EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME
    1.
    发明申请
    EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME 审中-公开
    嵌入式多层陶瓷电子元件及其印刷电路板

    公开(公告)号:US20140262463A1

    公开(公告)日:2014-09-18

    申请号:US13941172

    申请日:2013-07-12

    CPC classification number: H05K1/183 H01G2/06 H01G4/005 H01G4/224 H05K1/162

    Abstract: There is provided an embedded multilayer ceramic electronic component including a ceramic body including dielectric layers, having first and second main surfaces, first and second side surfaces, and first and second end surfaces, and having a thickness of 250 μm or less, first and second internal electrodes alternately exposed to the first or second side surface, and first and second external electrodes formed on the first and second side surfaces, wherein the first external electrode includes a first electrode layer and a first metal layer, the second external electrode includes a second electrode layer and a second metal layer, the first and second external electrodes are extended onto the first and second main surfaces, and widths of the first and second external electrodes formed on the first and second main surfaces are different from each other.

    Abstract translation: 提供一种嵌入式多层陶瓷电子部件,其包括具有电介质层的陶瓷体,具有第一和第二主表面,第一和第二侧表面以及第一和第二端面,并且具有250μm或更小的厚度,第一和第二 交替暴露于第一或第二侧表面的内部电极以及形成在第一和第二侧表面上的第一和第二外部电极,其中第一外部电极包括第一电极层和第一金属层,第二外部电极包括第二外部电极 电极层和第二金属层,第一和第二外部电极延伸到第一和第二主表面上,并且形成在第一和第二主表面上的第一和第二外部电极的宽度彼此不同。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
    2.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号:US20160351332A1

    公开(公告)日:2016-12-01

    申请号:US14990742

    申请日:2016-01-07

    CPC classification number: H01G4/30 H01G4/12 H01G4/232 H01G13/006

    Abstract: A multilayer ceramic electronic component includes: a main body; and a first external electrode disposed on a first surface of the main body and a second external electrode disposed on a second surface of the main body. The first external electrodes include a first base electrode forming an edge portion of the first surface of the main body and a first terminal electrode disposed on a portion of the first base electrode. The second external electrodes include a second base electrode forming an edge portion of the second surface of the main body and a second terminal electrode disposed on a portion of the second base electrode.

    Abstract translation: 多层陶瓷电子部件包括:主体; 以及设置在主体的第一表面上的第一外部电极和设置在主体的第二表面上的第二外部电极。 第一外部电极包括形成主体的第一表面的边缘部分的第一基底电极和设置在第一基底电极的一部分上的第一端子电极。 第二外部电极包括形成主体的第二表面的边缘部分的第二基底电极和设置在第二基底电极的一部分上的第二端子电极。

    MULTILAYER CERAMIC CAPACITOR AND CIRCUIT BOARD HAVING THE SAME
    3.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND CIRCUIT BOARD HAVING THE SAME 有权
    多层陶瓷电容器和具有该陶瓷电容器的电路板

    公开(公告)号:US20150302992A1

    公开(公告)日:2015-10-22

    申请号:US14335613

    申请日:2014-07-18

    Abstract: There are provided a multilayer ceramic capacitor and a circuit board having the same. The multilayer ceramic capacitor may include: first and second internal electrodes connected to first and second external electrodes, respectively, and disposed to face each other; and third and fourth internal electrodes connected to the first and second external electrodes, respectively, and disposed to face each other, a connection area of the third and fourth internal electrodes with the first and second external electrodes being different from that of the first and second internal electrodes with the first and second external electrodes, and the first and second external electrodes including first and second conductive layers disposed in inner portions thereof and first and second conductive resin layers disposed in outer portions thereof, respectively.

    Abstract translation: 提供了一种多层陶瓷电容器和具有该多层陶瓷电容器的电路板。 多层陶瓷电容器可以包括:第一和第二内部电极,分别连接到第一外部电极和第二外部电极并且彼此面对设置; 以及第三和第四内部电极,分别与第一外部电极和第二外部电极相连并且彼此相对配置,第三和第四内部电极与第一和第二外部电极的连接区域与第一和第二外部电极的连接区域不同于第一和第二外部电极的连接区域 具有第一外部电极和第二外部电极的内部电极,第一外部电极和第二外部电极分别包括设置在其内部的第一和第二导电层以及设置在其外部的第一和第二导电树脂层。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT HAVING EXTERNAL ELECTRODE LAYERS WITH HOLES

