公开(公告)号：US11049817B2

公开(公告)日：2021-06-29

申请号：US16283853

申请日：2019-02-25

Applicant: NXP B.V.

Inventor： Chayathorn Saklang ,  Amornthep Saiyajitara ,  Chanon Suwankasab ,  Russell Joseph Lynch

IPC: H01L23/552 ,  H01L23/06 ,  H01L23/29 ,  H01L23/31 ,  H01L23/495 ,  H01L23/49 ,  H01L23/528

Abstract: A shielded semiconductor device has a first die attached to a die pad of a lead frame and a second die attached to a surface of the first die. The first die is electrically connected to inner lead ends of leads that surround the die pad, and the second die is electrically connected to the first die and to an inner end of a shielding lead. A mold compound forms a body around the first and second dies and the electrical connections. Outer lead ends of the leads project from the sides of the body. The outer end of the shielding lead projects from a central location of one side of the body and is bent up the side surface from which it projects and over the top of the body and provides EMI shielding.

公开(公告)号：US10790220B2

公开(公告)日：2020-09-29

申请号：US16164776

申请日：2018-10-18

Applicant: NXP B.V.

Inventor： Chayathorn Saklang ,  Stephen Ryan Hooper ,  Chanon Suwankasab ,  Amornthep Saiyajitara ,  Bernd Offermann ,  James Lee Grothe ,  Russell Joseph Lynch

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/56 ,  H01R12/58

Abstract: A press-fit semiconductor device includes a lead frame having a die pad, leads with inner and outer lead ends, and a press-fit lead. The press-fit lead has a circular section between an outer lead end and an inner lead end, and the circular section has a central hole that is sized and shaped to receive a press-fit connection pin. A die is attached to the die pad and electrically connected to the inner lead ends of the leads and the inner lead end of the press-fit lead. The die, electrical connections and inner lead ends are covered with an encapsulant that forms a housing. The outer lead ends of the leads extend beyond the housing. The housing has a hole extending therethrough that is aligned with the center hole of the press-fit lead, so that a press-fit connection pin can be pushed through the hole to connect the device to a circuit board.

公开(公告)号：US10340211B1

公开(公告)日：2019-07-02

申请号：US15922873

申请日：2018-03-15

Applicant: NXP B.V.

Inventor： Chanon Suwankasab ,  Amornthep Saiyajitara ,  Chayathorn Saklang ,  Stephen Ryan Hooper

IPC: H01L23/495 ,  H01L21/56 ,  G01P1/02 ,  H01L25/16 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00 ,  H01L23/02 ,  H01L21/52 ,  G01P15/00

Abstract: A sensor module, such as an acceleration sensor module, includes a leaded socket assembly covered by a housing. The leaded socket assembly includes a dual gauge lead frame, a sensor die, and various passive devices. The sensor die and the passive devices are mounted on the lead frame, and then the lead frame, sensor die, and passive devices are over-molded to form the leaded socket assembly. Neither the sensor module nor the socket assembly includes a printed circuit board, so many conventional sensor module assembly steps are bypassed.

公开(公告)号：US09257374B1

公开(公告)日：2016-02-09

申请号：US14582521

申请日：2014-12-24

Applicant: NXP B.V.

Inventor： Chanon Suwankasab ,  Amornthep Saiyajiatara

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49555 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83464 ,  H01L2224/83856 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85464 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/27 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00012

Abstract: Consistent with an example embodiment, a thin outline shrink package (TSOP) provides for a significant reduction in lead pitch along with a reduced package profile for a semiconductor device die packaged, therein.

Abstract translation: 与示例性实施例一致，薄外形收缩封装（TSOP）提供了引线间距的显着降低以及其中封装的半导体器件封装的减小的封装形状。