公开(公告)号：US11107622B2

公开(公告)日：2021-08-31

申请号：US16164278

申请日：2018-10-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byung Soo Kang ,  Byeong Cheol Moon ,  Joung Gul Ryu ,  Ju Hwan Yang

IPC: H01F27/29 ,  H01F27/32 ,  H01F27/28 ,  H01F41/04 ,  H01F27/34

Abstract: A coil component includes a body having a first surface and a second surface opposing each other in a thickness direction of the body and including a core formed in the thickness direction; a coil part embedded in the body and including at least one turn around the core; an insulating layer disposed on the first surface of the body; a bonded conductive layer disposed on the insulating layer and having a surface roughness of the first surface which is in contact with the insulating layer greater than a surface roughness of the second surface opposing the first surface of the bonded conductive layer; and external electrodes connected to the coil part and covering the bonded conductive layer.

公开(公告)号：US11037722B2

公开(公告)日：2021-06-15

申请号：US15970192

申请日：2018-05-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ji Hyung Jung ,  Boum Seock Kim ,  Byeong Cheol Moon

IPC: H01F17/00 ,  H01F41/00 ,  H01F27/29 ,  H01F41/04 ,  H01F41/10 ,  H01F17/04 ,  H01F27/28

Abstract: A coil component includes: a body portion; a coil portion; and an electrode portion, wherein the coil portion includes: a support member; a first coil layer disposed on a first surface of the support member, having first conductive patterns having a planar coil shape, and having a constant line width up to an innermost end portion; a second coil layer disposed on a second surface of the support member, having second conductive patterns having a planar coil shape, and having a constant line width up to an innermost end portion; a via hole penetrating through the support member and partially overlapping innermost end portions of the first and second conductive patterns; and a via conductor filling a portion of the via hole and connected to the innermost end portions of the first and second conductive patterns.

公开(公告)号：US10741321B2

公开(公告)日：2020-08-11

申请号：US15861189

申请日：2018-01-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Boum Seock Kim ,  Kang Wook Bong ,  Byeong Cheol Moon ,  Joung Gul Ryu

IPC: H01F5/00 ,  H01F27/28 ,  H01F27/29 ,  H01F27/255 ,  H01F17/00

Abstract: A thin film type inductor includes first, second and third exposed portions exposed to a first end surface of a body and fourth, fifth and sixth exposed portions exposed to a second end surface of the body opposing the first end surface of the body among external surfaces of the body. The first, second and third exposed portions are formed to be exposed symmetrically to the fourth, fifth and sixth exposed portions opposing the first, second and third exposed portions, respectively.

公开(公告)号：US20200082974A1

公开(公告)日：2020-03-12

申请号：US16293202

申请日：2019-03-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Mi Geum Kim ,  Byeong Cheol Moon ,  Joung Gul Ryu

IPC: H01F27/29 ,  H01F27/32 ,  H01F27/30

Abstract: A coil component includes a body including a magnetic metal powder; an internal insulating layer buried in the body; an internal coil portion disposed on the internal insulating layer, and having turns of which cross-sectional areas increase towards the internal insulating layer from externally of the internal insulating layer; an external insulating layer covering the internal coil portion; an external coil portion disposed on the external insulating layer, and having a greater number of turns than a number of turns of the internal coil portion; a connection via penetrating through the external insulating layer and connecting the internal coil portion and the external coil portion; and an insulating film surrounding the internal insulating layer, the internal coil portion, the external insulating layer, and the external coil portion.

公开(公告)号：US10347419B2

公开(公告)日：2019-07-09

申请号：US15391216

申请日：2016-12-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Hun Kim ,  Byeong Cheol Moon

IPC: H01F27/29 ,  H01F41/04 ,  H01F17/00 ,  H01F17/04

Abstract: A coil electronic component includes: a body including a substrate and coil parts disposed on first and second surfaces of the substrate; and external electrodes formed on outer surfaces of the body and connected to the coil parts. A metal layer is disposed within the substrate.

