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公开(公告)号：US10219365B1
公开(公告)日：2019-02-26
申请号：US15903465
申请日：2018-02-23
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung Chen , Yi-Chieh Chen , Ming-Hung Tsai , Jen-Mao Chen
IPC: H05K7/20 , H05K1/02 , G06F1/20 , H01L23/367
Abstract: A circuit card assembly includes a circuit card, a plurality of components disposed on a first surface of the circuit card in a shadow arrangement, and a plurality of air-cooled heat sink structures disposed on each of the components. Each of the plurality of heat sink structures comprises a plurality of impedance zones arranged in series substantially perpendicular to the airflow path, where the plurality of impedance zones comprise a first impedance zone having a first air impedance, and a second impedance zone having a second air impedance less than the first air impedance. Further, the plurality of zones in the plurality of heat sink structures are aligned so that the first impedance zone in one of the plurality of heat sink structures does not overlap with the first impedance zone in another of the plurality of heat sink structures, relative to the airflow path.
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公开(公告)号：US12052846B2
公开(公告)日：2024-07-30
申请号：US17670113
申请日：2022-02-11
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh Chen , Yueh-Chang Wu , Ching-Yi Shih , Kang Hsu
CPC classification number: H05K7/20409 , F28D21/00 , F28F3/02 , F28F21/084 , H05K7/20518 , H05K7/20727 , B23P2700/10 , F28D2021/0029
Abstract: A heat sink comprises a first portion and a second portion. The first portion is configured to contact a heat-generating electronic component. The first portion is formed from a first group of materials and has a first plurality of fins. The second portion is coupled to the first portion. The second portion is formed from a second group of materials and has a second plurality of fins. The second group of materials is different than the first group of materials. The first group of materials can include extruded aluminum, stamped aluminum, or both. The second group of materials can include die-cast metal. The first plurality of fins can have a smaller fin pitch than the second plurality of fins. The heat sink can further comprise a third portion coupled to the first portion, such that the first portion is positioned between the second portion and the third portion.
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公开(公告)号：US11864341B1
公开(公告)日：2024-01-02
申请号：US17846776
申请日：2022-06-22
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh Chen , Yueh-Chang Wu , Te-Chuan Wang , Wei-Ju Chen
CPC classification number: H05K7/20145 , H05K5/0213 , H05K5/0226 , H05K5/03 , H05K7/2049 , H05K7/20409
Abstract: A sunshield to protect an equipment housing from solar heat and allow cooling from external air flow is disclosed. The sunshield includes a main plate configured to be positioned to cover a side of the equipment housing. A vent in the main plate allows air flow through the main plate to the equipment housing. A shutter is rotatable between an open position allowing air flow through the vent, and a closed position blocking air flow through the vent. A biasing mechanism provides force to bias the shutter in the closed position. The force is overcome by a predetermined level of external air flow on the shutter to rotate the shutter to the open position.
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公开(公告)号：US11687134B2
公开(公告)日：2023-06-27
申请号：US16878026
申请日：2020-05-19
Applicant: QUANTA COMPUTER INC.
Inventor： Yi-Chieh Chen , Yueh-Chang Wu , Yan-Kuei Chen , Hsin-Yu Lin
IPC: G06F1/20
CPC classification number: G06F1/206
Abstract: Cooling devices, such as fans, installed in a computing device can be automatically identified by reading an encoded signal from the cooling device's tachometer signal line. A cooling device can temporarily output an encoded signal in response to a trigger event, such as a power on event (e.g., powering-on of the cooling device). A controller, such as a baseboard management controller (BMC), can receive the encoded signal and decode the signal to determine identification information about the cooling device, such as vendor information and/or model information. The identification information about the cooling device can be stored, logged, output, and/or used to customize the operation of the cooling device.
