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公开(公告)号：US11570336B2
公开(公告)日：2023-01-31
申请号：US17242211
申请日：2021-04-27
发明人： Mingzhu Wang , Bojie Zhao , Feifan Chen , Liang Ding , Nan Guo , Ye Wu , Heng Jiang
IPC分类号： H04N5/225 , H01L27/146
摘要： A camera module includes an optical lens, a light-sensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.
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公开(公告)号：US10250788B2
公开(公告)日：2019-04-02
申请号：US15127412
申请日：2014-05-13
发明人： Baozhong Zhang , Bojie Zhao , Ye Wu , Wei Guo
摘要： A camera module includes an optical lens unit and a light sensing unit. The light sensing unit is provided along a light outgoing path of the optical lens unit so that the light sensing unit is able to sense light emitted from the optical lens unit. The light sensing unit further includes a photoelectric converting element and a conducting unit connected to the photoelectric converting element. The conducting unit transfers electrical signals converted and generated during operation of the photoelectric converting element, and conducts heat generated during operation of the photoelectric converting element outside.
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公开(公告)号：US11646332B2
公开(公告)日：2023-05-09
申请号：US16954724
申请日：2018-12-18
发明人： Takehiko Tanaka , Bojie Zhao , Ye Wu , Zhewen Mei , Mingzhu Wang
IPC分类号： H01L27/146 , H04N5/225
CPC分类号： H01L27/14618 , H01L27/14636 , H01L27/14687 , H04N5/2252 , H04N5/2253 , H04N5/2257
摘要： A photosensitive assembly includes a circuit board, a photosensitive element mounted on the circuit board and including a first edge, a first metal wire electrically connecting the photosensitive element and the circuit board and spanning the first edge, a first electronic element mounted on the circuit board and having a mounting area corresponding to an extension line of the first edge, and a molding portion formed on the circuit board, surrounding the photosensitive element, extending to the photosensitive element, covering the first electronic element and the first metal wire, and contacting with a surface of the photosensitive element. Also included are a corresponding camera module, a photosensitive assembly jointed panel and a manufacturing method thereof. The damage risk of a gold wire in a molding process can be reduced to a certain extent without adding additional components and changing a die.
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公开(公告)号：US11049898B2
公开(公告)日：2021-06-29
申请号：US15617843
申请日：2017-06-08
发明人： Mingzhu Wang , Nan Guo , Jingfei He , Zhenyu Chen , Bojie Zhao , Takehiko Tanaka , Feifan Chen , Ye Wu , Zhen Huang , Zhongyu Luan
摘要： A method for manufacturing semiconductor modules for image-sensing devices is disclosed. The method may comprise applying a removable layer on a first surface of a printed circuit board (PCB) which comprises a plurality of PCB units; mounting a photosensitive member to a second surface of each of the PCB units; and encapsulating the photosensitive member with an encapsulation layer on each PCB unit. Each PCB unit may comprise at least a semiconductor component on a second surface of the PCB and one or more opening across the first surface and the second surface. The photosensitive member and the removable layer separate the one or more opening from outside, and the photosensitive member is positioned to receive light through the opening. At least one semiconductor component is also encapsulated by the encapsulation layer on each PCB unit.
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公开(公告)号：US20180286913A1
公开(公告)日：2018-10-04
申请号：US15617843
申请日：2017-06-08
发明人： Mingzhu Wang , Nan Guo , Jingfei He , Zhenyu Chen , Bojie Zhao , Takehiko Tanaka , Feifan Chen , Ye Wu , Zhen Huang , Zhongyu Luan
摘要： A method for manufacturing semiconductor modules for image-sensing devices is disclosed. The method may comprise applying a removable layer on a first surface of a printed circuit board (PCB) which comprises a plurality of PCB units; mounting a photosensitive member to a second surface of each of the PCB units; and encapsulating the photosensitive member with an encapsulation layer on each PCB unit. Each PCB unit may comprise at least a semiconductor component on a second surface of the PCB and one or more opening across the first surface and the second surface. The photosensitive member and the removable layer separate the one or more opening from outside, and the photosensitive member is positioned to receive light through the opening. At least one semiconductor component is also encapsulated by the encapsulation layer on each PCB unit.
