公开(公告)号：US20210359430A1

公开(公告)日：2021-11-18

申请号：US17287114

申请日：2019-10-24

Applicant: OMRON Corporation

Inventor： Tsuyoshi MIYATA ,  Hiroyuki MIZUSAKI ,  Yasuyoshi SAWADA ,  Yoshiki TANI

IPC: H01R4/2454 ,  H01R12/53 ,  H01R4/2406

Abstract: Provided is a sensor which makes it easy to mount a cable to a circuit board. This sensor 1 is provided with: a circuit board 2; a connector 10 which is composed of a metal material and which is fixed to the circuit board 2; and a cable 3 which is connected to the circuit board 2 via the connector 10. The connector 10 has: a bottom part 11 that is connected to the circuit board 2; and a pair of pinching elements 12L, 12R that are raised upright from said bottom part 11. The cable 3 is held in a space S between the pair of pinching elements 12L, 12R.

公开(公告)号：US20190288153A1

公开(公告)日：2019-09-19

申请号：US16276624

申请日：2019-02-15

Applicant: OMRON Corporation

Inventor： Hiroyuki MIZUSAKI ,  Jumpei NAKAMURA ,  Tomohiro TSUJI ,  Makoto SUGIMOTO

IPC: H01L31/14 ,  H01L31/0232 ,  H01L31/0203

Abstract: A photoelectric sensor having at least one of a light emitting unit emitting light and a light receiving unit detecting light, includes a substrate on which at least one of the light emitting unit and the light receiving unit is mounted, and a cover portion having a protective portion facing the substrate and protecting the substrate, and a side wall extending from a peripheral edge of the protective portion toward the substrate side, in which the side wall of the cover portion includes a first portion formed in a first width and a second portion formed in a second width smaller than the first width, the first portion is positioned between the protective portion and the second portion, a surface in an end portion of the substrate is in contact with the first portion, and a side surface in the end portion of the substrate faces the second portion.

公开(公告)号：US20180239054A1

公开(公告)日：2018-08-23

申请号：US15814418

申请日：2017-11-16

Applicant: OMRON Corporation

Inventor： Hiroyuki MIZUSAKI

IPC: G01V8/12 ,  H03K17/945 ,  H05K5/00 ,  H05K7/14 ,  H01H50/02 ,  H03K17/94 ,  G01P1/02

CPC classification number: G01V8/12 ,  G01P1/02 ,  H01B3/30 ,  H01H50/021 ,  H03K17/941 ,  H03K17/945 ,  H03K2217/94094 ,  H03K2217/960755 ,  H05K5/006 ,  H05K7/1417

Abstract: To provide an electronic device which can be efficiently manufactured with stable quality. A photoelectric sensor 1A includes a cable 20 of which one end is drawn into a casing 10 through a cable insertion opening portion 10c, and a lead frame 25 which is electrically connected to a circuit board 34. A conductive wire 23 of the cable 20 is bonded to the lead frame 25, and an area from the cable insertion opening portion 10c to the bonded portion between the conductive wire 23 and the lead frame 25 is continuously sealed with resin R.

公开(公告)号：US20170254698A1

公开(公告)日：2017-09-07

申请号：US15391141

申请日：2016-12-27

Applicant: OMRON CORPORATION

Inventor： Hiroyuki MIZUSAKI ,  Hirotaka NAKASHIMA

IPC: G01J1/02 ,  B23K26/082 ,  B23K26/26

CPC classification number: G01J1/0271 ,  B23K26/082 ,  B23K26/206 ,  B23K26/244 ,  B23K26/26 ,  B23K33/004 ,  B23K2101/12 ,  B23K2101/36 ,  B23K2103/05 ,  H01H11/00 ,  H01H35/00

Abstract: A sensor device includes a body case provided with an opening, and a body cover assembled to the body case to cover the opening. The body cover has at an outer peripheral portion thereof an overlapping region overlapping a portion of the body case located at a peripheral edge of the opening. The body cover is fixed to the body case by providing a welded portion surrounding the opening using laser-welding at a portion distant from an end surface of the body cover in a boundary of the overlapping region of the body cover and a portion of the body case overlapping the overlapping region.