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公开(公告)号：US20160118548A1
公开(公告)日：2016-04-28
申请号：US14924714
申请日：2015-10-28
Applicant: NICHIA CORPORATION
Inventor： Hirofumi KAWAGUCHI , Akinori YONEDA , Kazuki KASHIMOTO
CPC classification number: H01L33/50 , H01L25/0753 , H01L33/38 , H01L33/56 , H01L2224/16225 , H01L2224/73253
Abstract: A light emitting device has a plurality of light emitting elements that are arranged with gaps between the devices on a mounting board in a first direction, a wavelength-conversion member that covers the plurality of light emitting elements, a light reflective resin. Each light emitting element has an n-type semiconductor layer, an active layer provided in a part of the n-type semiconductor layer, and a p-type semiconductor layer provided on the active layer. In a second direction which is perpendicular to the first direction, an n-side electrodes are provided at least in regions at both ends of the n-type semiconductor layer, and a p-side electrode is provided on the surface of the p-type semiconductor layer, and wherein in the second direction, the wavelength-conversion member is positioned to approximately align both sides with both active layer side faces, or to dispose its sides outward of the active layer side faces.
Abstract translation: 发光器件具有多个发光元件，其在第一方向上的安装板上的器件之间布置有间隙，覆盖多个发光元件的波长转换构件，光反射树脂。 每个发光元件具有n型半导体层，设置在n型半导体层的一部分中的有源层和设置在有源层上的p型半导体层。 在垂直于第一方向的第二方向上，至少在n型半导体层的两端的区域中设置n侧电极，在p型表面上设置p侧电极 半导体层，并且其中在所述第二方向上，所述波长转换构件被定位成将两侧与所述两个有源层侧面大致对准，或者将其侧面设置在所述有源层侧面的外侧。
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公开(公告)号：US20210273143A1
公开(公告)日：2021-09-02
申请号：US17179313
申请日：2021-02-18
Applicant: NICHIA CORPORATION
Inventor： Akinori YONEDA
Abstract: A wavelength-converting member includes a wavelength-converting layer, a heat-dissipating component, and a securing member. The wavelength-converting layer has an upper surface, a lower surface, and one or more lateral surfaces with each of the one or more lateral surfaces of the wavelength-converting layer defining an inclined surface inclined at an acute angle with respect to the lower surface of the wavelength-converting layer. The wavelength-converting layer includes a thermally conductive part, and a fluorescent material containing part in contact with the thermally conductive part. The wavelength-converting layer is mounted on the heat-dissipating component. The securing member is secured to the heat-dissipating component. The securing member presses the inclined surface of each of the one or more lateral surfaces such that the wavelength-converting layer is secured to the heat-dissipating component.
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公开(公告)号：US20180159007A1
公开(公告)日：2018-06-07
申请号：US15886656
申请日：2018-02-01
Applicant: NICHIA CORPORATION
Inventor： Akinori YONEDA , Yoshiyuki AIHARA
CPC classification number: H01L33/62 , H01L33/0095 , H01L33/38 , H01L33/486 , H01L33/507 , H01L33/52 , H01L33/54 , H01L2224/4813 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0066
Abstract: A method of manufacturing one or more light emitting devices includes: forming one or more emitting elements, each including a first conductive type semiconductor layer, a second conductive type semiconductor layer, a first electrode, and a second electrode, on a growth substrate; forming a first metal layer electrically connected to each first electrode, and a second metal layer electrically connected to each second electrode; forming a first resin layer covering the one or more light emitting elements so as to expose an upper surface of each first metal layer and an upper surface of each second metal layer; connecting a first wire to the upper surface of each first metal layer, and connecting a second wire to the upper surface of each second metal layer; and forming a second resin layer on the first resin layer so as to expose an end portion of each first wire and second wire.
