p侧外部电极用电极。 内部布线包括金属线和金属镀层，以及分别串联连接的金属线和金属镀层。
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公开(公告)号：US20150187995A1
公开(公告)日：2015-07-02
申请号：US14581639
申请日：2014-12-23
Applicant: Nichia Corporation
Inventor： Akinori YONEDA , Yoshiyuki AIHARA
CPC classification number: H01L33/62 , H01L33/0095 , H01L33/38 , H01L33/486 , H01L33/507 , H01L33/52 , H01L33/54 , H01L2224/4813 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0066
Abstract: A light emitting device is constituted with a semiconductor light emitting element on which a support member is disposed on one surface provided with a p-side electrode and an n-side electrode and a fluorescent material layer is disposed on the other surface which is an opposite side of the one surface. The support member includes a resin layer, an electrode for p-side external connection and an electrode for n-side external connection disposed exposed at a surface opposite side of a surface where the resin layer is in touch with a light emitting element, and internal wirings disposed in the resin layer and electrically connecting between a p-side electrode and the electrode for p-side external connection respectively. The internal wirings include a metal wire and a metal plated layer, and a metal wire and a metal plated layer respectively connected in series.
Abstract translation: 发光装置由在其上设置有p侧电极和n侧电极的一个表面上设置有支撑构件的半导体发光元件构成，并且荧光材料层设置在相反的另一个表面上 一面。 支撑构件包括树脂层，用于p侧外部连接的电极和用于n侧外部连接的电极，暴露在树脂层与发光元件接触的表面的相反侧的表面处，以及内部 布线设置在树脂层中，分别电连接p侧电极和p侧外部电极用电极。 内部布线包括金属线和金属镀层，以及分别串联连接的金属线和金属镀层。
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公开(公告)号：US20150333236A1
公开(公告)日：2015-11-19
申请号：US14808706
申请日：2015-07-24
Applicant: Nichia Corporation
Inventor： Akinori YONEDA , Shinji NAKAMURA , Yoshiyuki AIHARA , Hirokazu SASA
CPC classification number: H01L33/507 , H01L24/18 , H01L33/38 , H01L33/46 , H01L33/505 , H01L33/54 , H01L33/58 , H01L33/60 , H01L2924/12041 , H01L2924/15788 , H01L2933/005 , H01L2924/00
Abstract: To provide a method of manufacturing at low cost a light emitting device that converts the wavelength of light radiated by a light emitting element and emits, the method includes: forming a phosphor layer on a translucent substrate; arranging a plurality of light emitting elements with a predetermined spacing, the light emitting elements having an electrode formed face provided with positive and negative electrodes respectively and arranged with the electrode formed faces on the top; embedding a resin containing phosphor particles so that an upper face of the embedded resin does not bulge over a plane containing the electrode formed faces; and curing the resin, and then cutting and dividing the cured resin, the phosphor layer and the translucent substrate into a plurality of light emitting devices each including one or more of the light emitting elements.
Abstract translation: 为了提供低成本地制造发光装置的方法，该发光装置转换由发光元件辐射的光的波长并发射，所述方法包括：在透光性基板上形成荧光体层; 以规定的间隔配置多个发光元件，所述发光元件具有分别设置有正极和负极的电极形成面，并且将电极形成面布置在顶部; 包埋含有荧光体颗粒的树脂，使得嵌入树脂的上表面不会在包含电极形成面的平面上凸出; 并固化树脂，然后将固化树脂，荧光体层和透光性基板切割分割成多个发光器件，每个发光器件包括一个或多个发光元件。
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