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公开(公告)号：US11627239B2
公开(公告)日：2023-04-11
申请号：US17540642
申请日：2021-12-02
发明人： Mingzhu Wang , Zhenyu Chen , Takehiko Tanaka , Zhongyu Luan , Bojie Zhao , Zhen Huang , Nan Guo , Fengsheng Xi , Heng Jiang , Zilong Deng
IPC分类号： H04N5/225
摘要： A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.
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公开(公告)号：US09998644B1
公开(公告)日：2018-06-12
申请号：US15460227
申请日：2017-03-15
发明人： Mingzhu Wang , Zhenyu Chen , Nan Guo , Takehiko Tanaka , Bojie Zhao , Zilong Deng
CPC分类号： H04N5/2253 , H04N5/2254 , H04N5/2257 , H05K1/0274 , H05K1/181 , H05K1/185 , H05K3/0014 , H05K3/284 , H05K3/301 , H05K3/32 , H05K5/0073 , H05K2201/10121 , H05K2201/10151 , H05K2203/1316
摘要： A camera module and its molded circuit board assembly and manufacturing method are disclosed, wherein the molded circuit board assembly includes a circuit board and a molded base integrally formed with the circuit board through a molding process. The molded base forms a light window disposed corresponding to a photosensitive element of the camera module, wherein the light window is configured to have a trapezoidal or to multi-stair trapezoidal shape cross section which has diameters increasing from bottom to top to facilitate demolding, so as to prevent damage to the molded base, and to avoid stray light.
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公开(公告)号：US11729483B2
公开(公告)日：2023-08-15
申请号：US17829721
申请日：2022-06-01
发明人： Mingzhu Wang , Zhenyu Chen , Zhongyu Luan , Zhen Huang , Nan Guo , Fengsheng Xi , Takehiko Tanaka , Bojie Zhao , Heng Jiang , Ye Wu , Zilong Deng
CPC分类号： H04N23/54 , H04N23/55 , H05K1/0274 , H05K2201/10121
摘要： A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.
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公开(公告)号：US11575816B2
公开(公告)日：2023-02-07
申请号：US17824415
申请日：2022-05-25
发明人： Mingzhu Wang , Zhenyu Chen , Nan Guo , Takehiko Tanaka , Bojie Zhao , Zilong Deng
IPC分类号： B29K101/12 , H04N5/225 , B29C45/14 , B29C33/44 , G02B19/00 , G02B7/10 , B29C70/72 , B29C70/88 , G02B13/00 , H05K1/02 , H05K1/18 , H05K3/28 , B29C43/18 , B29C43/36 , B29C43/52 , G02B7/02 , B29L31/34 , B29C45/40 , B29C45/00 , B29D11/00 , B29L31/00
摘要： A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.
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公开(公告)号：US11477354B2
公开(公告)日：2022-10-18
申请号：US16842784
申请日：2020-04-08
发明人： Mingzhu Wang , Zhenyu Chen , Nan Guo , Takehiko Tanaka , Bojie Zhao , Zilong Deng
摘要： A camera module and its molded circuit board assembly and manufacturing method are disclosed, wherein the molded circuit board assembly includes a circuit board and a molded base integrally formed with the circuit board through a molding process. The molded base forms a light window disposed corresponding to a photosensitive element of the camera module, wherein the light window is configured to have a trapezoidal or to multi-stair trapezoidal shape cross section which has diameters increasing from bottom to top to facilitate demoulding, so as to prevent damage to the molded base, and to avoid stray light.
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公开(公告)号：US10666847B2
公开(公告)日：2020-05-26
申请号：US16157061
申请日：2018-10-10
发明人： Mingzhu Wang , Zhenyu Chen , Nan Guo , Takehiko Tanaka , Bojie Zhao , Zilong Deng
IPC分类号： H04N5/225 , B29C45/14 , B29C33/44 , G02B19/00 , G02B7/10 , B29C70/72 , B29C70/88 , G02B13/00 , H05K1/02 , H05K1/18 , H05K3/28 , B29C43/18 , B29C43/36 , B29C43/52 , G02B7/02 , B29L31/34 , B29C45/40 , B29C45/00 , B29D11/00 , B29L31/00 , B29K101/12
摘要： A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.
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公开(公告)号：US11388320B2
公开(公告)日：2022-07-12
申请号：US16322946
申请日：2017-06-02
发明人： Mingzhu Wang , Zhenyu Chen , Zhongyu Luan , Zhen Huang , Nan Guo , Fengsheng Xi , Takehiko Tanaka , Bojie Zhao , Heng Jiang , Ye Wu , Zilong Deng
摘要： A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.
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公开(公告)号：US10659664B2
公开(公告)日：2020-05-19
申请号：US15387613
申请日：2016-12-21
发明人： Mingzhu Wang , Zhenyu Chen , Nan Guo , Takehiko Tanaka , Bojie Zhao , Zilong Deng
摘要： A camera module and its molded circuit board assembly and manufacturing method are disclosed, wherein the molded circuit board assembly includes a circuit board and a molded base integrally formed with the circuit board through a molding process. The molded base forms a light window disposed corresponding to a photosensitive element of the camera module, wherein the light window is configured to have a trapezoidal or multi-stair trapezoidal shape cross section which has diameters increasing from bottom to top to facilitate demoulding, so as to prevent damage to the molded base, and to avoid stray light.
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公开(公告)号：US10582097B2
公开(公告)日：2020-03-03
申请号：US16392595
申请日：2019-04-23
发明人： Mingzhu Wang , Zhenyu Chen , Takehiko Tanaka , Zhongyu Luan , Bojie Zhao , Zhen Huang , Nan Guo , Fengsheng Xi , Heng Jiang , Zilong Deng
IPC分类号： H04N5/225
摘要： A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.
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公开(公告)号：US10171716B2
公开(公告)日：2019-01-01
申请号：US15461402
申请日：2017-03-16
发明人： Mingzhu Wang , Zhenyu Chen , Nan Guo , Takehiko Tanaka , Bojie Zhao , Zilong Deng
IPC分类号： H04N5/225 , H05K3/28 , H05K1/02 , G02B7/10 , B29C70/72 , B29C70/88 , G02B13/00 , H05K1/18 , B29C43/18 , B29C43/36 , B29C43/52 , G02B7/02 , B29C45/14 , B29D11/00 , B29L31/00 , B29K101/12 , B29L31/34
摘要： A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demolding and avoiding stray lights.
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