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公开(公告)号：US20170012174A1
公开(公告)日：2017-01-12
申请号：US15276449
申请日：2016-09-26
Applicant: NICHIA CORPORATION
Inventor： Akinori YONEDA , Shinji NAKAMURA , Akiyoshi KINOUCHI , Yoshiyuki AIHARA , Hirokazu SASA
CPC classification number: H01L33/387 , H01L33/0095 , H01L33/44 , H01L33/62
Abstract: A light emitting element for flip-chip mounting having a flat mounting surface which allows a decrease in the width of the streets of a wafer. In the light emitting element, the insulating member filling around the bumps and flattening the upper surface is formed with a margin of a region with a width which is equal to or larger than the width of the streets on the dividing lines, so that at the time of dividing the wafer along the dividing lines, the insulating member is not processed, which allows designing of the streets with a small width.
Abstract translation: 一种用于倒装芯片安装的发光元件，其具有平坦的安装表面，其允许晶片的街道宽度的减小。 在发光元件中，填充凸起并使上表面变平的绝缘构件形成有宽度等于或大于分界线上的街道宽度的区域的边缘，使得在 分割晶片沿着分割线的时间，绝缘构件不被处理，这允许以小的宽度设计街道。
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5.发明申请公开(公告)号：US20160284940A1
公开(公告)日：2016-09-29
申请号：US15173013
申请日：2016-06-03
Applicant: NICHIA CORPORATION
Inventor： Hirofumi KAWAGUCHI , Akinori YONEDA , Hisashi KASAI , Kazuki KASHIMOTO , Masafumi ITASAKA
CPC classification number: H01L33/405 , H01L33/36 , H01L33/38 , H01L33/382 , H01L33/42 , H01L2933/0016
Abstract: A semiconductor light emitting element having: a semiconductor laminated body; a full surface electrode containing an Ag provided on an upper surface of the p-type semiconductor layer; a cover electrode that covers a surface of the full surface electrode, is provided to contact on the upper surface of the p-type semiconductor layer at an outer edge of the full surface electrode, and is made of an Al-based metal material; a p-side electrode that is provided on a portion of a surface of the cover electrode; a metal oxide film that covers other surfaces of the cover electrode and contains an oxide of a metal material forming the cover electrode; and an insulation film that is made of an oxide and covers a surface of the metal oxide film, is provided.
Abstract translation: 一种半导体发光元件，具有：半导体层叠体; 包含设置在p型半导体层的上表面上的Ag的全表面电极; 覆盖全表面电极的表面的覆盖电极设置成在全表面电极的外边缘处与p型半导体层的上表面接触，并由Al基金属材料制成; p侧电极，设置在所述盖电极的表面的一部分上; 覆盖所述覆盖电极的其他表面并且包含形成所述覆盖电极的金属材料的氧化物的金属氧化物膜; 并且提供由氧化物制成并覆盖金属氧化物膜的表面的绝缘膜。
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Patent Agency Ranking
公开(公告)号：US20170271559A1
公开(公告)日：2017-09-21
申请号：US15614233
申请日：2017-06-05
Applicant: NICHIA CORPORATION
Inventor： Akinori YONEDA , Yoshiyuki AIHARA , Shinji NAKAMURA , Akiyoshi KINOUCHI , Kazuki KASHIMOTO , Kazuyuki AKAISHI
CPC classification number: H01L33/385 , H01L33/387 , H01L33/405 , H01L33/486 , H01L33/54 , H01L33/62
Abstract: A side-view type light emitting device has a bottom surface thereof as a light emission surface and a first lateral surface thereof as a mounting surface for mounting on a mounting substrate, and includes a semiconductor layered structure including a first semiconductor layer, an active layer and a second semiconductor layer; a first connecting electrode exposed from the first lateral surface and electrically connected to the first semiconductor layer; a first electrode disposed between the first semiconductor layer and the first connecting electrode; a second connecting electrode exposed from the first lateral surface; a metal wire electrically connecting an upper surface of the second semiconductor layer to the second connecting electrode; and a resin layer. In a direction perpendicular to the light emission surface, the active layer does not overlap with the first connecting electrode, and the active layer does not overlap with the second connecting electrode.
