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    ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
    电子元件及其制造方法

    公开(公告)号：US20160172103A1

    公开(公告)日：2016-06-16

    申请号：US14936433

    申请日：2015-11-09

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin JEONG ,  Kyung Seop LEE ,  Yong Un CHOI ,  Kyung Min SON

    IPC: H01F27/29 ,  H01F41/10 ,  H01F41/04 ,  H01F27/28 ,  H01F27/255

    CPC classification number: H01F27/255 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/292 ,  H01F41/046 ,  H01F2017/048

    Abstract: An electronic component includes a magnetic body; and a coil pattern embedded in the magnetic body, the coil pattern including an internal coil part having a spiral shape and a lead part connected to an end of the internal coil part and exposed to an external surface of the magnetic body. The lead part includes at least two regions having different thicknesses, and the thickness of at least a portion of the lead part having a relatively thin thickness is thinner than a thickness of the internal coil part.

    Abstract translation: 电子部件包括磁性体; 以及嵌入在磁体中的线圈图案，所述线圈图案包括具有螺旋形状的内部线圈部分和与所述内部线圈部分的端部连接并暴露于所述磁性体的外表面的引线部分。 引线部分包括具有不同厚度的至少两个区域，并且具有相对较薄厚度的引线部分的至少一部分的厚度比内部线圈部分的厚度薄。

    COIL ELECTRONIC COMPONENT
    2.
    发明申请
    COIL ELECTRONIC COMPONENT 有权
    线圈电子元件

    公开(公告)号：US20160307689A1

    公开(公告)日：2016-10-20

    申请号：US15088653

    申请日：2016-04-01

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin JEONG ,  Kyung Seop LEE

    IPC: H01F27/28 ,  H01F27/255

    CPC classification number: H01F17/04 ,  H01F17/0013 ,  H01F2017/002 ,  H01F2017/048

    Abstract: A coil electronic component includes a first coil disposed on a first surface of an insulating substrate; a second coil disposed on a second surface of the insulating substrate opposing the first surface; a via connecting the first and second coils through the insulating substrate; a first via pad formed as one end of the first coil extending and disposed on the first surface of the insulating substrate to cover the via; and a second via pad formed as one end of the second coil extending and disposed on the second surface of the insulating substrate to cover the via. Upper surfaces of the first and second via pads have rounded corners.

    Abstract translation: 线圈电子部件包括设置在绝缘基板的第一表面上的第一线圈; 设置在与第一表面相对的绝缘基板的第二表面上的第二线圈; 通过绝缘基板连接第一和第二线圈的通孔; 第一通孔焊盘，其形成为在绝缘基板的第一表面上延伸并设置以覆盖通孔的第一线圈的一端; 以及形成为第二线圈的一端的第二通孔焊盘，其延伸并设置在绝缘衬底的第二表面上以覆盖通孔。 第一和第二通孔焊盘的上表面具有圆角。

    ELECTRONIC COMPONENT
    4.
    发明申请
    ELECTRONIC COMPONENT 审中-公开
    电子元件

    公开(公告)号：US20160351314A1

    公开(公告)日：2016-12-01

    申请号：US15091466

    申请日：2016-04-05

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin JEONG ,  Kyung Seop LEE

    IPC: H01F27/24 ,  H01F27/29

    CPC classification number: H01F17/0013 ,  H01F17/04 ,  H01F27/292 ,  H01F2017/048

    Abstract: An electronic component includes at least one current path blocking part formed in a surface of a magnetic body in a direction crossing a direction in which terminals of a coil part are exposed. The current path of the fine current flowing on the surface of the magnetic body may be blocked by the current path blocking part, when a high voltage is applied. The current path of the current flowing in the magnetic body may be formed as long as possible, whereby the fine current flowing on the surface of the inductor may be removed or decreased.

    Abstract translation: 电子部件包括沿着与线圈部的端子露出的方向交叉的方向形成在磁性体的表面中的至少一个电流路径阻挡部。 当施加高电压时，流过磁体表面的精细电流的电流路径可能被电流路径阻挡部分阻挡。 可以尽可能长地形成流过磁体的电流的电流路径，从而可以消除或减少在电感器表面流动的微细电流。

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