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公开(公告)号：US11412638B2
公开(公告)日：2022-08-09
申请号：US17247149
申请日：2020-12-01
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh Chen , Yueh-Chang Wu , Yan-Kuei Chen , Te-Chuan Wang
Abstract: A cooling system for an electronic device includes a central processing unit (CPU), a remote heat sink, and a heat-pipe module. The CPU is mounted on a base of the electronic device, and the remote heat sink receives heat generated by the CPU. The heat-pipe module has a plurality of heat pipes for transferring the heat generated by the CPU to the remote heat sink. Each heat pipe has a circular section extending between a first end and a second end. The first end has a flattened, non-circular shape, and is coupled to the base near the CPU. The second end is coupled to the remote heat sink. The first end of each heat pipe is in direct contact with at least another first end of an adjacent heat pipe.
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Patent Agency Ranking
公开(公告)号：US11333157B2
公开(公告)日：2022-05-17
申请号：US16706428
申请日：2019-12-06
Applicant: QUANTA COMPUTER INC.
Inventor： Yi-Chieh Chen , Yueh-Chang Wu , Jen-Mao Chen
Abstract: A computing device has a fan housing that includes a dual rotor fan with a first rotor and a second rotor. The computing device also includes a controller communicatively coupled to the dual rotor fan. The controller is operable to detect a failure associated with the first rotor. In response to detecting the failure, the controller is operable to drive the second rotor at a higher speed than a fan-speed at which the second rotor was being driven before the failure.
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公开(公告)号：US10856437B2
公开(公告)日：2020-12-01
申请号：US16039808
申请日：2018-07-19
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung Chen , Yi-Chieh Chen , Yueh-Chang Wu , Ming-Chin Huang
IPC: H05K7/20 , G06F1/20 , G06F1/3234 , G06F1/3221 , G06F1/3287
Abstract: A system and method to control fan power for an electronic device based on cooling requirements is disclosed. The electronic device includes a power supply unit and a fan coupled to the power supply unit. A controller is coupled to the fan. The device includes at least one electronic component cooled by the fan. The controller is operable to classify the at least one electronic component, and regulate the power supplied to the fan based on the classification of the at least one electronic component.
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公开(公告)号：US10653040B1
公开(公告)日：2020-05-12
申请号：US16418331
申请日：2019-05-21
Applicant: QUANTA COMPUTER INC.
Inventor： Wei-Te Wang , Shuo-Ting Jian , Samuel Chatelier , Yi-Chieh Chen
IPC: H05K7/20
Abstract: The present disclosure is directed to an apparatus for a server chassis. A position of the apparatus changes the airflow in the server chassis. The apparatus can be adjacent to a slot in the server chassis. The apparatus adjusts among a plurality of positions based on a height of the slot and/or a size of a computer component received at the slot. The apparatus includes a base portion and an arm. The base portion can couple with a wall of the chassis body, and the arm can include a plurality of moveable segments.
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公开(公告)号：US11622471B2
公开(公告)日：2023-04-04
申请号：US17304704
申请日：2021-06-24
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh Chen , Yueh-Chang Wu , Te-Chuan Wang , Tzu-Hsuan Hsu
Abstract: A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first cold plate, a connecting conduit, a second cold plate, an outlet conduit, and a heat conductor. Coolant flows through the inlet conduit. The first cold plate has a first inlet surface and a first outlet surface. The inlet conduit is coupled to the first inlet surface. The inlet conduit transfers the coolant into the first cold plate. The connecting conduit is coupled at one end to the first outlet surface. The coolant flows from the first cold plate through the connecting conduit. The second cold plate has a second inlet surface and a second outlet surface, the connecting conduit being coupled at another end to the second inlet surface. The outlet conduit is coupled to the second outlet surface. The coolant flows from the second cold plate through the outlet conduit.
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公开(公告)号：US10986751B1
公开(公告)日：2021-04-20
申请号：US16773007
申请日：2020-01-27
Applicant: QUANTA COMPUTER INC.
Inventor： Yi-Chieh Chen , Jen-Mao Chen , Wei-Te Wang , Shuo-Ting Jian
IPC: H05K7/20
Abstract: An external air baffle nozzle has a top surface, a bottom surface, and a pair of sidewalls separating the top surface from the bottom surface. An end of the pair of sidewalls, an end of the top surface and an end of the bottom surface define an inlet. An opposite end of the pair of sidewalls, an opposite end of the top surface, and an opposite end of the bottom surface define an outlet. The outlet has a smaller cross section than a cross section of the inlet.
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