Abstract:
Systems and methods for controlling adhesive application are disclosed. The systems and methods may include a controller and one or more sensors configured to measure an amount of adhesive applied to a plurality of substrates by a pump, detect a number of the substrates, determine an amount of adhesive applied per substrate, compare the adhesive applied per substrate to a target value, and adjust a pressure of the pump based on the comparison. The sensor(s) may include one or more of a valve sensor coupled to an adhesive supply, a flow rate sensor coupled to a manifold, a flow rate sensor coupled to one or more hoses, and a flow rate sensors coupled to a gun.
Abstract:
An adhesive dispensing system includes a pump and at least one sensor positioned to sense movements of a component of the pump and produce signals based on the sensed movements. The dispensing system also includes a controller communicating with the at least one sensor to collect information regarding operational cycles of the pump based on the signals. As a result, one or more diagnostic processes are enabled at the controller during operation of the adhesive dispensing system. These diagnostic processes may include a leak rate test for the dispensing system, an overspeed detection test for the pump, and expected life cycle monitoring of the pump or other components.
Abstract:
An adhesive dispensing system is configured to automatically reduce the temperature of adhesive material to reduce degradation of the adhesive caused by holding the adhesive at an application temperature during periods of low throughput. To this end, a controller of the system operates a heater unit to maintain a unit set point temperature to heat and melt adhesive until a set threshold time has elapsed since the most recent supply of adhesive to the system by a fill system. Once the time elapsed since the most recent supply of adhesive exceeds the set threshold time, the heater unit is reduced in temperature to reduce the temperature of adhesive. This reduction is temperature is large enough to minimize degradation and outgassing but small enough to enable rapid warm-up times after a new supply of adhesive occurs.
Abstract:
An adhesive dispensing system includes a pump and at least one sensor positioned to sense movements of a component of the pump and produce signals based on the sensed movements. The dispensing system also includes a controller operating the pump and communicating with the at least one sensor to collect information regarding operational cycles of the pump based on the signals. As a result, one or more diagnostic processes are enabled at the controller during operation of the adhesive dispensing system. These diagnostic processes may include a leak rate test for the dispensing system, an overspeed detection test for the pump, and expected life cycle monitoring of the pump or other components.
Abstract:
Systems and methods for controlling adhesive application are disclosed. The systems and methods may include a controller and one or more sensors configured to measure an amount of adhesive applied to a plurality of substrates by a pump, detect a number of the substrates, determine an amount of adhesive applied per substrate, compare the adhesive applied per substrate to a target value, and adjust a pressure of the pump based on the comparison. The sensor(s) may include one or more of a valve sensor coupled to an adhesive supply, a flow rate sensor coupled to a manifold, a flow rate sensor coupled to one or more hoses, and a flow rate sensors coupled to a gun.
Abstract:
A melter melts particulate hot melt adhesive into a liquefied form. The melter includes a heated receiving device having an interior with an inlet that receives the particulate hot melt adhesive and an outlet. The heated receiving device melts the particulate hot melt adhesive and directs the liquified hot melt adhesive to the outlet. A prepackaged container holds a supply of the particulate hot melt adhesive and includes an outlet. A particulate hot melt adhesive feed device allows the particulate hot melt adhesive to be directed from the outlet of the prepackaged container to the inlet of the heated receiving device.
Abstract:
A flexible bag system can dispense particulate hot melt adhesive. The flexible bag system includes an articulation device in contact with the flexible bag body and manipulates the flexible bag body to maintain fluidity of the particulate hot melt adhesive out of the outlet. A system for supplying particulate hot melt adhesive is also disclosed. The system includes an outer housing, a flexible inner housing disposed inside the outer housing that receives the particulate hot melt adhesive, a transfer opening disposed inside the flexible inner housing and through which the particulate hot melt adhesive is transferred, and an agitator in contact with the flexible inner housing, where the agitator applies a lateral force to a surface of the flexible inner housing.
Abstract:
An adhesive dispensing device includes a heater unit for melting adhesive, a fill system communicating with a receiving space for feeding the heater unit, and a reservoir for receiving melted adhesive from the heater unit. The dispensing device also includes a capacitive level sensor located along a sidewall of the receiving space such that the level of adhesive in the receiving space can be detected by sensing the difference in dielectric capacitance where the adhesive is located compared to where air acts as the dielectric. The size of the driven electrode produces a broader sensing window capable of generating multiple control signals corresponding to different fill levels of adhesive. The receiving space and reservoir are minimized in size so that adhesive is not held at elevated temperatures long enough to char or degrade.
Abstract:
An adhesive dispensing system is configured to automatically reduce the temperature of adhesive material to reduce degradation of the adhesive caused by holding the adhesive at an application temperature during periods of low throughput. To this end, a controller of the system operates a heater unit to maintain a unit set point temperature to heat and melt adhesive until a set threshold time has elapsed since the most recent supply of adhesive to the system by a fill system. Once the time elapsed since the most recent supply of adhesive exceeds the set threshold time, the heater unit is reduced in temperature to reduce the temperature of adhesive. This reduction is temperature is large enough to minimize degradation and outgassing but small enough to enable rapid warm-up times after a new supply of adhesive occurs.
Abstract:
A dispensing system includes a hot melt unit delivering heated adhesive through a hose to at least one dispenser gun, which is actuated by an outside source of gun actuation. Rather than directly connecting the source of gun actuation to the dispenser gun, the source of gun actuation is connected to the hot melt unit and then to the dispenser gun. For example, the gun actuation signals may be terminated at a terminal block in the hot melt unit, which enables the hot melt unit to monitor the gun actuation signals. The dispensing system is operable to perform various diagnostics pertaining to the dispenser gun and the system as a whole based on these monitored gun actuation signals.