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公开(公告)号：US20160365498A1
公开(公告)日：2016-12-15
申请号：US15247188
申请日：2016-08-25
Applicant: NICHIA CORPORATION
Inventor： Akinori YONEDA , Akiyoshi KINOUCHI , Hisashi KASAI , Yoshiyuki AIHARA , Hirokazu SASA , Shinji NAKAMURA
CPC classification number: H01L33/62 , H01L21/6835 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/45 , H01L24/48 , H01L24/82 , H01L24/85 , H01L24/96 , H01L33/24 , H01L33/38 , H01L33/387 , H01L33/40 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L2021/60 , H01L2221/6835 , H01L2221/68368 , H01L2221/68372 , H01L2221/68381 , H01L2221/68386 , H01L2224/04105 , H01L2224/05644 , H01L2224/05647 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/2101 , H01L2224/2105 , H01L2224/211 , H01L2224/215 , H01L2224/2401 , H01L2224/24011 , H01L2224/2405 , H01L2224/2413 , H01L2224/245 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48095 , H01L2224/48101 , H01L2224/4813 , H01L2224/48644 , H01L2224/48647 , H01L2224/48844 , H01L2224/48847 , H01L2224/821 , H01L2224/82106 , H01L2224/85947 , H01L2224/96 , H01L2924/0002 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/3511 , H01L2933/0016 , H01L2933/005 , H01L2933/0066 , H01L2924/00 , H01L2924/00012 , H01L2924/014 , H01L2924/01079 , H01L2924/01047 , H01L2924/01029 , H01L2924/0105 , H01L2924/00014 , H01L2224/82
Abstract: A light emitting device includes a semiconductor chip including a p-type semiconductor layer and an n-type semiconductor layer, the semiconductor chip being adapted to emit light between the p-type semiconductor layer and the n-type semiconductor layer; a p-side pad electrode disposed on an upper surface side of the semiconductor chip and over the p-type semiconductor layer; an n-side pad electrode disposed on an upper surface side of the semiconductor chip and over the n-type semiconductor layer; a resin layer disposed to cover the upper surface of the semiconductor chip; a p-side connection electrode and an n-side connection electrode disposed at an outer surface of the resin layer and positioned on the upper surface side of the semiconductor chip; and a metal wire disposed in the resin. The metal wire is adapted to make connection at least one of between the p-side pad electrode and the p-side connection electrode, and between the n-side pad electrode and the n-side connection electrode.
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公开(公告)号：US20160064621A1
公开(公告)日：2016-03-03
申请号：US14838255
申请日：2015-08-27
Applicant: Nichia Corporation
Inventor： Akinori YONEDA , Yoshiyuki AIHARA
CPC classification number: H01L33/0079 , H01L33/382 , H01L33/504 , H01L2224/18 , H01L2933/0041 , H01L2933/0066
Abstract: A method of manufacturing a light emitting device includes providing a wafer having a substrate and a plurality of semiconductor stacked-layer bodies stacked on the substrate, an upper surface of the substrate being exposed at an outer peripheral region of each of the plurality of semiconductor stack bodies in a plan view, forming a separation layer integrally covering the upper surface of the substrate and an upper surface of the semiconductor stacked-layer body, the separation layer including a separation boundary, forming a support member on the separation layer, removing the substrate, forming a wavelength conversion layer on a side of the semiconductor stack body and the separation layer where the substrate is removed, the wavelength conversion layer made of a resin containing a wavelength conversion member, and removing the wavelength conversion layer located in the outer peripheral region by separating the separation layer at the separation boundary.
