Method and its apparatus for inspecting particles or defects of a semiconductor device
    11.
    发明申请
    Method and its apparatus for inspecting particles or defects of a semiconductor device 有权
    用于检查半导体器件的颗粒或缺陷的方法及其装置

    公开(公告)号:US20050024633A1

    公开(公告)日:2005-02-03

    申请号:US10933977

    申请日:2004-09-03

    IPC分类号: G01N21/88 G01N21/94

    摘要: Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

    摘要翻译: 通常,作为检测结果,粒子/缺陷检查装置输出检测出的粒子/缺陷的总数。 对于制造过程中的故障采取对策,分析检查装置检测到的颗粒/缺陷。 由于检查装置输出大量检测到的粒子/缺陷,所以需要巨大的时间来分析检测到的粒子/缺陷,从而导致制造过程中的失败的对策的延迟。 在本发明中,用于光学检查颗粒或缺陷的装置在检查结果中将颗粒或缺陷尺寸与故障原因相关联。 数据处理电路从检查结果统计中指出故障原因,并显示检查结果信息。 通过设定用于识别半导体装置等上的各区域的故障的阈值来进行故障分析,以统计学评价检测出的粒子。

    Method of apparatus for detecting particles on a specimen
    12.
    发明授权
    Method of apparatus for detecting particles on a specimen 有权
    用于检测样品上的颗粒的装置的方法

    公开(公告)号:US08289507B2

    公开(公告)日:2012-10-16

    申请号:US13118004

    申请日:2011-05-27

    IPC分类号: G01N21/00

    CPC分类号: G01N21/956

    摘要: A method and apparatus of detecting a defect by inspecting a specimen in which a surface of a specimen on which plural patterns are formed is illuminated with an elongated shape light flux from one of plural directions which are different in elevation angle by switching an optical path of the light flux emitted from an illuminating light source in accordance with a kind of defect to be detected. Plural optical images of the specimen illuminated by the elongated shape light flux are captured with plural image sensors installed in different elevation angle directions by changing an enlarging magnification in accordance with a density of the pattern formed on the sample in an area irradiated with the illuminating elongated shape light flux. A defect on the specimen is detected by processing the images captured by the plural image sensors.

    摘要翻译: 通过检查其中形成有多个图案的样本的表面的样本来检测缺陷的方法和装置,通过从仰角不同的多个方向之一的细长形状的光束照射, 根据要检测的缺陷的种类从照明光源发射的光束。 通过用安装在不同仰角方向上的多个图像传感器捕获由细长形状光束照射的样本的多个光学图像,通过根据在照射细长的照射区域中在样品上形成的图案的密度来改变放大倍率 形状光通量。 通过处理由多个图像传感器捕获的图像来检测样本上的缺陷。

    Method and its apparatus for inspecting particles or defects of a semiconductor device
    13.
    发明授权
    Method and its apparatus for inspecting particles or defects of a semiconductor device 有权
    用于检查半导体器件的颗粒或缺陷的方法及其装置

    公开(公告)号:US08072597B2

    公开(公告)日:2011-12-06

    申请号:US12138889

    申请日:2008-06-13

    IPC分类号: G01N15/02

    摘要: Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

    摘要翻译: 通常,作为检测结果,粒子/缺陷检查装置输出检测出的粒子/缺陷的总数。 对于制造过程中的故障采取对策,分析检查装置检测到的颗粒/缺陷。 由于检查装置输出大量检测到的粒子/缺陷,所以需要巨大的时间来分析检测到的粒子/缺陷,从而导致制造过程中的失败的对策的延迟。 在本发明中,用于光学检查颗粒或缺陷的装置在检查结果中将颗粒或缺陷尺寸与故障原因相关联。 数据处理电路从检查结果统计中指出故障原因,并显示检查结果信息。 通过设定用于识别半导体装置等上的各区域的故障的阈值来进行故障分析,以统计学评价检测出的粒子。

    Method for inspecting defect and apparatus for inspecting defect
    14.
    发明授权
    Method for inspecting defect and apparatus for inspecting defect 有权
    检查缺陷的方法和缺陷检查装置

    公开(公告)号:US07903244B2

    公开(公告)日:2011-03-08

    申请号:US12555530

    申请日:2009-09-08

    IPC分类号: G01N21/00

    摘要: The present invention is an apparatus for inspecting foreign particles/defects, comprises an illumination optical system, a detection optical system, a shielding unit which is provided in said detection optical system to selectively shield diffracted light pattern coming from circuit pattern existing on an inspection object and an arithmetic processing system, wherein said shielding unit comprises a micro-mirror array device or a reflected type liquid crystal, or a transmission type liquid crystal, or an object which is transferred a shielding pattern to an optical transparent substrate, or a substrate or a film which is etched so as to leave shielding patterns, or an optical transparent substrate which can be changed in transmission by heating, sudden cold, or light illumination, or change of electric field or magnetic field, or a shielding plate of cylindrical shape or plate shape.