公开(公告)号：US10236104B2

公开(公告)日：2019-03-19

申请号：US14271968

申请日：2014-05-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Il Lee ,  Byeong Cheol Moon ,  So Yeon Song ,  Ic Seob Kim ,  Soo Hwan Son

IPC: H01F1/01 ,  H01F1/34 ,  H01F17/00 ,  H01F17/04 ,  H01F27/245 ,  H01F27/29 ,  C04B35/26

Abstract: An inductor is provided including a multilayer body in which a plurality of magnetic layers containing a ferrite are laminated. A coil part including a plurality of conductive patterns is disposed in the multilayer body. External electrodes are electrically connected to the coil part. The ferrite may contain iron (Fe), manganese (Mn), nickel (Ni), zinc (Zn), and vanadium (V), and the ferrite may contain 40 to 55 mol % of iron (Fe) calculated as iron oxide (Fe2O3), 5 to 20 mol % of nickel (Ni) calculated as nickel oxide (NiO), 15 to 25 mol % of zinc (Zn) calculated as zinc oxide (ZnO), 15 to 30 mol % of manganese (Mn) calculated as manganese oxide (MnO), and 1 to 4 mol % of vanadium (V) calculated as vanadium oxide (V2O5).

公开(公告)号：US10199166B2

公开(公告)日：2019-02-05

申请号：US15806112

申请日：2017-11-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： No Il Park ,  Byeong Cheol Moon ,  Il Ro Lee ,  Hyun Ho Shin ,  Seung Mo Lim ,  In Young Kang

IPC: H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  H01G4/06 ,  H01G4/30 ,  H01G4/228

Abstract: A capacitor includes: a substrate including a plurality of trenches and a capacitance formation portion, and a margin portion disposed around the capacitance formation portion; dielectric layers disposed on one surface of the substrate and filling the trenches; a plurality of first electrode layers each disposed on one surface of the dielectric layer and each including a first lead portion led out from the capacitance formation portion to the margin portion; and a plurality of second electrode layers each disposed on one surface of the dielectric layer to face the first electrode layer with each of the dielectric layers interposed therebetween, and each including a second lead portion led out from the capacitance formation portion to the margin portion, wherein the first and second lead portions of the plurality of first and second electrode layers are stacked in a stepped shape inclined in a direction from the margin portion to the capacitance formation portion.

公开(公告)号：US20180350509A1

公开(公告)日：2018-12-06

申请号：US15860061

申请日：2018-01-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ji Hyung JUNG ,  Byeong Cheol Moon

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F27/24

Abstract: A coil component includes: an internal coil including a coil body and first and second lead portions; and first and second external electrodes electrically connected to the internal coil. At least one of the first and second lead portions may include first and second lead wires and at least one extension wire connected to at least one of the first and second lead wires and directly connected to the external electrode.

公开(公告)号：US10134520B2

公开(公告)日：2018-11-20

申请号：US15077405

申请日：2016-03-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byeong Cheol Moon

IPC: H01F27/29 ,  H01F5/00 ,  H01F17/04

Abstract: A coil electronic component includes a magnetic body in which a coil having leads exposed to side surfaces of the coil is disposed. External terminals are connected to the leads and disposed on outer surfaces of the magnetic body. Additionally, the external terminals are folded to have side surface portions which are disposed on end surfaces of the magnetic body, and bottom surface portions which are disposed on a bottom surface of the magnetic body.

公开(公告)号：US10020112B2

公开(公告)日：2018-07-10

申请号：US15229587

申请日：2016-08-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jong Sik Yoon ,  Byeong Cheol Moon

IPC: H01F5/00 ,  H01F27/28 ,  H01F27/29 ,  H01F27/255 ,  H01F41/04 ,  H01F41/10

CPC classification number: H01F27/292 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/255 ,  H01F27/2804 ,  H01F41/041 ,  H01F41/10 ,  H01F2017/048

Abstract: A coil component and a method of manufacturing the same are provided. The coil component may include a body part containing a magnetic material, a coil part disposed in the body part, and an electrode part disposed on the body part. The coil part includes a support member, a coil disposed on a surface of the support member and having a terminal exposed to at least one outer surface of the body part, and a conductive via connected to the terminal of the coil and penetrating through at least one end portion of the support member to thereby be exposed to the at least one outer surface of the body part.