公开(公告)号：US11749875B2

公开(公告)日：2023-09-05

申请号：US17343235

申请日：2021-06-09

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Chin Mo Kim ,  Sungyong An ,  Jae Yeong Kim

IPC: H01Q1/00 ,  H01Q1/22 ,  H05K1/18 ,  H05K3/10 ,  H01Q9/04 ,  H05K1/11

CPC classification number: H01Q1/2283 ,  H01Q9/0407 ,  H05K1/11 ,  H05K1/181 ,  H05K3/10 ,  H05K2201/10098

Abstract: A chip antenna includes a substrate having a concavo-convex pattern on a surface thereof, and a conductor pattern disposed on the surface of the substrate having the concavo-convex pattern, wherein a convex portion extending in one direction and a concave portion extending in one direction are alternately disposed in the concavo-convex pattern.

公开(公告)号：US11652272B2

公开(公告)日：2023-05-16

申请号：US17499212

申请日：2021-10-12

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Yeong Kim ,  Sung Nam Cho ,  Sung Yong An ,  Ji Hyung Jung ,  Chin Mo Kim

IPC: H01Q1/22 ,  H01Q9/40 ,  H01Q9/04 ,  H01Q21/06 ,  H01Q1/48 ,  H01Q1/38

CPC classification number: H01Q1/2283 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q9/0457 ,  H01Q9/40 ,  H01Q21/065

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.

公开(公告)号：US11621491B2

公开(公告)日：2023-04-04

申请号：US17405286

申请日：2021-09-01

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Yeong Kim ,  Chin Mo Kim ,  Ji Hyung Jung ,  Sung Nam Cho ,  Sung Yong An

IPC: H01Q1/22 ,  H01Q9/04 ,  H01Q1/48 ,  H01Q1/38

Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.

公开(公告)号：US11069954B2

公开(公告)日：2021-07-20

申请号：US16788585

申请日：2020-02-12

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Chin Mo Kim ,  Jae Yeong Kim ,  Sung Yong An ,  Sung Nam Cho ,  Ji Hyung Jung

IPC: H01Q1/38 ,  H01Q1/22 ,  H01Q9/04 ,  H01Q1/42 ,  H01Q21/06

Abstract: A chip antenna includes a first dielectric substrate, a second dielectric substrate spaced apart from and opposing the first dielectric substrate, a first patch disposed on the first dielectric substrate, a second patch disposed on the second dielectric substrate, and a mounting pad and a feed pad disposed on a mounting surface of the first dielectric substrate. The first dielectric substrate, mounted on a mounting substrate through the mounting pad, is electrically connected to the mounting substrate through the feed pad. One of the first dielectric substrate and the second dielectric substrate is formed of ceramic and another is formed of polytetrafluoroethylene (PTFE).

公开(公告)号：US12176633B2

公开(公告)日：2024-12-24

申请号：US17980203

申请日：2022-11-03

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Juhyoung Park ,  Daeki Lim ,  Won Cheol Lee ,  Jeongki Ryoo ,  Sungyong An ,  Chin Mo Kim

IPC: H01Q9/04 ,  H01Q5/307 ,  H01Q21/08

Abstract: An antenna device according to embodiment includes: a first dielectric layer; a second dielectric layer disposed on the first dielectric layer; a third dielectric layer disposed on the second dielectric layer; a first antenna including a first feed via passing through the first dielectric layer and a first antenna patch disposed in a first surface of the first dielectric layer; and a second antenna including a second feed via passing through the first dielectric layer and a second antenna patch disposed in the first surface of the first dielectric layer, wherein a dielectric constant of the second dielectric layer is lower than a dielectric constant of the first dielectric layer and a dielectric constant of the third dielectric layer, and the second dielectric layer has a cavity overlapping the second antenna patch.

