公开(公告)号：US20220200166A1

公开(公告)日：2022-06-23

申请号：US17129084

申请日：2020-12-21

Applicant: QUALCOMM Incorporated

Inventor： Hong Bok WE ,  Aniket PATIL ,  Jeahyeong HAN ,  Mohammad Ali TASSOUDJI

IPC: H01Q21/06 ,  H01Q1/48 ,  H01Q1/22 ,  H01Q1/52 ,  H01Q21/00

Abstract: Aspects disclosed herein include a device including a first antenna substrate including one or more antennas. The device also includes a metallization structure. The device also includes a first spacer disposed between the first antenna substrate and the metallization structure, configured to maintain a constant distance between the first antenna substrate and the metallization structure. The device also includes a first plurality of conductive elements, disposed within the first spacer, configured to electrically couple the first antenna substrate to the metallization structure. The device also includes where the first spacer is configured to enclose all the conductive elements, electrically coupled to the first antenna substrate, and is configured to form an air gap between the first antenna substrate and the metallization structure. The device also includes where the first plurality of conductive elements is separated by air in the air gap.

公开(公告)号：US20220013472A1

公开(公告)日：2022-01-13

申请号：US16925217

申请日：2020-07-09

Applicant: QUALCOMM Incorporated

Inventor： Jeahyeong HAN ,  David Fraser RAE ,  Rajneesh KUMAR

IPC: H01L23/552 ,  H01L23/64 ,  H01L23/31

Abstract: Packages are configured to include an electromagnetic interference (EMI) shield. According to one example, a package includes a substrate, an electrical component, and an EMI shield. The substrate includes a first surface and a second surface. The electrical component may be coupled to the first side of the substrate. The EMI shield is formed with at least one passive device. The at least one passive device is coupled to the first surface of the substrate. The at least one passive device is located laterally to the at least one electrical component, and extends along at least a portion of the electrical component. Other aspects, embodiments, and features are also included.

公开(公告)号：US20210345492A1

公开(公告)日：2021-11-04

申请号：US17093920

申请日：2020-11-10

Applicant: QUALCOMM Incorporated

Inventor： Jaehyun YEON ,  Suhyung HWANG ,  Rajneesh KUMAR ,  Jeahyeong HAN

IPC: H05K1/18 ,  H05K1/02

Abstract: A device that includes a flexible printed circuit board (PCB), a package coupled to the flexible PCB, a first antenna device coupled to the flexible PCB, and a second antenna device coupled to the flexible PCB. The first antenna device is configured to transmit and receive a first signal having a first frequency. The second antenna device is configured to transmit and receive a second signal having a second frequency. The first antenna device may be coupled to a second surface of the flexible PCB, and the second antenna device is coupled to the second surface of the flexible PCB. The first antenna device may be coupled to a second surface of the flexible PCB, and the second antenna device is coupled to a first surface of the flexible PCB.

公开(公告)号：US20210175152A1

公开(公告)日：2021-06-10

申请号：US16704789

申请日：2019-12-05

Applicant: QUALCOMM Incorporated

Inventor： Chaoqi ZHANG ,  Rajneesh KUMAR ,  Li-Sheng WENG ,  Darryl Sheldon JESSIE ,  Suhyung HWANG ,  Jeahyeong HAN ,  Xiaoming CHEN ,  Jaehyun YEON

IPC: H01L23/48 ,  H01L23/31 ,  H01L21/67 ,  H01L21/56

Abstract: A package that includes a substrate having a routing region and a non-routing region along a periphery of the substrate. The non-routing region includes a plurality of vias configured as a shield. The package includes an integrated device coupled to the substrate, and an encapsulation layer located over the substrate such that the encapsulation layer encapsulates the integrated device.

公开(公告)号：US20230155273A1

公开(公告)日：2023-05-18

申请号：US17981176

申请日：2022-11-04

Applicant: QUALCOMM Incorporated

Inventor： Jeahyeong HAN ,  Rajneesh KUMAR ,  Suhyung HWANG ,  Jaehyun YEON ,  Mohammad Ali TASSOUDJI ,  Darryl Sheldon JESSIE ,  Ameya GALINDE

IPC: H01Q1/22 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/36 ,  H01Q1/52 ,  H05K1/18 ,  H05K9/00

CPC classification number: H01Q1/2283 ,  H01L21/565 ,  H01L23/66 ,  H01L23/552 ,  H01L23/3121 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5387 ,  H01Q1/36 ,  H01Q1/526 ,  H05K1/185 ,  H05K9/0081 ,  H01L21/4857

Abstract: A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.

公开(公告)号：US20210280959A1

公开(公告)日：2021-09-09

申请号：US16810621

申请日：2020-03-05

Applicant: QUALCOMM Incorporated

Inventor： Jeahyeong HAN ,  Rajneesh KUMAR ,  Suhyung HWANG ,  Jaehyun YEON ,  Mohammad Ali TASSOUDJI ,  Darryl Sheldon JESSIE ,  Ameya GALINDE

IPC: H01Q1/22 ,  H01Q1/52 ,  H01Q1/36 ,  H05K1/18 ,  H05K9/00 ,  H01L23/31 ,  H01L23/538 ,  H01L23/66 ,  H01L23/552 ,  H01L21/56

Abstract: A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.