Combination heat sink
    11.
    发明授权

    公开(公告)号:US12052846B2

    公开(公告)日:2024-07-30

    申请号:US17670113

    申请日:2022-02-11

    Abstract: A heat sink comprises a first portion and a second portion. The first portion is configured to contact a heat-generating electronic component. The first portion is formed from a first group of materials and has a first plurality of fins. The second portion is coupled to the first portion. The second portion is formed from a second group of materials and has a second plurality of fins. The second group of materials is different than the first group of materials. The first group of materials can include extruded aluminum, stamped aluminum, or both. The second group of materials can include die-cast metal. The first plurality of fins can have a smaller fin pitch than the second plurality of fins. The heat sink can further comprise a third portion coupled to the first portion, such that the first portion is positioned between the second portion and the third portion.

    Cooling device identification
    13.
    发明授权

    公开(公告)号:US11687134B2

    公开(公告)日:2023-06-27

    申请号:US16878026

    申请日:2020-05-19

    CPC classification number: G06F1/206

    Abstract: Cooling devices, such as fans, installed in a computing device can be automatically identified by reading an encoded signal from the cooling device's tachometer signal line. A cooling device can temporarily output an encoded signal in response to a trigger event, such as a power on event (e.g., powering-on of the cooling device). A controller, such as a baseboard management controller (BMC), can receive the encoded signal and decode the signal to determine identification information about the cooling device, such as vendor information and/or model information. The identification information about the cooling device can be stored, logged, output, and/or used to customize the operation of the cooling device.

    Cooling for server with high-power CPU

    公开(公告)号:US11412638B2

    公开(公告)日:2022-08-09

    申请号:US17247149

    申请日:2020-12-01

    Abstract: A cooling system for an electronic device includes a central processing unit (CPU), a remote heat sink, and a heat-pipe module. The CPU is mounted on a base of the electronic device, and the remote heat sink receives heat generated by the CPU. The heat-pipe module has a plurality of heat pipes for transferring the heat generated by the CPU to the remote heat sink. Each heat pipe has a circular section extending between a first end and a second end. The first end has a flattened, non-circular shape, and is coupled to the base near the CPU. The second end is coupled to the remote heat sink. The first end of each heat pipe is in direct contact with at least another first end of an adjacent heat pipe.

    Automated fan adjustment system
    15.
    发明授权

    公开(公告)号:US11333157B2

    公开(公告)日:2022-05-17

    申请号:US16706428

    申请日:2019-12-06

    Abstract: A computing device has a fan housing that includes a dual rotor fan with a first rotor and a second rotor. The computing device also includes a controller communicatively coupled to the dual rotor fan. The controller is operable to detect a failure associated with the first rotor. In response to detecting the failure, the controller is operable to drive the second rotor at a higher speed than a fan-speed at which the second rotor was being driven before the failure.

Patent Agency Ranking