公开(公告)号：US20180199440A1

公开(公告)日：2018-07-12

申请号：US15914664

申请日：2018-03-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Woo LEE ,  Jin Man JUNG

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/09 ,  H01G4/232 ,  H05K1/02 ,  H01G4/30 ,  H01G4/12

CPC classification number: H05K1/185 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H05K1/0231 ,  H05K1/09 ,  H05K1/115 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

Abstract: There is provided a multilayer ceramic electronic component embedded in a board including: a ceramic body including dielectric layers; first and second internal electrodes; and first and second external electrodes formed on first and second side surfaces of the ceramic body, respectively, wherein the first external electrode includes a first electrode layer and a first metal layer formed on the first electrode layer, the second external electrode includes a second electrode layer and a second metal layer formed on the second electrode layer, the first and second external electrodes are formed to be extended to first main surface of the ceramic body, and when a maximum width and a minimum width of at least one of the first and second external electrodes formed on the first main surface are defined as BWmax and BWmin, respectively, 0≤BWmax−BWmin≤100 μm is satisfied.

公开(公告)号：US20170202090A1

公开(公告)日：2017-07-13

申请号：US15471235

申请日：2017-03-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Woo LEE ,  Jin Man JUNG

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H01G4/232 ,  H01G4/30 ,  H05K1/09 ,  H01G4/12

CPC classification number: H05K1/185 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H05K1/0231 ,  H05K1/09 ,  H05K1/115 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

Abstract: There is provided a multilayer ceramic electronic component embedded in a board including: a ceramic body including dielectric layers; first and second internal electrodes; and first and second external electrodes formed on first and second side surfaces of the ceramic body, respectively, wherein the first external electrode includes a first electrode layer and a first metal layer formed on the first electrode layer, the second external electrode includes a second electrode layer and a second metal layer formed on the second electrode layer, the first and second external electrodes are formed to be extended to first main surface of the ceramic body, and when a maximum width and a minimum width of at least one of the first and second external electrodes formed on the first main surface are defined as BWmax and BWmin, respectively, 0≦BWmax−BWmin≦100 μm is satisfied.

公开(公告)号：US20140182907A1

公开(公告)日：2014-07-03

申请号：US13770887

申请日：2013-02-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Woo LEE ,  Eun Hyuk CHAE ,  Byoung Hwa LEE

IPC: H05K1/16 ,  H01G4/12

CPC classification number: H05K1/162 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30 ,  H05K1/185 ,  H05K2201/10015

Abstract: There is provided an embedded multilayer ceramic electronic component including: a ceramic body including dielectric layers, having first and second lateral surfaces opposing one another, and having a thickness equal to or less than 250 μm; a first internal electrode and a second internal electrode disposed to face one another with the dielectric layer interposed therebetween; a first external electrode formed on the first lateral surface of the ceramic body and electrically connected to the first internal electrode and a second external electrode formed on the second lateral surface and electrically connected to the second internal electrode; and metal layers formed on the first external electrode and the second external electrode, respectively, and including copper (Cu), wherein when a thickness of the metal layers is tp, tp≧5 μm may be satisfied.

Abstract translation: 提供了一种嵌入式多层陶瓷电子部件，其包括：陶瓷体，其包括电介质层，其具有彼此相对的第一和第二侧表面，并且具有等于或小于250μm的厚度; 第一内部电极和第二内部电极，其设置成彼此面对，其间插入介电层; 第一外部电极，其形成在陶瓷体的第一侧面上并电连接到第一内部电极，第二外部电极形成在第二侧面上并电连接到第二内部电极; 以及金属层，分别形成在第一外部电极和第二外部电极上，并且包括铜（Cu），其中当金属层的厚度为tp时，可以满足tp≥5μm。