公开(公告)号：US20150340546A1

公开(公告)日：2015-11-26

申请号：US14716451

申请日：2015-05-19

Applicant: NICHIA CORPORATION

Inventor： Ryo SUZUKI ,  Yoshikazu TAKEUCHI ,  Hirokazu SASA

IPC: H01L33/00

CPC classification number: H01L33/641 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/28 ,  H01L33/32 ,  H01L33/502 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A method for manufacturing a light emitting device has: preparing a base body which comprises a pair of connection terminals; preparing a light emitting element which includes a substrate, a semiconductor laminate that is laminated on the substrate, and a pair of electrodes formed on the surface of the semiconductor laminate; joining the electrodes of the light emitting element to the connection terminals of the base body; covering the light emitting element with a sealing member; and removing at least a part of the sealing member and a part of the substrate of the light emitting element from the opposite side from the base body so that an upper surface of the sealing member is lower than an upper surface of the substrate of the light emitting element.

Abstract translation: 一种制造发光器件的方法具有：准备包括一对连接端子的基体; 制备包括基板的发光元件，层叠在基板上的半导体层叠体和形成在半导体层叠体的表面上的一对电极; 将发光元件的电极连接到基体的连接端子; 用密封构件覆盖发光元件; 以及从所述基体的相反侧除去所述密封构件的至少一部分和所述发光元件的所述基板的一部分，使得所述密封构件的上表面比所述光的基板的上表面低 发光元件。

公开(公告)号：US20210202802A1

公开(公告)日：2021-07-01

申请号：US17134337

申请日：2020-12-26

Applicant: NICHIA CORPORATION

Inventor： Shusaku BANDO ,  Hirokazu SASA

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/58

Abstract: The light emitting device includes: at least one light emitting element including a light-extracting surface and at least one lateral surface; a wavelength converting member including; a first upper surface and a second upper surface, a lower surface located at an opposite side from the first upper surface and the second upper surface, at least one first lateral surface connecting the second upper surface and the first upper surface, and at least one second lateral surface connecting the second upper surface and the lower surface, in which a thickness between the lower surface and the first upper surface is smaller than a thickness between the lower surface and the second upper surface, and the first upper surface is located at an opposite side from the light-extracting surface of a corresponding one of the at least one light emitting element, and the lower surface is located facing the light-extracting surface of the corresponding one of the at least one light emitting element; a covering member covering the at least one second lateral surface of the wavelength converting member and the at least one lateral surface of the light emitting element; and a light-shielding film covering the second upper surface of the wavelength converting member.

公开(公告)号：US20210151646A1

公开(公告)日：2021-05-20

申请号：US17097732

申请日：2020-11-13

Applicant: NICHIA CORPORATION

Inventor： Hirokazu SASA

IPC: H01L33/58 ,  H01L33/50 ,  H01L33/52 ,  H01L33/00

Abstract: A light-emitting device includes a light-emitting element, a light-transmissive member having an upper surface in a rectangular shape and a lower surface to be bonded to the light-emitting element, and a covering member disposed to cover lateral surfaces of the light-transmissive member and lateral surfaces of the light-emitting element such that the upper surface of the light-transmissive member is exposed. The light-transmissive member includes a main portion that constitutes the upper surface in the rectangular shape and a peripheral portion that is positioned around the main portion and has a smaller thickness than the main portion. In lateral surfaces of the peripheral portion, recesses are formed each of which is positioned at a location of a corresponding one of corners of the rectangular shape, and is depressed toward the main portion.

