公开(公告)号：US10153255B2

公开(公告)日：2018-12-11

申请号：US15439321

申请日：2017-02-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji-Hwan Hwang ,  Sang-Sick Park ,  Tae-Hong Min ,  Geol Nam

IPC: H01L25/00 ,  H01L25/065 ,  H01L25/10 ,  H01L23/31 ,  H01L21/56

Abstract: A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of the plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.

公开(公告)号：US10964670B2

公开(公告)日：2021-03-30

申请号：US16225074

申请日：2018-12-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taehyeong Kim ,  Young Lyong Kim ,  Geol Nam

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L25/00

Abstract: Disclosed are semiconductor packages and methods of manufacturing the same. The method of manufacturing a semiconductor package may include providing a carrier substrate having a trench formed on a first top surface of the carrier substrate, providing a first semiconductor chip on the carrier substrate, mounting at least one second semiconductor chip on a second top surface of the first semiconductor chip, coating a mold member to surround a first lateral surface of the first semiconductor chip and a second lateral surface of the at least one second semiconductor chip, and curing the mold member to form a mold layer. The trench may be provided along a first edge of the first semiconductor chip. The mold member may cover a second edge of a bottom surface the first semiconductor chip.

公开(公告)号：US20200219853A1

公开(公告)日：2020-07-09

申请号：US16824403

申请日：2020-03-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji-Hwan Hwang ,  Sang-Sick Park ,  Tae-Hong Min ,  Geol Nam

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H01L25/10

Abstract: A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of the plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.

公开(公告)号：US10651154B2

公开(公告)日：2020-05-12

申请号：US16046471

申请日：2018-07-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Sick Park ,  Geol Nam ,  Tae Hong Min ,  Jihwan Hwang

IPC: H01L25/065 ,  H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00 ,  H01L23/498

Abstract: A semiconductor package includes a plurality of semiconductor chips on a substrate. The semiconductor chips include a first semiconductor chip, a second semiconductor chip, and a third semiconductor chip that are sequentially stacked on the substrate. The semiconductor package further includes a plurality of non-conductive layers between the substrate and the first semiconductor chip and between adjacent semiconductor chips among the semiconductor chips. The semiconductor chips include smaller widths as a distance from the substrate increases. Each of the non-conductive layers includes an extension protruding outward from a side surface of an overlying one of the semiconductor chips.

公开(公告)号：US10431547B2

公开(公告)日：2019-10-01

申请号：US15870910

申请日：2018-01-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Geol Nam ,  Young Lyong Kim

IPC: H01L23/48 ,  H01L23/538 ,  H01L25/065

Abstract: A semiconductor package is provided including a package substrate, a first semiconductor chip on the substrate, with a first surface and a second surface opposite to each other; a plurality of first connection terminals disposed on the first surface contacting an upper surface of the substrate; a second semiconductor chip disposed on the second surface, with a third surface and a fourth surface opposite to each other; a plurality of second connection terminals disposed on the third surface contacting the second surface, wherein an absolute value between a first area, the sum of areas in which the plurality of first connection terminals contact the upper surface of the package substrate, and a second area, the sum of areas in which the plurality of second connection terminals contact the second surface of the first semiconductor chip, is equal to or less than about 0.3 of the first area.

公开(公告)号：US20190096856A1

公开(公告)日：2019-03-28

申请号：US16200109

申请日：2018-11-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji-Hwan Hwang ,  Sang-Sick Park ,  Tae-Hong Min ,  Geol Nam

IPC: H01L25/065 ,  H01L25/10

Abstract: A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of tire plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.