Airflow in a card-based computing device

    公开(公告)号:US12177961B2

    公开(公告)日:2024-12-24

    申请号:US17971474

    申请日:2022-10-21

    Abstract: According to various embodiments, a processing subsystem includes: a processor mounted on a first printed circuit board that is oriented parallel to a first plane; a heat sink thermally coupled to the processor; a second printed circuit board that is communicatively coupled to the first printed circuit board and oriented parallel to a second plane, wherein the second plane is not parallel with the first plane; and at least one cooling fan that is positioned to direct a cooling fluid through the heat sink in a direction parallel to the first plane.

    Blow-through axial fan for a graphics processing unit

    公开(公告)号:US11681340B2

    公开(公告)日:2023-06-20

    申请号:US17121565

    申请日:2020-12-14

    CPC classification number: G06F1/20 H05K7/2039 H05K7/20154 G06F2200/201

    Abstract: A graphics subsystem includes a printed circuit board (PCB), a set of one or more fans, and a heat sink. A graphics processing unit (GPU) is integrated into the PCB. The PCB is shortened to occupy a portion of the width of the graphics subsystem. The heat sink is coupled to the PCB and/or GPU and configured to extend beyond an edge of the PCB, thereby occupying a larger portion of the width of the graphics subsystem compared to the PCB. A first fan is disposed partially or fully beyond the edge of the PCB and is configured to direct air through the portion of the heat sink that extends beyond the edge of the PCB, along a first airflow path, and out of the graphics subsystem. A second fan is configured to direct air through the heat sink, along a second airflow path, towards the GPU.

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