公开(公告)号：US20160365498A1

公开(公告)日：2016-12-15

申请号：US15247188

申请日：2016-08-25

Applicant: NICHIA CORPORATION

Inventor： Akinori YONEDA ,  Akiyoshi KINOUCHI ,  Hisashi KASAI ,  Yoshiyuki AIHARA ,  Hirokazu SASA ,  Shinji NAKAMURA

IPC: H01L33/62 ,  H01L33/56

CPC classification number: H01L33/62 ,  H01L21/6835 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L24/85 ,  H01L24/96 ,  H01L33/24 ,  H01L33/38 ,  H01L33/387 ,  H01L33/40 ,  H01L33/486 ,  H01L33/502 ,  H01L33/54 ,  H01L33/56 ,  H01L2021/60 ,  H01L2221/6835 ,  H01L2221/68368 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/04105 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2101 ,  H01L2224/2105 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/2401 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/2413 ,  H01L2224/245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48095 ,  H01L2224/48101 ,  H01L2224/4813 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/821 ,  H01L2224/82106 ,  H01L2224/85947 ,  H01L2224/96 ,  H01L2924/0002 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2933/0016 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01079 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/00014 ,  H01L2224/82

Abstract: A light emitting device includes a semiconductor chip including a p-type semiconductor layer and an n-type semiconductor layer, the semiconductor chip being adapted to emit light between the p-type semiconductor layer and the n-type semiconductor layer; a p-side pad electrode disposed on an upper surface side of the semiconductor chip and over the p-type semiconductor layer; an n-side pad electrode disposed on an upper surface side of the semiconductor chip and over the n-type semiconductor layer; a resin layer disposed to cover the upper surface of the semiconductor chip; a p-side connection electrode and an n-side connection electrode disposed at an outer surface of the resin layer and positioned on the upper surface side of the semiconductor chip; and a metal wire disposed in the resin. The metal wire is adapted to make connection at least one of between the p-side pad electrode and the p-side connection electrode, and between the n-side pad electrode and the n-side connection electrode.

公开(公告)号：US20140227813A1

公开(公告)日：2014-08-14

申请号：US14177329

申请日：2014-02-11

Applicant: NICHIA CORPORATION

Inventor： Akinori YONEDA ,  Shinji NAKAMURA ,  Akiyoshi KINOUCHI ,  Yoshiyuki AIHARA ,  Hirokazu SASA

IPC: H01L21/78 ,  H01L33/00

CPC classification number: H01L33/387 ,  H01L33/0095 ,  H01L33/44 ,  H01L33/62

Abstract: A light emitting element for flip-chip mounting having a flat mounting surface which allows a decrease in the width of the streets of a wafer. In the light emitting element, the insulating member filling around the bumps and flattening the upper surface is formed with a margin of a region with a width which is equal to or larger than the width of the streets on the dividing lines, so that at the time of dividing the wafer along the dividing lines, the insulating member is not processed, which allows designing of the streets with a small width.

Abstract translation: 一种用于倒装芯片安装的发光元件，其具有平坦的安装表面，其允许晶片的街道宽度的减小。 在发光元件中，填充凸起并使上表面变平的绝缘构件形成有宽度等于或大于分界线上的街道宽度的区域的边缘，使得在 分割晶片沿着分割线的时间，绝缘构件不被处理，这允许以小的宽度设计街道。

公开(公告)号：US20240063348A1

公开(公告)日：2024-02-22

申请号：US18498351

申请日：2023-10-31

Applicant: NICHIA CORPORATION

Inventor： Shusaku BANDO ,  Hirokazu SASA

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/58

CPC classification number: H01L33/505 ,  H01L25/0753 ,  H01L33/58 ,  H01L2933/0058 ,  H01L2933/0041

Abstract: A method of manufacturing wavelength converting members includes: disposing masks having a rectangular shape in plan view on an upper surface of a wavelength converting substrate; singulating the substrate into workpieces, each including an upper surface and lateral surfaces, with a predetermined size and a rectangular shape in plan view such that the upper surface includes one of the masks and a portion of the substrate; aligning a predetermined number of the workpieces and disposing a light-shielding film on the lateral surfaces and the upper surface of each workpiece, and on the mask of each workpiece; removing the masks with portions of the light-shielding film on the masks, while maintaining a portion of the light-shielding film on the upper surfaces of the workpieces at portions surrounding the masks; and reducing a thickness of a portion of each workpiece where the mask has been removed.