    公开(公告)号:US20200075248A1

    公开(公告)日:2020-03-05

    申请号:US16372782

    申请日:2019-04-02

    Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately stacked with each of the dielectric layers interposed therebetween. First and second external electrodes are disposed on outer surfaces of the ceramic body, connected to the first and second internal electrodes respectively, and disposed to cover at least five of eight corners of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers at least partially in contact with the outer surfaces of the ceramic body and first and second plating layers disposed to cover the first and second base electrode layers, respectively. The first and second plating or base electrode layers have one or more to three or less holes positioned adjacent to one or more to three or less of the eight corners of the ceramic body.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD
    5.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD 审中-公开
    多层陶瓷电子元件嵌入板上

    公开(公告)号:US20150016019A1

    公开(公告)日:2015-01-15

    申请号:US14331019

    申请日:2014-07-14

    CPC classification number: H01G4/30 H01G4/2325

    Abstract: A multilayer ceramic electronic component to be embedded in a board may include: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body, respectively, with at least one of the dielectric layers interposed therebetween; and first and second external electrodes disposed on the end surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively. Each of the first and second external electrodes includes a first external electrode layer containing a glass component and disposed on the end surface of the ceramic body and a second external electrode layer being glass-free and covering the first external electrode layer.

    Abstract translation: 要嵌入板中的多层陶瓷电子部件可以包括:多个电介质层堆叠的陶瓷体; 多个第一和第二内部电极分别通过陶瓷体的两个端面交替地暴露,其中介电层中的至少一个介于其间; 以及第一外部电极和第二外部电极,其分别设置在陶瓷体的端面上并电连接到第一和第二内部电极。 第一和第二外部电极中的每一个包括含有玻璃成分并设置在陶瓷体的端面上的第一外部电极层和不含玻璃的第二外部电极层,并覆盖第一外部电极层。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN
    6.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN 审中-公开
    多层陶瓷电子元件嵌入板和印刷电路板上嵌有多层陶瓷电子元件

    公开(公告)号:US20150060122A1

    公开(公告)日:2015-03-05

    申请号:US14135560

    申请日:2013-12-19

    Abstract: There is provided a multilayer ceramic electronic component embedded in a board including: a ceramic body including dielectric layers; first and second internal electrodes; and first and second external electrodes formed on first and second side surfaces of the ceramic body, respectively, wherein the first external electrode includes a first electrode layer and a first metal layer formed on the first electrode layer, the second external electrode includes a second electrode layer and a second metal layer formed on the second electrode layer, the first and second external electrodes are formed to be extended to first main surface of the ceramic body, and when a maximum width and a minimum width of at least one of the first and second external electrodes formed on the first main surface are defined as BWmax and BWmin, respectively, 0≦BWmax−BWmin≦100 μm is satisfied.

    Abstract translation: 提供了一种嵌入板中的多层陶瓷电子部件,包括:包括电介质层的陶瓷体; 第一和第二内部电极; 以及分别形成在陶瓷体的第一和第二侧面上的第一外部电极和第二外部电极,其中第一外部电极包括形成在第一电极层上的第一电极层和第一金属层,第二外部电极包括第二电极 层和形成在第二电极层上的第二金属层,第一和第二外部电极形成为延伸到陶瓷体的第一主表面,并且当第一和第二外部电极的第一和第二外部电极的最大宽度和最小宽度 形成在第一主表面上的第二外部电极分别被定义为BWmax和BWmin,满足0≤n1E; BWmax-BWmin≦̸满足100μm。

    EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME
    7.
    发明申请
    EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME 有权
    嵌入式多层陶瓷电子元件及其印刷电路板

    公开(公告)号:US20150053472A1

    公开(公告)日:2015-02-26

    申请号:US14135220

    申请日:2013-12-19

    Abstract: There is provided an embedded multilayer ceramic electronic component including: a ceramic body including a dielectric layer; a plurality of first and second internal electrodes; and first and second external electrodes formed on both end portions of the ceramic body, wherein the first and second external electrodes are extended to first and second main surfaces of the ceramic body, and when a thickness of the ceramic body is defined as ts, a maximum thickness of the first and second external electrodes formed on the first and second main surfaces of the ceramic body is defined as tb, a minimum distance of the first and second external electrodes formed on first and second end surfaces of the ceramic body in a length direction of the ceramic body is defined as ta, tb/ts and ta/tb satisfy the following Equations, respectively: 0.1≦tb/ts≦1.0 and 0.5≦ta/tb≦2.0.

