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    CHIP-TYPE COIL COMPONENT
    11.
    发明申请
    CHIP-TYPE COIL COMPONENT 有权
    芯片型线圈组件

    公开(公告)号：US20130293339A1

    公开(公告)日：2013-11-07

    申请号：US13937050

    申请日：2013-07-08

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin JEONG ,  Jae Wook LEE

    IPC: H01F27/28

    CPC classification number: H01F27/2804 ,  H01F17/0033 ,  H01F27/292

    Abstract: The chip-type coil component includes: a body; conductive patterns connected to each other so as to have a coil structure; and external electrodes formed on the bottom surface and the two surfaces in the length direction; wherein a height of the external electrodes in a thickness direction of the body is greater than a height from the bottom surface to a farthest conductive pattern therefrom among the conductive patterns and is less than a height from the bottom surface of the body to the top surface thereof. According to embodiments of the present invention, even in a case in which a chip-type coil component set contacts a metal can, interference such as short-circuits does not occur, and as a result, a chip-type coil component having excellent reliability can be acquired.

    Abstract translation: 芯片型线圈部件包括：主体; 导电图案彼此连接以具有线圈结构; 以及形成在底表面上的两个表面和长度方向上的两个表面的外部电极; 其中，所述外部电极在所述主体的厚度方向上的高度大于所述导电图案中从所述底面到最远的导电图案的高度，并且小于从所述主体的底面到所述顶面的高度 其中。 根据本发明的实施例，即使在芯片型线圈部件组件与金属罐接触的情况下，也不会发生短路等干扰，结果是具有良好可靠性的芯片型线圈部件 可以获得。

    CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    12.
    发明申请
    CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 审中-公开

    公开(公告)号：US20200373055A1

    公开(公告)日：2020-11-26

    申请号：US16992329

    申请日：2020-08-13

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin JEONG

    IPC: H01F17/00 ,  H01F17/06 ,  H01F27/29

    Abstract: There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.

    COIL ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING SAME
    13.
    发明申请
    COIL ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING SAME 审中-公开

    公开(公告)号：US20180233270A1

    公开(公告)日：2018-08-16

    申请号：US15955464

    申请日：2018-04-17

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin JEONG

    IPC: H01F27/28 ,  H01F41/04 ,  H01F27/255 ,  H01F27/29 ,  H01F41/02

    CPC classification number: H01F27/2804 ,  H01F27/255 ,  H01F27/29 ,  H01F41/0233 ,  H01F41/042

    Abstract: A coil electronic component includes a magnetic body having an internal coil part embedded therein, in which the internal coil part includes an insulating substrate, a first insulator, a coil conductor, and a second insulator. The first insulator is disposed on at least one of first and second main surfaces of the insulating substrate and has a groove formed therein. The coil conductor is formed inside the groove. The second insulator encloses the insulating substrate, the first insulator, and the coil conductor. The first insulator may be formed to a thickness larger than (and no more than 40 μm thicker than) a thickness of the coil conductor on the insulating substrate. The first insulator may be formed to a width of 3 μm to 50 μm. Further, the second insulator may extend to a thickness 1 μm to 20 μm larger than that of the first insulator on the insulating substrate.

    COIL ELECTRONIC COMPONENT
    15.
    发明申请
    COIL ELECTRONIC COMPONENT 审中-公开
    线圈电子元件

    公开(公告)号：US20160351318A1

    公开(公告)日：2016-12-01

    申请号：US15081544

    申请日：2016-03-25

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin JEONG

    IPC: H01F27/28 ,  H01F27/255 ,  H01F27/29

    CPC classification number: H01F27/292 ,  H01F17/0013 ,  H01F2017/0066 ,  H01F2017/048

    Abstract: A coil electronic component includes a substrate; a coil pattern formed on at least one of first and second main surfaces of the substrate; a body region filling at least a core region of the coil pattern and having a magnetic material; and a magnetic flux controlling part covering at least the coil pattern and having a material having a saturation magnetic flux density higher than that of a magnetic material contained in the body region.

    Abstract translation: 线圈电子部件包括基板; 形成在所述基板的第一和第二主表面中的至少一个上的线圈图案; 填充所述线圈图案的至少芯区域并具有磁性材料的体区; 以及磁通量控制部，其至少覆盖所述线圈图案，并且具有比所述体区域中所含的磁性材料的饱和磁通密度高的材料。

    ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    16.
    发明申请
    ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
    电子元件及其制造方法

    公开(公告)号：US20160172103A1

    公开(公告)日：2016-06-16

    申请号：US14936433

    申请日：2015-11-09

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin JEONG ,  Kyung Seop LEE ,  Yong Un CHOI ,  Kyung Min SON

    IPC: H01F27/29 ,  H01F41/10 ,  H01F41/04 ,  H01F27/28 ,  H01F27/255

    CPC classification number: H01F27/255 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/292 ,  H01F41/046 ,  H01F2017/048

    Abstract: An electronic component includes a magnetic body; and a coil pattern embedded in the magnetic body, the coil pattern including an internal coil part having a spiral shape and a lead part connected to an end of the internal coil part and exposed to an external surface of the magnetic body. The lead part includes at least two regions having different thicknesses, and the thickness of at least a portion of the lead part having a relatively thin thickness is thinner than a thickness of the internal coil part.