公开(公告)号：US20170077373A1

公开(公告)日：2017-03-16

申请号：US15361630

申请日：2016-11-28

Applicant: NICHIA CORPORATION

Inventor： Ryo SUZUKI ,  Yoshikazu TAKEUCHI ,  Hirokazu SASA

IPC: H01L33/64 ,  H01L33/56 ,  H01L33/28 ,  H01L33/50 ,  H01L33/00 ,  H01L33/32 ,  H01L33/62 ,  H01L33/60

CPC classification number: H01L33/641 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/28 ,  H01L33/32 ,  H01L33/502 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A method for manufacturing a light emitting device includes preparing a light emitting element that includes a light transmissive substrate comprising a first main surface, a second main surface, and a side surface having a light transmitting part and a light absorbing part whose optical transmissivity is lower than that of the light transmitting part, and a semiconductor laminate that is provided to the first main surface of the light transmissive substrate, joining the light emitting element to an upper surface of a base body such that the base body is opposite to the side where the semiconductor laminate is provided, providing a support member that covers the side surface of the light emitting element and part of the base body, and removing the light absorbing part by thinning the light transmissive substrate from the second main surface side.

Abstract translation: 一种发光器件的制造方法，其特征在于，具备：准备包括透光性基板的发光元件，所述透光性基板包括第一主面，第二主面以及具有透光部的透光部和光透射率较低的光吸收部的侧面 与透光部的上表面接合，并且设置在透光性基板的第一主面上的半导体层叠体，将该发光元件与基体的上表面接合，使得基体与 提供半导体层叠体，提供覆盖发光元件的侧面和基体的一部分的支撑构件，并且通过使透光性基板从第二主面侧变薄来除去光吸收部。

公开(公告)号：US20170012174A1

公开(公告)日：2017-01-12

申请号：US15276449

申请日：2016-09-26

Applicant: NICHIA CORPORATION

Inventor： Akinori YONEDA ,  Shinji NAKAMURA ,  Akiyoshi KINOUCHI ,  Yoshiyuki AIHARA ,  Hirokazu SASA

IPC: H01L33/38 ,  H01L33/44 ,  H01L33/62

CPC classification number: H01L33/387 ,  H01L33/0095 ,  H01L33/44 ,  H01L33/62

Abstract: A light emitting element for flip-chip mounting having a flat mounting surface which allows a decrease in the width of the streets of a wafer. In the light emitting element, the insulating member filling around the bumps and flattening the upper surface is formed with a margin of a region with a width which is equal to or larger than the width of the streets on the dividing lines, so that at the time of dividing the wafer along the dividing lines, the insulating member is not processed, which allows designing of the streets with a small width.

Abstract translation: 一种用于倒装芯片安装的发光元件，其具有平坦的安装表面，其允许晶片的街道宽度的减小。 在发光元件中，填充凸起并使上表面变平的绝缘构件形成有宽度等于或大于分界线上的街道宽度的区域的边缘，使得在 分割晶片沿着分割线的时间，绝缘构件不被处理，这允许以小的宽度设计街道。

公开(公告)号：US20150333236A1

公开(公告)日：2015-11-19

申请号：US14808706

申请日：2015-07-24

Applicant: Nichia Corporation

Inventor： Akinori YONEDA ,  Shinji NAKAMURA ,  Yoshiyuki AIHARA ,  Hirokazu SASA

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/38 ,  H01L33/58 ,  H01L33/60

CPC classification number: H01L33/507 ,  H01L24/18 ,  H01L33/38 ,  H01L33/46 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L2924/12041 ,  H01L2924/15788 ,  H01L2933/005 ,  H01L2924/00

Abstract: To provide a method of manufacturing at low cost a light emitting device that converts the wavelength of light radiated by a light emitting element and emits, the method includes: forming a phosphor layer on a translucent substrate; arranging a plurality of light emitting elements with a predetermined spacing, the light emitting elements having an electrode formed face provided with positive and negative electrodes respectively and arranged with the electrode formed faces on the top; embedding a resin containing phosphor particles so that an upper face of the embedded resin does not bulge over a plane containing the electrode formed faces; and curing the resin, and then cutting and dividing the cured resin, the phosphor layer and the translucent substrate into a plurality of light emitting devices each including one or more of the light emitting elements.

