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公开(公告)号：US11729483B2
公开(公告)日：2023-08-15
申请号：US17829721
申请日：2022-06-01
发明人： Mingzhu Wang , Zhenyu Chen , Zhongyu Luan , Zhen Huang , Nan Guo , Fengsheng Xi , Takehiko Tanaka , Bojie Zhao , Heng Jiang , Ye Wu , Zilong Deng
CPC分类号： H04N23/54 , H04N23/55 , H05K1/0274 , H05K2201/10121
摘要： A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.
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公开(公告)号：US11653079B2
公开(公告)日：2023-05-16
申请号：US16472405
申请日：2017-12-25
发明人： Mingzhu Wang , Nan Guo , Zhenyu Chen , Bojie Zhao , Takehiko Tanaka , Feifan Chen , Ye Wu
CPC分类号： H04N5/2257 , G01N15/0656 , G03B17/02 , H04M1/0264 , H04N5/2253 , H04N5/2254
摘要： The present disclosure provides a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device with the camera module, wherein the circuit board assembly comprises at least one electronic component, a substrate, and a molding unit. At least one of the electronic components is connected to the substrate conductively on a back face of the substrate. The molding unit comprises a back molding portion and a molding base, wherein the molding base is bonded to a front face of the substrate integrally when the back molding portion is bonded to at least a part of an area of the back face of the substrate integrally. There may be no need to reserve a position on the front face of the substrate to conductively connect the electronic components, so that the length and width of the camera module can be reduced, thereby reducing the volume of the camera module.
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公开(公告)号：US10771666B2
公开(公告)日：2020-09-08
申请号：US15780534
申请日：2016-12-01
发明人： Mingzhu Wang , Baozhong Zhang , Zhen Huang , Feifan Chen , Nan Guo , Zhenyu Chen , Ye Wu
摘要： The present disclosure provides a camera module and an electrical bracket thereof. The electrical bracket is provided with a clear aperture. The electrical bracket not only has the functions of a conventional circuit board (conduction of the electrical signal of an electronic device such as a chip and a motor), but also has the effects of a conventional base to support an optical filter and serve as a motor base bracket.
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公开(公告)号：US10412278B2
公开(公告)日：2019-09-10
申请号：US15057063
申请日：2016-02-29
发明人： Mingzhu Wang , Bojie Zhao , Feifan Chen , Liang Ding , Nan Guo , Ye Wu , Heng Jiang
IPC分类号： H04N5/225
摘要： A camera module includes an optical lens, a photosensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.
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