    Abstract translation: 提供了一种嵌入式多层陶瓷电子部件,包括:包括电介质层的陶瓷体; 多个第一和第二内部电极; 以及形成在所述陶瓷体的两端部的第一外部电极和第二外部电极,其中,所述第一外部电极和所述第二外部电极延伸到所述陶瓷体的第一和第二主面,并且当所述陶瓷体的厚度被定义为ts时, 形成在陶瓷体的第一和第二主表面上的第一和第二外部电极的最大厚度被定义为tb,在陶瓷体的第一和第二端面上形成的第一和第二外部电极的最小距离为一定长度 陶瓷体的方向被定义为ta,tb / ts和ta / tb分别满足以下等式:0.1≦̸ tb / ts≦̸ 1.0和0.5≦̸ ta / tb≦̸ 2.0。

    MULTILAYER CERAMIC CAPACITOR TO BE EMBEDDED IN BOARD, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING BOARD HAVING MULTILAYER CERAMIC CAPACITOR EMBEDDED THEREIN
    8.
    发明申请
    MULTILAYER CERAMIC CAPACITOR TO BE EMBEDDED IN BOARD, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING BOARD HAVING MULTILAYER CERAMIC CAPACITOR EMBEDDED THEREIN 有权
    嵌入板中的多层陶瓷电容器及其制造方法以及嵌入式多层陶瓷电容器的制造方法

    公开(公告)号:US20150022943A1

    公开(公告)日:2015-01-22

    申请号:US14067912

    申请日:2013-10-30

    CPC classification number: H01G4/30 H01G4/232

    Abstract: There is provided a multilayer ceramic capacitor to be embedded in a board, including: a ceramic body; first and second internal electrodes alternately exposed through end surfaces of the ceramic body; first and second external electrodes formed on end surfaces of the ceramic body; and first and second plating layers enclosing the first and second external electrodes, wherein when distance from one end of bands of the first or second external electrode to the other end thereof is ‘A’ and distance between points at which a virtual line drawn from a point vertically spaced apart from a surface of the first or second plating layer at a point ½×A from one end of the bands inwardly of the ceramic body by 3 μm in length direction of the ceramic body intersects points on the surface of the first or second plating layer is ‘B,’ B/A≧0.6.

    Abstract translation: 提供一种嵌入板的多层陶瓷电容器,包括:陶瓷体; 第一和第二内部电极通过陶瓷体的端面交替地暴露; 形成在陶瓷体的端面上的第一外部电极和第二外部电极; 以及包围第一外部电极和第二外部电极的第一和第二电镀层,其中当从第一或第二外部电极的另一端的带的一端到另一端的距离为“A”时, 从第一或第二镀层的表面垂直间隔开的距离陶瓷体内部的带的一端的距离陶瓷体的长度方向3μm的点的1/2×A与陶瓷体的长度方向相交, 第二镀层为“B”,B /A≥0.6。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    9.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号:US20130163143A1

    公开(公告)日:2013-06-27

    申请号:US13720171

    申请日:2012-12-19

    CPC classification number: H01G4/30 H01G4/008 H01G4/12 Y10T29/417

    Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body having dielectric layers and first and second internal electrodes alternately stacked therein; and first and second external electrodes electrically connected to the first and second internal electrodes and formed at both ends of the ceramic body, wherein the ceramic body includes an effective layer contributing to capacitance formation and a protective layer provided on at least one of upper and lower surfaces of the effective layer, the protective layer including one or more step absorbing layers provided at both ends thereof, so that the multilayer ceramic electronic component can have excellent reliability by reducing defects such as electrode spreading, cracks, delamination and the like.

    Abstract translation: 提供了一种多层陶瓷电子部件,其包括:陶瓷体,其具有交替堆叠的电介质层和第一和第二内部电极; 以及第一和第二外部电极,电连接到第一和第二内部电极并形成在陶瓷体的两端,其中陶瓷体包括有助于电容形成的有效层和设置在上部和下部中的至少一个上的保护层 有效层的表面,保护层包括设置在其两端的一个或多个阶梯吸收层,使得多层陶瓷电子部件可以通过减少诸如电极扩散,裂纹,分层等的缺陷而具有优异的可靠性。

Patent Agency Ranking