Abstract translation: 为了提供低成本地制造发光装置的方法，该发光装置转换由发光元件辐射的光的波长并发射，所述方法包括：在透光性基板上形成荧光体层; 以规定的间隔配置多个发光元件，所述发光元件具有分别设置有正极和负极的电极形成面，并且将电极形成面布置在顶部; 包埋含有荧光体颗粒的树脂，使得嵌入树脂的上表面不会在包含电极形成面的平面上凸出; 并固化树脂，然后将固化树脂，荧光体层和透光性基板切割分割成多个发光器件，每个发光器件包括一个或多个发光元件。

公开(公告)号：US20150311410A1

公开(公告)日：2015-10-29

申请号：US14745120

申请日：2015-06-19

Applicant: NICHIA CORPORATION

Inventor： Akinori YONEDA ,  Akiyoshi KINOUCHI ,  Hisashi KASAI ,  Yoshiyuki AIHARA ,  Hirokazu SASA ,  Shinji NAKAMURA

IPC: H01L33/56 ,  H01L33/24 ,  H01L33/40 ,  H01L33/50 ,  H01L33/62

CPC classification number: H01L33/62 ,  H01L21/6835 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L24/85 ,  H01L24/96 ,  H01L33/24 ,  H01L33/38 ,  H01L33/387 ,  H01L33/40 ,  H01L33/486 ,  H01L33/502 ,  H01L33/54 ,  H01L33/56 ,  H01L2021/60 ,  H01L2221/6835 ,  H01L2221/68368 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/04105 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2101 ,  H01L2224/2105 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/2401 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/2413 ,  H01L2224/245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48095 ,  H01L2224/48101 ,  H01L2224/4813 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/821 ,  H01L2224/82106 ,  H01L2224/85947 ,  H01L2224/96 ,  H01L2924/0002 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2933/0016 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01079 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/00014 ,  H01L2224/82

Abstract: A light emitting device includes a semiconductor chip including a p-type semiconductor layer and an n-type semiconductor layer, the semiconductor chip being adapted to emit light between the p-type semiconductor layer and the n-type semiconductor layer; a p-side pad electrode disposed on an upper surface side of the semiconductor chip and over the p-type semiconductor layer; an n-side pad electrode disposed on an upper surface side of the semiconductor chip and over the n-type semiconductor layer; a resin layer disposed to cover the upper surface of the semiconductor chip; a p-side connection electrode and an n-side connection electrode disposed at an outer surface of the resin layer and positioned on the upper surface side of the semiconductor chip; and a metal wire disposed in the resin. The metal wire is adapted to make connection at least one of between the p-side pad electrode and the p-side connection electrode, and between the n-side pad electrode and the n-side connection electrode.

Abstract translation: 发光器件包括具有p型半导体层和n型半导体层的半导体芯片，该半导体芯片适于在p型半导体层和n型半导体层之间发光; p侧焊盘电极，设置在所述半导体芯片的上表面侧并且位于所述p型半导体层上方; 设置在所述半导体芯片的上表面侧并且位于所述n型半导体层上的n侧焊盘电极; 设置成覆盖半导体芯片的上表面的树脂层; p侧连接电极和n侧连接电极，设置在树脂层的外表面并位于半导体芯片的上表面侧; 以及设置在树脂中的金属线。 金属线适于连接p侧焊盘电极和p侧连接电极之间以及n侧焊盘电极和n侧连接电极之中的至少一个。