公开(公告)号：US20240347242A1

公开(公告)日：2024-10-17

申请号：US18588880

申请日：2024-02-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seongjae Lee ,  Jongho Chung ,  Jihoon Hwang ,  Jihye Kim ,  Byung Soo Kang ,  Chin Mo Kim

IPC: H01F1/153 ,  H01F27/245

CPC classification number: H01F1/15308 ,  H01F1/15316 ,  H01F1/15333 ,  H01F27/245

Abstract: Soft magnetic alloy particles according to the present disclosure include nanocrystals and amorphous phase and Fe (iron) and Ge (germanium). An average content of Ge in the amorphous phase is Ge(a) (at %) and an average content of Ge in the nanocrystal is Ge(c) (at %), and Ge(a)−Ge(c)>0.

公开(公告)号：US12068548B2

公开(公告)日：2024-08-20

申请号：US17969888

申请日：2022-10-20

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Chin Mo Kim ,  Juhyoung Park ,  Hyunjun Choi ,  Jae Yeong Kim ,  Sungyong An

IPC: H01Q9/04

CPC classification number: H01Q9/045 ,  H01Q9/0414

Abstract: An antenna includes a first insulating layer; a second insulating layer disposed on the first insulating layer in a height direction; a third insulating layer disposed between the first and second insulating layers, a feed via including a first portion passing through the first insulating layer, a second portion passing through the second insulating layer, and a third portion passing through the third insulating layer and connected to the first and second portions; and an antenna patch disposed on the first insulating layer and fed from the feed via, wherein a permittivity of the third insulating layer is lower than permittivities of the first and second insulating layers, and in a direction perpendicular to the height direction, a width of the third portion is wider than a width of the first portion and/or a width of the second portion.

公开(公告)号：US11545734B2

公开(公告)日：2023-01-03

申请号：US17202640

申请日：2021-03-16

Applicant: Samsung Electro-Mechanics Co., Ltd

Inventor： Sungyong An ,  Chin Mo Kim ,  Jungil Kim ,  Juhyoung Park ,  Daeki Lim

IPC: H03M1/38 ,  H01Q1/22 ,  H01Q5/335 ,  H01Q1/38

Abstract: An antenna device is provided. The antenna device includes an antenna body portion configured to transmit and/or receive a radio frequency (RF) signal, and including a dielectric material having a first dielectric constant; a metal layer configured to contact the antenna body portion; a first insulation layer configured to cover at least a part of the metal layer; and an electrical connection structure configured to be electrically connected to the metal layer, wherein the first dielectric constant of the antenna body portion is larger than a dielectric constant of the first insulation layer, and is smaller than a dielectric constant of the metal layer.

公开(公告)号：US11522269B2

公开(公告)日：2022-12-06

申请号：US17318417

申请日：2021-05-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chin Mo Kim ,  Sungyong An

IPC: H01Q1/22 ,  H01Q9/04 ,  H01L23/66 ,  H01Q7/00 ,  H01Q1/24

Abstract: A chip antenna includes: a dielectric material block including a plurality of sides including a first side, a second side, and a third side that are different from each other; a first antenna portion including a first conductor pattern disposed on the first side; a second antenna portion including a second conductor pattern disposed on the second side; and a third antenna portion including a third conductor pattern disposed on the third side. The first conductor pattern, the second conductor pattern, and the third conductor pattern are respectively isolated on the first side, the second side, and the third side, and are independently positioned.

公开(公告)号：US11462832B2

公开(公告)日：2022-10-04

申请号：US17149968

申请日：2021-01-15

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Juhyoung Park ,  Daeki Lim ,  Youngsik Hur ,  Sungyong An ,  Jae Yeong Kim ,  Chin Mo Kim

IPC: H01Q9/04 ,  H04B3/52 ,  H01Q1/24 ,  H01P3/16 ,  H01Q13/28

Abstract: An antenna device includes first and second dielectric layers. The first dielectric layer includes first and second sides facing each other in a third direction. The second dielectric layer includes third and fourth sides facing each other in the third direction. A first antenna patch is disposed on the first side of the first dielectric layer. A second antenna patch is disposed on the third side of the second dielectric layer. Signals with a first frequency bandwidth are transmitted or received electrical signals applied to the first antenna patch. Signals with a different second frequency bandwidth are transmitted or received by an electrical signal applied to the second antenna patch. A height of the second dielectric layer measured to the third side from the fourth side in a direction parallel to a third direction is greater than a height of the first dielectric layer measured to the first side from the second side.