公开(公告)号：US20070080362A1

公开(公告)日：2007-04-12

申请号：US11543863

申请日：2006-10-06

申请人： Adam Scotch ,  George Wei

发明人： Adam Scotch ,  George Wei

IPC分类号： H01L33/00

CPC分类号： H01L33/641 ,  H01L25/0753 ,  H01L33/483 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

摘要： An more efficient or higher luminance LED assembly may be formed from a high power LED chip having a first surface, and a second surface, the first surface being mounted to a substrate; the second surface being in intimate thermal contact with a light transmissive heat sink having a thermal conductivity greater than 30 watts per meter-Kelvin. The LED chip is otherwise in electrical contact with at least a first electrical connection and a second electrical connection for powering the LED chip. Providing light transmissive heat sink can double the heat conduction from the LED dies thereby increasing life, or efficiency or luminance or a balance of the three.

摘要翻译： 可以从具有第一表面的大功率LED芯片和第二表面形成更有效或更高亮度的LED组件，第一表面安装到基板; 第二表面与导热率大于30瓦每米开尔文的透光散热器紧密地热接触。 LED芯片否则与至少第一电连接和用于为LED芯片供电的第二电连接电接触。 提供透光散热器可以使来自LED芯片的热传导加倍，从而增加寿命或效率或亮度或三者之间的平衡。

公开(公告)号：US20130114174A1

公开(公告)日：2013-05-09

申请号：US13724713

申请日：2012-12-21

申请人： David Hamby ,  Adam Scotch

发明人： David Hamby ,  Adam Scotch

IPC分类号： H02H3/20

CPC分类号： H02H3/20 ,  H02H7/20 ,  H02H9/046 ,  H05K1/0259 ,  H05K1/16 ,  H05K1/189 ,  H05K2201/0329 ,  H05K2201/0738 ,  H05K2201/10106 ,  H05K2201/10174

摘要： Systems and methods for protecting electrical components such as light emitting diodes are described. In some embodiments, electrical components are protected from high level electrostatic discharge (“ESD”) events by a circuit board that provides an intrinsic level of ESD protection. At the same time, such electrical components are protected against low level ESD events by one or more diodes that are electrically coupled thereto. The one or more diodes may be thin film diodes comprising at least one layer of p-type semiconductive material and at least one layer of n-type semiconductive material. Devices including ESD protection and methods for manufacturing such devices are also described.

摘要翻译： 描述了用于保护诸如发光二极管的电气部件的系统和方法。 在一些实施例中，通过提供固有水平的ESD保护的电路板来保护电气部件免受高电平静电放电（“ESD”）事件的影响。 同时，通过与电耦合到其上的一个或多个二极管来保护这种电气部件免受低电平ESD事件的影响。 一个或多个二极管可以是包括至少一层p型半导体材料和至少一层n型半导体材料的薄膜二极管。 还描述了包括ESD保护的装置和用于制造这种装置的方法。

公开(公告)号：US08183585B2

公开(公告)日：2012-05-22

申请号：US12211351

申请日：2008-09-16

申请人： Adam Scotch ,  John Selverian ,  David Hamby

发明人： Adam Scotch ,  John Selverian ,  David Hamby

IPC分类号： H01S5/00

CPC分类号： H05B33/0803 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A lighting module comprising a base panel and a plurality of light-emitting diode (LED) chips attached directly to the base panel. The LED chips are in electrical communication with conductive traces on the base panel, which deliver a current to the LED chips. Various embodiments of this generally described lighting module are also presented. Additionally, methods of preparing such a lighting module, and system components of the lighting module are presented.

摘要翻译： 一种照明模块，包括基板和直接附接到基板的多个发光二极管（LED）芯片。 LED芯片与基板上的导电迹线电连通，其向LED芯片传送电流。 还提供了这个一般描述的照明模块的各种实施例。 另外，提出了制备这种照明模块的方法以及照明模块的系统组件。

公开(公告)号：US09000453B2

公开(公告)日：2015-04-07

申请号：US13724713

申请日：2012-12-21

申请人： David Hamby ,  Adam Scotch

发明人： David Hamby ,  Adam Scotch

IPC分类号： H01L21/00 ,  H02H3/20 ,  H05K1/02 ,  H05K1/18 ,  H02H7/20 ,  H05K1/16 ,  H02H9/04

CPC分类号： H02H3/20 ,  H02H7/20 ,  H02H9/046 ,  H05K1/0259 ,  H05K1/16 ,  H05K1/189 ,  H05K2201/0329 ,  H05K2201/0738 ,  H05K2201/10106 ,  H05K2201/10174

摘要： Systems and methods for protecting electrical components such as light emitting diodes are described. In some embodiments, electrical components are protected from high level electrostatic discharge (“ESD”) events by a circuit board that provides an intrinsic level of ESD protection. At the same time, such electrical components are protected against low level ESD events by one or more diodes that are electrically coupled thereto. The one or more diodes may be thin film diodes comprising at least one layer of p-type semiconductive material and at least one layer of n-type semiconductive material. Devices including ESD protection and methods for manufacturing such devices are also described.

摘要翻译： 描述了用于保护诸如发光二极管的电气部件的系统和方法。 在一些实施例中，通过提供固有水平的ESD保护的电路板来保护电气部件免受高电平静电放电（“ESD”）事件的影响。 同时，通过与电耦合到其上的一个或多个二极管来保护这种电气部件免受低电平ESD事件的影响。 一个或多个二极管可以是包括至少一层p型半导体材料和至少一层n型半导体材料的薄膜二极管。 还描述了包括ESD保护的装置和用于制造这种装置的方法。