公开(公告)号：US20210302236A1

公开(公告)日：2021-09-30

申请号：US17347467

申请日：2021-06-14

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： KOUHEI TAKAHASHI ,  NAOKI TAMBO ,  KUNIHIKO NAKAMURA ,  MASAKI FUJIKANE ,  YASUYUKI NAITO

IPC: G01J5/22 ,  H01L27/16

Abstract: Each of first and second beams has a connection portion connected to a base substrate and a separated portion away from the base substrate, and is physically joined to an infrared receiver at the separated portion. The infrared receiver is supported by the first and second beams, and includes lower electrode, upper electrode, and a resistance change film. The resistance change film is sandwiched by the lower electrode and upper electrode in a thickness direction, each of the lower and upper electrodes is electrically connected to the resistance change film, the lower and upper electrodes are electrically connected to first wiring and second wiring, respectively, at least one electrode selected from the lower electrode and the upper electrode has a line-and-space structure, and an infrared reflection film is provided at a position on a surface of the base substrate facing the infrared receiver.

公开(公告)号：US20190178718A1

公开(公告)日：2019-06-13

申请号：US16193152

申请日：2018-11-16

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TAKASHI KAWASAKI ,  KOUHEI TAKAHASHI ,  NAOKI TAMBO ,  YASUYUKI NAITO

IPC: G01J5/06 ,  G01J5/20 ,  H01L37/02

Abstract: An infrared sensor comprises a base substrate including a recess, a bolometer infrared ray receiver, and a Peltier device. The bolometer infrared ray receiver comprises a resistance variable layer, a bolometer first beam, and a bolometer second beam. The Peltier device comprises a Peltier first beam formed of a p-type semiconductor material and a Peltier second beam formed of an n-type semiconductor material. The Peltier device is in contact with a back surface of the bolometer infrared ray receiver. One end of each of the bolometer first beam, the bolometer second beam, the Peltier first beam, and the Peltier second beam is connected to the base substrate. The bolometer infrared ray receiver and the Peltier device are suspended above the base substrate. Each of the bolometer first beam, the bolometer second beam, the Peltier first beam, and the Peltier second beam has a phononic crystal structure including a plurality of through holes arranged regularly.

公开(公告)号：US20170356806A1

公开(公告)日：2017-12-14

申请号：US15497353

申请日：2017-04-26

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： KOUHEI TAKAHASHI ,  TAKASHI KAWASAKI ,  YASUYUKI NAITO ,  MORIO TOMIYAMA

IPC: G01J5/02 ,  G01J5/14 ,  G01J5/22 ,  G01J5/20 ,  G01J5/12

CPC classification number: G01J5/02 ,  G01J5/023 ,  G01J5/046 ,  G01J5/06 ,  G01J5/12 ,  G01J5/14 ,  G01J5/20 ,  G01J5/22 ,  G01J2005/123

Abstract: An infrared sensor is formed in such a manner that an infrared receiver and a base substrate are spaced with a beam made of a thin-film phononic crystal in which through holes are arranged periodically. The beam made of a phononic crystal is formed in such a manner that a period P of through holes increases at arbitrary intervals in a direction from the infrared receiver toward the base substrate.