公开(公告)号：US11721696B2

公开(公告)日：2023-08-08

申请号：US17320555

申请日：2021-05-14

Applicant: Rohm Co., Ltd.

Inventor： Hirotaka Takihara

IPC: H01L27/092 ,  H03K17/687 ,  H02P7/03

CPC classification number: H01L27/092 ,  H02P7/04 ,  H03K17/6872

Abstract: A semiconductor integrated circuit includes first to fourth transistor arrangement regions. A portion of the third transistor arrangement region is located on a second side in a first direction of the second transistor arrangement region. A portion of the first transistor arrangement region connected to the second transistor arrangement region is sandwiched in the first direction by the second transistor arrangement region and the portion of the third transistor arrangement region. The portion of the first transistor arrangement region is located on a first side in the first direction of the fourth transistor arrangement region. The portion of the third transistor arrangement region connected to the fourth transistor arrangement region is sandwiched in the first direction by the fourth transistor arrangement region and the portion of the first transistor arrangement region.

公开(公告)号：US11115020B2

公开(公告)日：2021-09-07

申请号：US16508682

申请日：2019-07-11

Applicant: Rohm Co., Ltd.

Inventor： Daiki Yanagishima ,  Toshiyuki Ishikawa ,  Hirotaka Takihara

IPC: H03K17/691 ,  H03K17/61 ,  H04L25/02 ,  G01R31/27 ,  G01R31/28 ,  H02P31/00

Abstract: A signal transmission device includes a first lead frame supporting a signal transmission chip that includes first and second inductor spiral rings, a first bonding pad electrically coupled between the first and second inductor spiral rings, and a guard ring provided to roundly cover the first and second inductor spiral rings in a plan view. Bonding pads are provided outside of the guard ring. A direction of rotation between the first and second inductor spiral rings are different from each other so that the first and second inductor spiral rings are disposed substantially symmetrically about the first bonding pad. A second lead frame supports a semiconductor chip, with the signal transmission chip and the semiconductor chip facing each other.

公开(公告)号：US20200313671A9

公开(公告)日：2020-10-01

申请号：US16508682

申请日：2019-07-11

Applicant: Rohm Co., Ltd.

Inventor： Daiki Yanagishima ,  Toshiyuki Ishikawa ,  Hirotaka Takihara

IPC: H03K17/691 ,  G01R31/27 ,  H04L25/02 ,  G01R31/28 ,  H02P31/00 ,  H03K17/61

Abstract: Disclosed is a signal transmission circuit device (200) including a feedback signal transmission unit (210) that feeds back a control output signal (Sout) as a feedback signal (Sf) to an input side circuit (200A). A logical comparison circuit (212) detects “mismatch” between input and output by performing logical comparison between a control input signal (Sin) and the feedback signal (Sf). When a state of “mismatch” between input and output occurs, a first pulse generating circuit (202) or a second pulse generating circuit (204) outputs a first correction signal (Sa1) or a second correction signal (Sa2) corresponding to a potential (high level or low level) of the control input signal (Sin), and corrects the control output signal (Sout) to the same potential (high level or low level) as the control input signal (Sin). With such configuration, the mismatch

公开(公告)号：US20170194959A1

公开(公告)日：2017-07-06

申请号：US15463121

申请日：2017-03-20

Applicant: Rohm Co., Ltd.

Inventor： Daiki Yanagishima ,  Toshiyuki Ishikawa ,  Hirotaka Takihara

IPC: H03K17/691 ,  G01R31/28 ,  G01R31/27 ,  H03K17/61 ,  H02P31/00

CPC classification number: H03K17/691 ,  G01R31/27 ,  G01R31/2884 ,  H02P31/00 ,  H03K17/61 ,  H04L25/028

Abstract: Disclosed is a signal transmission circuit device (200) including a feedback signal transmission unit (210) that feeds back a control output signal (Sout) as a feedback signal (Sf) to an input side circuit (200A). A logical comparison circuit (212) detects “mismatch” between input and output by performing logical comparison between a control input signal (Sin) and the feedback signal (Sf). When a state of “mismatch” between input and output occurs, a first pulse generating circuit (202) or a second pulse generating circuit (204) outputs a first correction signal (Sa1) or a second correction signal (Sa2) corresponding to a potential (high level or low level) of the control input signal (Sin), and corrects the control output signal (Sout) to the same potential (high level or low level) as the control input signal (Sin). With such configuration, the mismatch

公开(公告)号：US09632135B2

公开(公告)日：2017-04-25

申请号：US14576775

申请日：2014-12-19

Applicant: Rohm Co., Ltd.

Inventor： Daiki Yanagishima ,  Toshiyuki Ishikawa ,  Hirotaka Takihara

IPC: G01R31/26 ,  H01L23/64 ,  G01R31/28 ,  H03K17/61 ,  H03K17/691 ,  H04L25/02 ,  G01R31/27

CPC classification number: H03K17/691 ,  G01R31/27 ,  G01R31/2884 ,  H02P31/00 ,  H03K17/61 ,  H04L25/028

Abstract: Disclosed is a signal transmission circuit device (200) including a feedback signal transmission unit (210) that feeds back a control output signal (Sout) as a feedback signal (Sf) to an input side circuit (200A). A logical comparison circuit (212) detects “mismatch” between input and output by performing logical comparison between a control input signal (Sin) and the feedback signal (Sf). When a state of “mismatch” between input and output occurs, a first pulse generating circuit (202) or a second pulse generating circuit (204) outputs a first correction signal (Sa1) or a second correction signal (Sa2) corresponding to a potential (high level or low level) of the control input signal (Sin), and corrects the control output signal (Sout) to the same potential (high level or low level) as the control input signal (Sin). With such configuration, the mismatch between input and output can be automatically corrected.