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公开(公告)号：US11652132B2
公开(公告)日：2023-05-16
申请号：US17345929
申请日：2021-06-11
发明人： Mingzhu Wang , Nan Guo , Jingfei He , Zhenyu Chen , Bojie Zhao , Takehiko Tanaka , Feifan Chen , Ye Wu , Zhen Huang , Zhongyu Luan
CPC分类号： H01L27/14683 , H01L27/14618 , H04N23/55 , H05K1/0274 , H05K1/181 , H05K3/0052 , H05K3/284 , H04N23/57 , H05K2201/10121 , H05K2201/10151 , H05K2203/1316
摘要： A method for manufacturing semiconductor modules for image-sensing devices is disclosed. The method may comprise applying a removable layer on a first surface of a printed circuit board (PCB) which comprises a plurality of PCB units; mounting a photosensitive member to a second surface of each of the PCB units; and encapsulating the photosensitive member with an encapsulation layer on each PCB unit. Each PCB unit may comprise at least a semiconductor component on a second surface of the PCB and one or more opening across the first surface and the second surface. The photosensitive member and the removable layer separate the one or more opening from outside, and the photosensitive member is positioned to receive light through the opening. At least one semiconductor component is also encapsulated by the encapsulation layer on each PCB unit.
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公开(公告)号：US11388320B2
公开(公告)日：2022-07-12
申请号：US16322946
申请日：2017-06-02
发明人： Mingzhu Wang , Zhenyu Chen , Zhongyu Luan , Zhen Huang , Nan Guo , Fengsheng Xi , Takehiko Tanaka , Bojie Zhao , Heng Jiang , Ye Wu , Zilong Deng
摘要： A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.
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公开(公告)号：US20210305308A1
公开(公告)日：2021-09-30
申请号：US17345929
申请日：2021-06-11
发明人： Mingzhu Wang , Nan Guo , Jingfei He , Zhenyu Chen , Bojie Zhao , Takehiko Tanaka , Feifan Chen , Ye Wu , Zhen Huang , Zhongyu Luan
摘要： A method for manufacturing semiconductor modules for image-sensing devices is disclosed. The method may comprise applying a removable layer on a first surface of a printed circuit board (PCB) which comprises a plurality of PCB units; mounting a photosensitive member to a second surface of each of the PCB units; and encapsulating the photosensitive member with an encapsulation layer on each PCB unit. Each PCB unit may comprise at least a semiconductor component on a second surface of the PCB and one or more opening across the first surface and the second surface. The photosensitive member and the removable layer separate the one or more opening from outside, and the photosensitive member is positioned to receive light through the opening. At least one semiconductor component is also encapsulated by the encapsulation layer on each PCB unit.
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公开(公告)号：US11025805B2
公开(公告)日：2021-06-01
申请号：US16458164
申请日：2019-06-30
发明人： Mingzhu Wang , Bojie Zhao , Feifan Chen , Liang Ding , Nan Guo , Ye Wu , Heng Jiang
IPC分类号： H04N5/225 , H01L27/146
摘要： A camera module includes an optical lens, a photosensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.
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公开(公告)号：US12041335B2
公开(公告)日：2024-07-16
申请号：US17986436
申请日：2022-11-14
发明人： Mingzhu Wang , Nan Guo , Zhenyu Chen , Bojie Zhao , Takehiko Tanaka , Feifan Chen , Ye Wu
CPC分类号： H04N23/57 , G01N15/0656 , G03B17/02 , H04M1/0264 , H04N23/54 , H04N23/55
摘要： The present disclosure provides a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device with the camera module, wherein the circuit board assembly comprises at least one electronic component, a substrate, and a molding unit. At least one of the electronic components is connected to the substrate conductively on a back face of the substrate. The molding unit comprises a back molding portion and a molding base, wherein the molding base is bonded to a front face of the substrate integrally when the back molding portion is bonded to at least a part of an area of the back face of the substrate integrally. There may be no need to reserve a position on the front face of the substrate to conductively connect the electronic components, so that the length and width of the camera module can be reduced, thereby reducing the volume of the camera module.
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