公开(公告)号：US20220123470A1

公开(公告)日：2022-04-21

申请号：US17075098

申请日：2020-10-20

Applicant: QUALCOMM Incorporated

Inventor： Jeongil Jay KIM ,  Sangkil KIM ,  Darryl Sheldon JESSIE

IPC: H01Q5/40 ,  H01Q9/04 ,  H01Q9/06

Abstract: Various wireless device and antenna array configurations are provided. An example wireless device includes at least one radio frequency integrated circuit, at least one patch antenna element operably coupled to the at least one radio frequency integrated circuit, at least one dipole antenna comprising two dipole antenna elements disposed adjacent to the at least one patch antenna element and operably coupled to the at least one radio frequency integrated circuit, and at least one high impedance surface disposed below the at least one dipole antenna and adjacent to the at least one patch antenna element.

公开(公告)号：US20210351488A1

公开(公告)日：2021-11-11

申请号：US16871822

申请日：2020-05-11

Applicant: QUALCOMM Incorporated

Inventor： Chaoqi ZHANG ,  Suhyung HWANG ,  Jaehyun YEON ,  Taesik YANG ,  Jeongil Jay KIM ,  Darryl Sheldon JESSIE ,  Mohammad Ali TASSOUDJI

IPC: H01Q1/12 ,  H05K1/02 ,  H05K3/46 ,  H05K3/00

Abstract: A multi-core broadband printed circuit board (PCB) antenna and methods for fabricating such an antenna are provided. One example antenna implemented with a multi-core PCB generally includes a first core structure, a second core structure disposed above the first core structure, and one or more metal layers disposed above the second core structure or below the first core structure. The first core structure includes a first core layer, a first metal layer disposed below the first core layer, and a second metal layer disposed above the first core layer. The second core structure includes a second core layer, a third metal layer disposed below the second core layer, and a fourth metal layer disposed above the second core layer. The first core layer and the second core layer may have different thicknesses.

公开(公告)号：US20210280959A1

公开(公告)日：2021-09-09

申请号：US16810621

申请日：2020-03-05

Applicant: QUALCOMM Incorporated

Inventor： Jeahyeong HAN ,  Rajneesh KUMAR ,  Suhyung HWANG ,  Jaehyun YEON ,  Mohammad Ali TASSOUDJI ,  Darryl Sheldon JESSIE ,  Ameya GALINDE

IPC: H01Q1/22 ,  H01Q1/52 ,  H01Q1/36 ,  H05K1/18 ,  H05K9/00 ,  H01L23/31 ,  H01L23/538 ,  H01L23/66 ,  H01L23/552 ,  H01L21/56

Abstract: A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.

公开(公告)号：US20210119350A1

公开(公告)日：2021-04-22

申请号：US16825615

申请日：2020-03-20

Applicant: QUALCOMM Incorporated

Inventor： Julio ZEGARRA ,  Peter LIEN ,  Sang-June PARK ,  Darryl Sheldon JESSIE ,  Alberto CICALINI ,  Sean OAK ,  Neil BURNS

IPC: H01Q23/00 ,  H05K1/18 ,  H01Q1/48 ,  H01Q1/52

Abstract: An integrated millimeter wave antenna module may include at least one antenna array directly connected to a wiring board with a flexible printed circuit without any additional connectors. The integrated module may include an antenna, a flexible printed circuit attached to the antenna on one end and a wiring board on the other end.