    摘要翻译: 本发明是用于检查异物的缺陷的装置,包括照明光学系统,检测光学系统,屏蔽单元,其设置在所述检测光学系统中,以选择性地屏蔽来自存在于检查对象上的电路图案的衍射光图案 以及算术处理系统,其中所述屏蔽单元包括微镜阵列器件或反射型液晶或透射型液晶,或将屏蔽图案转印到光学透明基板或基板或 蚀刻以留下屏蔽图案的薄膜,或通过加热,突然冷或光照射或电场或磁场的变化或透镜中的可变化的光学透明基板或圆柱形的屏蔽板或 板形。

    Method and Its Apparatus for Inspecting Particles or Defects of a Semiconductor Device
    16.
    发明申请
    Method and Its Apparatus for Inspecting Particles or Defects of a Semiconductor Device 有权
    检测颗粒的方法及其装置或半导体器件的缺陷

    公开(公告)号:US20080246964A1

    公开(公告)日:2008-10-09

    申请号:US12138889

    申请日:2008-06-13

    IPC分类号: G01N15/02

    摘要: Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

    摘要翻译: 通常,作为检测结果,粒子/缺陷检查装置输出检测出的粒子/缺陷的总数。 对于制造过程中的故障采取对策,分析检查装置检测到的颗粒/缺陷。 由于检查装置输出大量检测到的粒子/缺陷,所以需要巨大的时间来分析检测到的粒子/缺陷,从而导致制造过程中的失败的对策的延迟。 在本发明中,用于光学检查颗粒或缺陷的装置在检查结果中将颗粒或缺陷尺寸与故障原因相关联。 数据处理电路从检查结果统计中指出故障原因,并显示检查结果信息。 通过设定用于识别半导体装置等上的各区域的故障的阈值来进行故障分析,以统计学评价检测出的粒子。

    Inspection method and inspection apparatus
    17.
    发明授权
    Inspection method and inspection apparatus 有权
    检验方法和检验仪器

    公开(公告)号:US07315363B2

    公开(公告)日:2008-01-01

    申请号:US10722531

    申请日:2003-11-28

    IPC分类号: G01N21/00

    摘要: The present invention provides an inspection apparatus and inspection method. The inspection apparatus provided by the present invention comprises an illumination optical system which illuminates light to an object under inspection; a detection optical system which detects light reflected from said object and converts the detected light into an image signal; a spatial filter which is provided in said detection optical system to selectively shield diffracted light pattern coming from a circuit pattern existing on the object by combining light-shielding points of minute dots state; an arithmetic processing system which processes the image signal detected by said detection optical system; and a monitor which observes foreign matters/defects based on a signal processed by said arithmetic processing system.

    摘要翻译: 本发明提供一种检查装置和检查方法。 本发明提供的检查装置包括照明光学系统,其将光照射到被检查物体; 检测光学系统,其检测从所述对象反射的光并将检测到的光转换为图像信号; 设置在所述检测光学系统中的空间滤波器,通过组合微点状态的遮光点来选择性地屏蔽来自存在于物体上的电路图案的衍射光图案; 算术处理系统,处理由所述检测光学系统检测到的图像信号; 以及基于由所述算术处理系统处理的信号来观察异物/缺陷的监视器。

    Method and its apparatus for inspecting particles or defects of a semiconductor device
    19.
    发明申请
    Method and its apparatus for inspecting particles or defects of a semiconductor device 有权
    用于检查半导体器件的颗粒或缺陷的方法及其装置

    公开(公告)号:US20070001132A1

    公开(公告)日:2007-01-04

    申请号:US11516344

    申请日:2006-09-05

    IPC分类号: G01N21/86

    摘要: Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

    摘要翻译: 通常,作为检测结果,粒子/缺陷检查装置输出检测出的粒子/缺陷的总数。 对于制造过程中的故障采取对策,分析检查装置检测到的颗粒/缺陷。 由于检查装置输出大量检测到的粒子/缺陷,所以需要巨大的时间来分析检测到的粒子/缺陷,从而导致制造过程中的失败的对策的延迟。 在本发明中,用于光学检查颗粒或缺陷的装置在检查结果中将颗粒或缺陷尺寸与故障原因相关联。 数据处理电路从检查结果统计中指出故障原因,并显示检查结果信息。 通过设定用于识别半导体装置等上的各区域的故障的阈值来进行故障分析,以统计学评价检测出的粒子。