公开(公告)号：US20080242123A1

公开(公告)日：2008-10-02

申请号：US11729581

申请日：2007-03-29

申请人： Robert Martinson ,  Tieyu Zheng

发明人： Robert Martinson ,  Tieyu Zheng

IPC分类号： H01R12/00

CPC分类号： H01R13/2442 ,  H01R43/0249 ,  H01R43/0256

摘要： A land grid array socket and a microelectronic assembly including the socket. The socket comprises: a housing; an array of through-contacts on the housing; a solder ball standoff element on a PCB side of the housing; and a seating plane standoff element on a package side of the housing, the seating plane standoff element being aligned with the solder ball standoff element to form a loading force support element therewith.

摘要翻译： 一种地面栅格阵列插座和一个包括插座的微电子组件。 插座包括：壳体; 壳体上的一组通孔; 在壳体的PCB侧上的焊球支架元件; 以及在所述壳体的封装侧上的就座平面间隔元件，所述就座平面支座元件与所述焊球支座元件对齐以与其形成加载力支撑元件。

公开(公告)号：US06497734B1

公开(公告)日：2002-12-24

申请号：US10037026

申请日：2002-01-02

申请人： Kenneth K. Barber ,  Mark Fissel ,  Soo Yun Joh ,  Mukul Khosla ,  Karl B. Levy ,  Robert Martinson ,  Michael Meyers ,  Dhairya Shrivastava

发明人： Kenneth K. Barber ,  Mark Fissel ,  Soo Yun Joh ,  Mukul Khosla ,  Karl B. Levy ,  Robert Martinson ,  Michael Meyers ,  Dhairya Shrivastava

IPC分类号： H01L21324

CPC分类号： H01L21/67757 ,  H01L21/67017 ,  Y10S438/908 ,  Y10S438/909 ,  Y10T29/41

摘要： A multi-level shelf degas station relying on at least two heaters integrated within wafer holding shelves or slots, where the semiconductor wafers do not have direct contact with the heater shelves. The heaters provide conduction heating. In order to degas a wafer, the heater and wafer holder assembly is positioned in a sequential manner through each wafer slot to the next available slot. If a degassed wafer exists in the slot, a transfer chamber arm removes it. A loader arm then places a wafer in the available, empty slot and the stage is moved upwards to receive the wafer from the loader arm. The transfer chamber arm removes an individual wafer from the heater and wafer holder assembly allowing the removed wafer to be individually processed while the other wafers remain in the heater and wafer holder assembly. In some instances, a loader arm may also remove wafers. The remaining wafers in the heater and wafer holder assembly are subjected to further degas treatment while the wafer(s) removed by the transfer chamber arm are exposed to other process steps. Air-cooling chambers are employed to facilitate cooling the wafer slots for ease of removal and maintenance.

摘要翻译： 依赖于集成在晶片保持架或狭槽内的至少两个加热器的多级货架脱气站，其中半导体晶片不与加热器搁架直接接触。 加热器提供传导加热。 为了使晶片脱气，加热器和晶片保持器组件以顺序的方式定位成通过每个晶片槽到下一个可用的槽。 如果在槽中存在脱气的晶片，则传送室臂将其移除。 然后，装载臂将晶片放置在可用的空槽中，并且台架向上移动以从装载臂接收晶片。 传送室臂从加热器和晶片保持器组件移除单个晶片，允许将移除的晶片单独处理，而其它晶片保留在加热器和晶片保持器组件中。 在一些情况下，装载臂也可以移除晶片。 在加热器和晶片保持器组件中的剩余晶片经受进一步的脱气处理，同时通过转移室臂移除的晶片暴露于其它工艺步骤。 采用空气冷却室以便于冷却晶片槽以便于去除和维护。

公开(公告)号：US20050218035A1

公开(公告)日：2005-10-06

申请号：US10814528

申请日：2004-03-31

申请人： Tom Pearson ,  Robert Martinson ,  Terry Dishongh

发明人： Tom Pearson ,  Robert Martinson ,  Terry Dishongh

IPC分类号： H02H7/06 ,  H02P11/00 ,  H05K3/30 ,  H05K3/34

CPC分类号： H05K3/3494 ,  H05K3/303 ,  H05K2201/09127 ,  H05K2201/10325 ,  H05K2203/081 ,  H05K2203/082

摘要： A cap may be provided over the hinged cover of an integrated circuit socket to be surface mounted to a printed circuit board. The cap may protect the socket prior to the insertion of the integrated circuit. It may also facilitate the surface mounting of the socket to a printed circuit board. It may do so in at least two ways. The cap may facilitate convective heating by the provision of a series of openings in the cap. The cap may also be infrared transmissive so that infrared radiation from a surface mount oven passes through the cap to heat the socket. As a result, in some embodiments, better reflow is achieved and higher solder ball reliability may result.

摘要翻译： 盖可以设置在集成电路插座的铰接盖上，以被表面安装到印刷电路板。 在插入集成电路之前，盖可以保护插座。 也可以方便将插座表面安装到印刷电路板上。 它可能至少有两种方式。 盖可以通过在盖中提供一系列开口来促进对流加热。 盖也可以是红外透射的，使得来自表面安装的烘箱的红外辐射通过盖以加热插座。 结果，在一些实施例中，实现更好的回流并且可能导致更高的焊球可靠性。