中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

19 records (took 0.017 seconds)

    COIL COMPONENT
    14.
    发明申请
    COIL COMPONENT 有权

    公开(公告)号：US20210005379A1

    公开(公告)日：2021-01-07

    申请号：US16673328

    申请日：2019-11-04

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jeong Gu YEO ,  Young Il LEE ,  Byeong Cheol MOON

    IPC: H01F27/29 ,  H01F27/02 ,  H01F27/255 ,  H01F41/02

    Abstract: A coil component includes a body having a molded portion and a cover portion disposed on one surface of the molded portion, and including magnetic metal powder; a winding coil disposed between one surface of the molded portion and the cover portion and embedded in the body, and including a coating layer surrounding a surface of each of a plurality of turns; and a first protective film disposed between the one surface of the molded portion and the cover portion and between at least a portion of the surface of the winding coil and the cover portion.

    COIL COMPONENT
    15.
    发明申请
    COIL COMPONENT 审中-公开

    公开(公告)号：US20190333679A1

    公开(公告)日：2019-10-31

    申请号：US16175746

    申请日：2018-10-30

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Young Il LEE ,  Byeong Cheol MOON

    IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32

    Abstract: A coil electronic component includes a body including an internal coil including first and second end portions, and an encapsulant surrounding the internal coil and formed of a magnetic material, and first and second external electrodes disposed on external surfaces of the body. The body includes a first surface and a second surface to which the first and second end portions are led, respectively, and which oppose each other, a third surface connecting the first and second surfaces to each other and perpendicular to a center of a core of the internal coil, and a fourth surface opposing the third surface, and a first corner connecting the first surface and the third surface to each other and a second corner connecting the second surface and the third surface to each other include first and second recess portions, respectively.

    COIL ELECTRONIC COMPONENT
    16.
    发明申请
    COIL ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20190164689A1

    公开(公告)日：2019-05-30

    申请号：US15970138

    申请日：2018-05-03

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Young Il LEE ,  Han Wool RYU ,  Sang Kyun KWON

    IPC: H01F41/12 ,  H01F27/32 ,  H01F27/24 ,  H01F17/04

    Abstract: A coil electronic component includes a body having a coil portion embedded therein and having a form in which magnetic particles are dispersed in a first insulating material, a first atomic layer deposition (ALD) layer formed along a surface of the coil portion using a second insulating material, a second ALD layer formed along a surface of the first ALD layer using a third insulating material, and external electrodes connected to the coil portion.

    METHOD FOR MANUFACTURING SILICON OXIDE NANO WIRES
    19.
    发明申请
    METHOD FOR MANUFACTURING SILICON OXIDE NANO WIRES 审中-公开
    制造氧化硅纳米线的方法

    公开(公告)号：US20130156951A1

    公开(公告)日：2013-06-20

    申请号：US13709502

    申请日：2012-12-10

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Seon Hee JANG ,  Young Il LEE ,  Su Hwan CHO ,  Dong Hoon KIM ,  Jung Wook SEO

    IPC: B05D3/04

    CPC classification number: B05D3/0453 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  H01L29/0669

    Abstract: Disclosed herein is a method for manufacturing silicon oxide nano wires, the method including: a metal nano particle applying step of applying metal nano particles to a silicon wafer; and a heat treatment step of performing heat treatment under an atmosphere of reactive gas including hydrogen gas. Therefore, the silicon oxide nano wires may be manufactured by a simple process and a separate silicon source needs not to be injected, such that a manufacturing cost may be decreased and manufacturing efficiency may be improved, as compared with methods according to the related art.

    Abstract translation: 本发明公开了一种制造氧化硅纳米线的方法，该方法包括：向硅晶片施加金属纳米颗粒的金属纳米颗粒施加步骤; 以及在包括氢气的反应性气体的气氛下进行热处理的热处理步骤。 因此，与现有技术的方法相比，可以通过简单的工艺制造氧化硅纳米线，并且不需要注入单独的硅源，从而可以降低制造成本并且可以提高制造效率。

Patent Agency Ranking