Abstract translation: 一种制造发光器件的方法包括提供具有衬底的晶片和堆叠在衬底上的多个半导体叠层体，衬底的上表面暴露在多个半导体叠层中的每一个的外周区域 主体，形成一体地覆盖基板的上表面的分离层和半导体层叠体的上表面，分离层包括分离边界，在分离层上形成支撑部件，除去基板 在半导体堆叠体的一侧形成波长转换层，除去衬底的分离层，由包含波长转换构件的树脂制成的波长转换层，以及去除位于外围区域中的波长转换层 通过在分离边界处分离分离层。
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公开(公告)号：US20150295152A1
公开(公告)日：2015-10-15
申请号：US14683164
申请日：2015-04-10
Applicant: NICHIA CORPORATION
Inventor： Akinori YONEDA , Yoshiyuki AIHARA , Shinji NAKAMURA
CPC classification number: H01L33/62 , H01L33/0095 , H01L33/54 , H01L2224/94 , H01L2933/0033
Abstract: A light emitting device includes a semiconductor light emitting element, a resin layer, and a metal wire. The semiconductor light emitting element includes a semiconductor stack and an electrode. The semiconductor stack has one surface. The metal wire has a first surface, a second surface opposite to the first surface, and an end surface between the first surface and the second surface. The metal wire is provided in the resin layer and electrically connected to an upper surface of the electrode via the first surface. The end surface of the metal wire is exposed from the resin layer. A lower end of the end surface closest to the first surface of the metal wire that is exposed from the resin layer is provided at an opposite side of the one surface of the semiconductor stack with respect to the upper surface of the electrode.
Abstract translation: 发光器件包括半导体发光元件，树脂层和金属线。 半导体发光元件包括半导体叠层和电极。 半导体堆叠具有一个表面。 金属线具有第一表面，与第一表面相对的第二表面，以及在第一表面和第二表面之间的端面。 金属线设置在树脂层中，并且经由第一表面电连接到电极的上表面。 金属线的端面从树脂层露出。 在半导体堆叠的一个表面相对于电极的上表面的相反侧设置从树脂层露出的最靠近金属线的第一表面的端面的下端。
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公开(公告)号：US20150060934A1
公开(公告)日：2015-03-05
申请号：US14477617
申请日：2014-09-04
Applicant: Nichia Corporation
Inventor： Akinori YONEDA , Yoshiyuki AIHARA , Shinji NAKAMURA , Akiyoshi KINOUCHI , Kazuki KASHIMOTO , Kazuyuki AKAISHI
CPC classification number: H01L33/385 , H01L33/387 , H01L33/405 , H01L33/486 , H01L33/54 , H01L33/62
Abstract: A side-view type light emitting device having a bottom surface thereof as a light emission surface and one side surface thereof as amounting surface for mounting on amounting substrate includes a stacked semiconductor layer having a first semiconductor layer, an active layer, and a second semiconductor layer which are stacked in that order from a side of the bottom surface; a first connecting electrode exposed from the one side surface and electrically connected to the first semiconductor layer; a metal wire having one end thereof electrically connected to an upper surface of the second semiconductor layer; a second connecting electrode exposed from the one side surface and electrically connected to the other end of the metal wire; and a resin layer which covers at least a part of each of the first semiconductor layer, the second semiconductor layer, the first connecting electrode, the second connecting electrode and the metal wire and which is configured to form an upper surface and side surfaces of the light emitting device.
Abstract translation: 将其底表面作为发光面的侧视型发光器件和作为用于安装在数量基片上的表面的一个侧面包括具有第一半导体层，有源层和第二半导体的叠层半导体层 层，其从该底面的一侧依次层叠; 从所述一个侧表面暴露并电连接到所述第一半导体层的第一连接电极; 金属线，其一端电连接到第二半导体层的上表面; 从所述一个侧表面暴露并且电连接到所述金属线的另一端的第二连接电极; 以及树脂层，其覆盖第一半导体层，第二半导体层，第一连接电极，第二连接电极和金属线中的每一个的至少一部分，并且被配置为形成上表面和 发光装置。
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