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公开(公告)号:US12255642B2
公开(公告)日:2025-03-18
申请号:US18006105
申请日:2021-05-25
Applicant: ROHM CO., LTD.
Inventor: Daiki Yanagishima , Akio Sasabe
IPC: H03K17/691 , H02M3/07 , H02M3/335 , H03K19/0175
Abstract: A signal transmission device 100 includes an isolated signal transmission circuit 10 configured to transmit a pulse signal from a primary circuit system 1p via a first isolating element ISO1 to a secondary circuit system 1s, and an isolated power supply control circuit 20 which serves as a controlling agent of an isolation-type power supply that generates a second supply voltage Vcc2 for the secondary circuit system 1s from a first supply voltage Vcc1 for the primary circuit system 1p and which transmits an output feedback signal of the isolation-type power supply from the secondary circuit system 1s via a second isolating element ISO2 to the primary circuit system 1p.
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公开(公告)号:US11011297B2
公开(公告)日:2021-05-18
申请号:US16803522
申请日:2020-02-27
Applicant: ROHM CO., LTD.
Inventor: Kosei Osada , Isamu Nishimura , Tetsuya Kagawa , Daiki Yanagishima , Toshiyuki Ishikawa , Michihiko Mifuji , Satoshi Kageyama , Nobuyuki Kasahara
IPC: H01F27/28 , H01L23/64 , H01L23/522 , H01L23/58 , H01L23/495 , H01L23/31
Abstract: The semiconductor device of the present invention includes an insulating layer, a high voltage coil and a low voltage coil which are disposed in the insulating layer at an interval in the vertical direction, a low potential portion which is provided in a low voltage region disposed around a high voltage region for the high voltage coil in planar view and is connected with potential lower than the high voltage coil, and an electric field shield portion which is disposed between the high voltage coil and the low voltage region and includes an electrically floated metal member.
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公开(公告)号:US20190334522A1
公开(公告)日:2019-10-31
申请号:US16508682
申请日:2019-07-11
Applicant: Rohm Co., Ltd.
Inventor: Daiki Yanagishima , Toshiyuki Ishikawa , Hirotaka Takihara
Abstract: Disclosed is a signal transmission circuit device (200) including a feedback signal transmission unit (210) that feeds back a control output signal (Sout) as a feedback signal (Sf) to an input side circuit (200A). A logical comparison circuit (212) detects “mismatch” between input and output by performing logical comparison between a control input signal (Sin) and the feedback signal (Sf). When a state of “mismatch” between input and output occurs, a first pulse generating circuit (202) or a second pulse generating circuit (204) outputs a first correction signal (Sa1) or a second correction signal (Sa2) corresponding to a potential (high level or low level) of the control input signal (Sin), and corrects the control output signal (Sout) to the same potential (high level or low level) as the control input signal (Sin). With such configuration, the mismatch
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公开(公告)号:US10109995B2
公开(公告)日:2018-10-23
申请号:US15042870
申请日:2016-02-12
Applicant: Rohm Co., Ltd.
Inventor: Daiki Yanagishima , Chinatsu Nakaoka
IPC: H02H7/00 , H02H3/087 , H02H3/093 , H03K17/081 , H03K17/082 , H02H3/027 , H03K17/16
Abstract: A switch drive circuit for driving a switching device includes an overcurrent detector which detects an overcurrent passing through the switching device, and a voltage controller which applies a control voltage to the switching device to control the switching device between On and Off states. When the overcurrent detector detects an overcurrent, the voltage controller applies to the switching device a control voltage that initially drops to a predetermined voltage higher than the threshold voltage of the switching device and that then, after the lapse of a predetermined time, drops further to the ground potential of the switch drive circuit to turn off the switching device. When the overcurrent detector detects no overcurrent, the voltage controller applies to the switching device a control voltage that drops, before the lapse of the predetermined voltage, to the ground potential of the switch drive circuit to turn off the switching device.
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公开(公告)号:US09697948B2
公开(公告)日:2017-07-04
申请号:US14537234
申请日:2014-11-10
Applicant: ROHM CO., LTD.
Inventor: Kosei Osada , Isamu Nishimura , Tetsuya Kagawa , Daiki Yanagishima , Toshiyuki Ishikawa , Michihiko Mifuji , Satoshi Kageyama , Nobuyuki Kasahara
IPC: H01L23/522 , H01F27/28 , H01L23/64 , H01L23/58 , H01L23/495 , H01L23/31
CPC classification number: H01F27/288 , H01F27/2804 , H01F2027/2819 , H01L23/3107 , H01L23/49575 , H01L23/5225 , H01L23/5227 , H01L23/585 , H01L23/645 , H01L2224/04042 , H01L2224/05554 , H01L2224/05567 , H01L2224/06135 , H01L2224/48137 , H01L2224/48195 , H01L2224/48247 , H01L2224/49113 , H01L2924/10253 , H01L2924/10272 , H01L2924/13091 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19104
Abstract: The semiconductor device of the present invention includes an insulating layer, a high voltage coil and a low voltage coil which are disposed in the insulating layer at an interval in the vertical direction, a low potential portion which is provided in a low voltage region disposed around a high voltage region for the high voltage coil in planar view and is connected with potential lower than the high voltage coil, and an electric field shield portion which is disposed between the high voltage coil and the low voltage region and includes an electrically floated metal member.
