公开(公告)号：US20180233604A1

公开(公告)日：2018-08-16

申请号：US15431623

申请日：2017-02-13

Applicant: QUALCOMM Incorporated

Inventor： Shiqun GU ,  Gengming TAO ,  Richard HAMMOND ,  Ranadeep DUTTA ,  Matthew Michael NOWAK ,  Francesco CAROBOLANTE

IPC: H01L29/93 ,  H01L29/20 ,  H01L29/22 ,  H01L29/47 ,  H01L29/737 ,  H01L29/66 ,  H01L27/06 ,  H01L21/822 ,  H01L23/00 ,  H01L23/66 ,  H03H11/34 ,  H03H11/04

CPC classification number: H01L29/93 ,  H01L21/8221 ,  H01L23/66 ,  H01L24/13 ,  H01L27/0629 ,  H01L27/0688 ,  H01L29/20 ,  H01L29/22 ,  H01L29/47 ,  H01L29/66174 ,  H01L29/66242 ,  H01L29/7371 ,  H01L2224/13025 ,  H03H11/04 ,  H03H11/342

Abstract: A tunable capacitor may include a first terminal having a first semiconductor component with a first polarity. The tunable capacitor may also include a second terminal having a second semiconductor component with a second polarity. The second component may be adjacent to the first semiconductor component. The tunable capacitor may further include a first conductive material electrically coupled to a first depletion region at a first sidewall of the first semiconductor component.

公开(公告)号：US20140354378A1

公开(公告)日：2014-12-04

申请号：US14055707

申请日：2013-10-16

Applicant: QUALCOMM Incorporated

Inventor： Chengjie ZUO ,  Jonghae KIM ,  Changhan Hobie YUN ,  Daeik Daniel KIM ,  Mario Francisco VELEZ ,  Je-Hsiung LAN ,  Robert Paul MIKULKA ,  Matthew Michael NOWAK

IPC: H03H7/01

CPC classification number: H03H7/0138 ,  H03H7/0115 ,  Y10T29/417

Abstract: A filter includes a glass substrate having through substrate vias. The filter also includes capacitors supported by the glass substrate. The capacitors may have a width and/or thickness less than a printing resolution. The filter also includes a 3D inductor within the substrate. The 3D inductor includes a first set of traces on a first surface of the glass substrate coupled to the through substrate vias. The 3D inductor also includes a second set of traces on a second surface of the glass substrate coupled to opposite ends of the through substrate vias. The second surface of the glass substrate is opposite the first surface of the glass substrate. The through substrate vias and traces operate as the 3D inductor. The first set of traces and the second set of traces may also have a width and/or thickness less than the printing resolution.

Abstract translation: 滤光器包括具有通过基板通孔的玻璃基板。 滤波器还包括由玻璃基板支撑的电容器。 电容器可以具有小于打印分辨率的宽度和/或厚度。 滤波器还包括衬底内的3D电感器。 3D电感器包括耦合到贯穿衬底通孔的玻璃衬底的第一表面上的第一组迹线。 3D电感器还包括耦合到贯通衬底通孔的相对端的玻璃衬底的第二表面上的第二组迹线。 玻璃基板的第二表面与玻璃基板的第一表面相对。 直通衬底通孔和迹线作为3D电感器工作。 第一组迹线和第二组迹线也可以具有小于打印分辨率的宽度和/或厚度。