公开(公告)号：US11063183B2

公开(公告)日：2021-07-13

申请号：US15045680

申请日：2016-02-17

Applicant: NICHIA CORPORATION

Inventor： Keiji Emura ,  Shun Kitahama ,  Yasuo Miyoshi

IPC: H01L33/38 ,  H01L33/24 ,  H01L33/62

Abstract: A light emitting element includes a semiconductor layer which is in a planar shape of a polygon at least of a pentagon, a second electrode provided on the semiconductor layer, and a first electrode provided on the semiconductor layer and having a first pad portion, a first extension portion that extends from the first pad portion along an imaginary circle to which the first pad portion is tangent on the inside and whose center is at the same location as center of gravity of the polygon shape, and a second extension portion that extends along the imaginary circle from the first pad portion on the opposite side from the first extension portion.

公开(公告)号：US09941446B2

公开(公告)日：2018-04-10

申请号：US15388444

申请日：2016-12-22

Applicant: NICHIA CORPORATION

Inventor： Shun Kitahama

IPC: H01L33/38 ,  H01L33/44 ,  H01L33/40 ,  H01L33/42

CPC classification number: H01L33/38 ,  H01L33/387 ,  H01L33/40 ,  H01L33/405 ,  H01L33/42 ,  H01L33/44 ,  H01L2933/0016

Abstract: A method of manufacturing a light-emitting element includes forming a light-transmissive insulating film on a portion of an upper surface of a semiconductor layered body; forming a first light-transmissive electrode to continuously cover the upper surface of the semiconductor layered body and an upper surface of the light-transmissive insulating film; heat-treating the first light-transmissive electrode, and subsequently forming a metal film in at least a portion of a region above the light-transmissive insulating film; forming a second light-transmissive electrode to continuously cover an upper surface of the metal film and an upper surface of the first light-transmissive electrode, the second light-transmissive electrode being electrically connected to the first light-transmissive electrode; and forming a pad electrode in a region where the metal film is disposed in a top view, such that at least a portion of the pad electrode is in contact with an upper surface of the second light-transmissive electrode.

公开(公告)号：US09608170B2

公开(公告)日：2017-03-28

申请号：US15141164

申请日：2016-04-28

Applicant: NICHIA CORPORATION

Inventor： Shun Kitahama ,  Keiji Emura ,  Shinichi Daikoku

IPC: H01L33/42 ,  H01L33/40 ,  H01L33/44 ,  H01L33/38 ,  H01L33/32 ,  H01L33/46

CPC classification number: H01L33/42 ,  H01L33/32 ,  H01L33/38 ,  H01L33/405 ,  H01L33/44 ,  H01L33/46 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0033

Abstract: A method of manufacturing a semiconductor light emitting element includes providing a semiconductor stacked layer body; forming an insulating layer on a portion of the semiconductor stacked layer body; forming a light-transmissive electrode covering an upper surface of the semiconductor stacked layer body and an upper surface of the insulating layer, and on a region at least partially overlapping a region for disposing an extending portion in a plan view; forming a light reflecting layer in each of the openings of the light-transmissive electrode; forming a protective layer on a main surface side of the semiconductor stacked layer body; forming a mask on an upper surface of the protective layer except for the region for forming the pad electrode; etching the protective layer to form an opening in the protective layer; and forming a pad electrode in the opening of the protective layer.

公开(公告)号：US09356196B2

公开(公告)日：2016-05-31

申请号：US14802985

申请日：2015-07-17

Applicant: Nichia Corporation

Inventor： Shun Kitahama ,  Keiji Emura ,  Shinichi Daikoku

IPC: H01L33/00 ,  H01L33/40 ,  H01L33/42 ,  H01L33/44 ,  H01L33/38 ,  H01L33/32

CPC classification number: H01L33/42 ,  H01L33/32 ,  H01L33/38 ,  H01L33/405 ,  H01L33/44 ,  H01L33/46 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0033

Abstract: A method of manufacturing a semiconductor light emitting element includes providing a semiconductor stacked layer body; forming an insulating layer on a portion of the semiconductor stacked layer body; forming a light-transmissive electrode covering an upper surface of the semiconductor stacked layer body and an upper surface of the insulating layer, and on a region at least partially overlapping a region for disposing an extending portion in a plan view; forming a light reflecting layer in each of the openings of the light-transmissive electrode; forming a protective layer on a main surface side of the semiconductor stacked layer body; forming a mask on an upper surface of the protective layer except for the region for forming the pad electrode; etching the protective layer to form an opening in the protective layer; and forming a pad electrode in the opening of the protective layer.

Abstract translation: 一种制造半导体发光元件的方法包括：提供半导体层叠体; 在半导体层叠体的一部分上形成绝缘层; 形成覆盖所述半导体层叠体的上表面的绝缘层的上表面的透光性电极以及在平面图中至少部分地与所述延伸部配置的区域重叠的区域; 在透光电极的每个开口中形成光反射层; 在半导体层叠体主体的主面侧形成保护层; 在除了用于形成焊盘电极的区域之外的保护层的上表面上形成掩模; 蚀刻保护层以在保护层中形成开口; 以及在保护层的开口中形成焊盘电极。

公开(公告)号：US09041039B2

公开(公告)日：2015-05-26

申请号：US14167016

申请日：2014-01-29

Applicant: NICHIA CORPORATION

Inventor： Keiji Emura ,  Akihiro Miyagi ,  Shun Kitahama

IPC: H01L27/15 ,  H01L33/62 ,  H01L33/08 ,  H01L33/20 ,  H01L33/38

CPC classification number: H01L33/62 ,  H01L27/15 ,  H01L27/156 ,  H01L33/08 ,  H01L33/20 ,  H01L33/38 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2924/00

Abstract: A semiconductor light emitting element includes: an insulating substrate having a plurality of convex portions on a surface thereof; a plurality of light emitting element components having semiconductor laminated bodies that are laminated on the insulating substrate and are separated from one another by a groove that exposes the convex portions; and a connector connecting between the light emitting element components. The light emitting element components include a first light emitting element component and a second light emitting element component. The first light emitting element component is separated from the second light emitting element component with the groove in between, and has a first protrusion that protrudes toward the second light emitting element component. The connector includes a first connector having a shape that straddles the groove and that follows the convex portions, and has a straight section.

Abstract translation: 半导体发光元件包括：绝缘基板，其表面上具有多个凸部; 多个发光元件，其具有层叠在所述绝缘基板上并且通过露出所述凸部的槽而彼此分离的半导体层叠体; 以及连接在发光元件部件之间的连接器。 发光元件部件包括第一发光元件部件和第二发光元件部件。 第一发光元件部件与第二发光元件部件分离，其间具有凹槽，并且具有朝向第二发光元件部件突出的第一突起。 连接器包括第一连接器，该第一连接器具有横跨所述凹槽的形状，并且沿着所述凸部，并且具有直的部分。