    Abstract translation: 电子部件包括磁性体; 以及嵌入在磁体中的线圈图案，所述线圈图案包括具有螺旋形状的内部线圈部分和与所述内部线圈部分的端部连接并暴露于所述磁性体的外表面的引线部分。 引线部分包括具有不同厚度的至少两个区域，并且具有相对较薄厚度的引线部分的至少一部分的厚度比内部线圈部分的厚度薄。

    ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    18.
    发明申请
    ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
    电子元件及其制造方法

    公开(公告)号：US20160172097A1

    公开(公告)日：2016-06-16

    申请号：US14936502

    申请日：2015-11-09

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin JEONG

    IPC: H01F27/28 ,  H01F41/02 ,  H01F41/04 ,  H01F27/245

    CPC classification number: H01F17/0013 ,  H01F41/042 ,  H01F41/046 ,  H01F2017/0066

    Abstract: An electronic component includes a magnetic body having a surface step formed on at least one surface of the magnetic body; a coil pattern disposed in the magnetic body; and a filling part reducing a thickness of the surface step by filling at least a relatively thin portion of a region in the magnetic body.

    Abstract translation: 电子部件包括磁体，该磁体具有形成在磁体的至少一个表面上的表面台阶; 设置在磁体中的线圈图案; 以及填充部，通过填充至少相对薄的磁性体区域的一部分来减小表面台阶的厚度。

    CHIP ELECTRONIC COMPONENT
    19.
    发明申请
    CHIP ELECTRONIC COMPONENT 审中-公开
    芯片电子元件

    公开(公告)号：US20160086720A1

    公开(公告)日：2016-03-24

    申请号：US14796715

    申请日：2015-07-10

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin JEONG

    IPC: H01F27/28 ,  H01F27/255

    CPC classification number: H01F27/292 ,  H01F17/0013 ,  H01F2017/048

    Abstract: There is provided a chip electronic component including: a magnetic body in which an internal coil part is embedded, wherein the internal coil part includes: a first coil pattern part; and a second coil pattern part formed on the first coil pattern part, when a minimum interval between adjacent coil pattern portions in the first coil pattern part is defined as a, and a maximum thickness of each coil pattern portion in the first coil pattern part is defined as b, a≦15 μm and b/a≧7 are satisfied.

    Abstract translation: 提供一种芯片电子部件，包括：嵌入有内部线圈部的磁性体，其中，所述内部线圈部包括：第一线圈图案部; 以及第一线圈图形部分中形成的第二线圈图形部分，当第一线圈图案部分中的相邻线圈图案部分之间的最小间隔被定义为a，并且第一线圈图案部分中每个线圈图案部分的最大厚度为 定义为b，a＆nlE;15μm和b /a≥7。

    MULTILAYER INDUCTOR
    20.
    发明申请
    MULTILAYER INDUCTOR 审中-公开
    多层电感器

    公开(公告)号：US20150325360A1

    公开(公告)日：2015-11-12

    申请号：US14806565

    申请日：2015-07-22

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin JEONG ,  Hyeog Soo SHIN

    IPC: H01F27/28 ,  H01F27/29

    CPC classification number: H01F27/29 ,  H01F3/14 ,  H01F17/0033 ,  H01F27/2804 ,  H01F27/292 ,  H01F2027/2809

    Abstract: Disclosed herein is a multilayer inductor. The multilayer inductor according to an exemplary embodiment of the present invention includes a laminate on which a plurality of body sheets are multilayered; a coil part configured to have internal electrode patterns formed on the body sheet; a first gap made of a non-magnetic material located between the multilayered body sheets; a second gap made of a dielectric material located between the multilayered body sheets and located on a layer different from the first gap; and external electrodes formed on both surfaces of the laminate and electrically connected with both ends of the coil part. By this configuration, the exemplary embodiment of the present invention can remarkably improve DC biased characteristics without reducing breaking strength of the inductor.

    Abstract translation: 这里公开了一种多层电感器。 根据本发明的示例性实施例的多层电感器包括多层体层叠体， 线圈部，被配置为具有形成在所述主体片上的内部电极图案; 由位于所述多层体片之间的非磁性材料制成的第一间隙; 由位于所述多层体片之间且位于不同于所述第一间隙的层上的电介质材料制成的第二间隙; 以及形成在层压体的两个表面上且与线圈部分的两端电连接的外部电极。 通过这种配置，本发明的示例性实施例可以显着地改善直流偏置特性，而不会降低电感器的断裂强度。

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