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公开(公告)号:US12224654B2
公开(公告)日:2025-02-11
申请号:US17917661
申请日:2021-04-06
Applicant: Rohm Co., Ltd.
Inventor: Tsuyoshi Fukura , Daiki Yanagishima , Akio Sasabe
IPC: H02M1/08 , H02M1/00 , H03K19/0175
Abstract: A pulse receiving circuit constituting a signal transmission device includes a first pulse detector that receives a differential input between a first reception pulse signal, i.e. an internal signal at a secondary winding of a first transformer and a second reception pulse signal, i.e. an internal signal at a secondary winding of a second transformer; a second pulse detector that receives the differential input between the first reception pulse signal and the second reception pulse signal with input polarity reversed to that of the first pulse detector; and a logic unit that generates a reception pulse signal based on output signals of the first and second pulse detectors, respectively.
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公开(公告)号:US11658659B2
公开(公告)日:2023-05-23
申请号:US17383545
申请日:2021-07-23
Applicant: Rohm Co., Ltd.
Inventor: Daiki Yanagishima , Toshiyuki Ishikawa , Hirotaka Takihara
CPC classification number: H03K17/691 , G01R31/27 , G01R31/2884 , H02P31/00 , H03K17/61 , H04L25/028
Abstract: A signal transmission device includes a signal transmission chip, and a first lead frame supporting the signal transmission chip. A first inductor spiral ring is on a surface of the signal transmission chip, a second inductor spiral ring is inside the signal transmission chip, a first bonding pad is electrically coupled between the first and second inductor spiral rings, a guard ring covers the first and second inductor spiral rings in a plan view, and bonding pads are outside of the guard ring. A direction of rotation between the first and second inductor spiral rings are different from each other. The signal transmission device further includes a semiconductor chip and a second lead frame supporting the semiconductor chip, wherein the signal transmission chip and the semiconductor chip face each other.
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公开(公告)号:US10333499B2
公开(公告)日:2019-06-25
申请号:US15652514
申请日:2017-07-18
Applicant: Rohm Co., Ltd.
Inventor: Toshiyuki Ishikawa , Daiki Yanagishima , Yoshizo Osumi
IPC: H03K3/037 , B60L11/18 , H03K19/20 , H03K17/61 , H03K17/687 , H03K17/691 , H04L25/02 , H04L25/493
Abstract: A signal transmission circuit which transmits N (N is a natural number of 2 or more) input signals includes a transmission signal generation portion, 2N transmission portions and an output portion. The transmission signal generation portion generates 2N transmission signals according to the N input signals. The 2N transmission portions respectively transmit the 2N transmission signals output from the transmission signal generation portion while performing electrical insulation. The output portion generates and outputs, based on the 2N transmission signals transmitted by the 2N transmission portions, N output signals that respectively indicate the N input signals. The transmission signal generation portion generates a pulse according to the N input signals and incorporates the pulse in only one of the 2N transmission signals at the same time.
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公开(公告)号:US12034437B2
公开(公告)日:2024-07-09
申请号:US18024086
申请日:2021-09-16
Applicant: ROHM CO., LTD.
Inventor: Takeshi Kikuchi , Masato Nishinouchi , Akio Sasabe , Daiki Yanagishima
IPC: H02P29/024 , H03K17/18
CPC classification number: H03K17/18 , H02P29/0241
Abstract: A signal transmission device that transmits a driving signal for a power transistor from a primary circuit system to a secondary circuit system while isolating between the primary and secondary circuit systems includes: a first fault detection circuit configured to detect a fault in the primary circuit system; a second fault detection circuit configured to detect a fault in the secondary circuit system; a first signal transmission path configured to transmit the result of detection by the second fault detection circuit from the secondary circuit system to the primary circuit system while isolating between the primary and secondary circuit systems; and a self-test circuit configured to perform a self-test on each of the first fault detection circuit, the second fault detection circuit, and the first signal transmission path.
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公开(公告)号:US11657953B2
公开(公告)日:2023-05-23
申请号:US17230356
申请日:2021-04-14
Applicant: ROHM CO., LTD.
Inventor: Kosei Osada , Isamu Nishimura , Tetsuya Kagawa , Daiki Yanagishima , Toshiyuki Ishikawa , Michihiko Mifuji , Satoshi Kageyama , Nobuyuki Kasahara
IPC: H01F27/28 , H01L23/64 , H01L23/522 , H01L23/58 , H01L23/495 , H01L23/31
CPC classification number: H01F27/288 , H01F27/2804 , H01L23/49575 , H01L23/5225 , H01L23/5227 , H01L23/585 , H01L23/645 , H01F2027/2819 , H01L23/3107 , H01L2224/04042 , H01L2224/05554 , H01L2224/05567 , H01L2224/06135 , H01L2224/48137 , H01L2224/48195 , H01L2224/48247 , H01L2224/49113 , H01L2224/49175 , H01L2924/10253 , H01L2924/10272 , H01L2924/13091 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19104
Abstract: The semiconductor device of the present invention includes an insulating layer, a high voltage coil and a low voltage coil which are disposed in the insulating layer at an interval in the vertical direction, a low potential portion which is provided in a low voltage region disposed around a high voltage region for the high voltage coil in planar view and is connected with potential lower than the high voltage coil, and an electric field shield portion which is disposed between the high voltage coil and the low voltage region and includes an electrically floated metal member.
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