公开(公告)号：US12298825B2

公开(公告)日：2025-05-13

申请号：US16653095

申请日：2019-10-15

Applicant: Nvidia Corporation

Inventor： Qi Lin ,  David Haley ,  Chad Plummer ,  Hans Schulze ,  Darryl Moore

IPC: G06F1/20 ,  G01K7/42 ,  G01M99/00 ,  G05B19/404 ,  H05K7/20

Abstract: The disclosure provides a cooling solution that evaluates the thermal environment of a computer component based on transient thermal responses of the computer component. The transient thermal responses are generated by measuring the temperature rise of the computer component over a designated amount of time for multiple “good” assemblies and multiple “bad” assemblies to determine a duration and allowable temperature rise needed to set a pass/fail criteria for different failure modes of cooling devices. A cooling device may not be operating as designed due to damage, needed maintenance, missing thermal interface material (TIM), improper installation, etc. From the transient thermal responses, a thermal problem, such as a malfunctioning fan, can be determined and a corrective action can be performed.

公开(公告)号：US12177961B2

公开(公告)日：2024-12-24

申请号：US17971474

申请日：2022-10-21

Applicant: NVIDIA CORPORATION

Inventor： Xiang Sun ,  Andrew Bell ,  Gabriele Gorla ,  Boris Landwehr ,  Darryl Moore

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/14

Abstract: According to various embodiments, a processing subsystem includes: a processor mounted on a first printed circuit board that is oriented parallel to a first plane; a heat sink thermally coupled to the processor; a second printed circuit board that is communicatively coupled to the first printed circuit board and oriented parallel to a second plane, wherein the second plane is not parallel with the first plane; and at least one cooling fan that is positioned to direct a cooling fluid through the heat sink in a direction parallel to the first plane.