公开(公告)号：US20200219853A1

公开(公告)日：2020-07-09

申请号：US16824403

申请日：2020-03-19

申请人： Samsung Electronics Co., Ltd.

发明人： Ji-Hwan Hwang ,  Sang-Sick Park ,  Tae-Hong Min ,  Geol Nam

IPC分类号： H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H01L25/10

摘要： A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of the plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.

公开(公告)号：US20190096856A1

公开(公告)日：2019-03-28

申请号：US16200109

申请日：2018-11-26

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Ji-Hwan Hwang ,  Sang-Sick Park ,  Tae-Hong Min ,  Geol Nam

IPC分类号： H01L25/065 ,  H01L25/10

摘要： A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of tire plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.

公开(公告)号：US09324683B2

公开(公告)日：2016-04-26

申请号：US14318643

申请日：2014-06-28

申请人： Samsung Electronics Co., Ltd.

发明人： Tae-Hong Min ,  Young-Kun Jee ,  Tae-Je Cho

IPC分类号： H01L21/00 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L23/433 ,  H01L23/31 ,  H01L21/56 ,  H01L23/498

CPC分类号： H01L24/83 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/433 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/2732 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/2939 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83005 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83907 ,  H01L2224/9205 ,  H01L2224/9211 ,  H01L2224/9221 ,  H01L2224/92225 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/07802

摘要： In one embodiment, a semiconductor package includes a circuit substrate, a plurality of semiconductor chips stacked on the circuit substrate, insulating adhesive patterns interposed between the semiconductor chips, a heat slug provided on an uppermost semiconductor chip and adhered to the uppermost semiconductor chip by a heat dissipative adhesive pattern, and a mold structure provided on the circuit substrate to cover sidewalls of the semiconductor chips, the insulating adhesive patterns, the heat dissipative adhesive pattern and the heat slug. A failure of the semiconductor package during a manufacturing process of the mold structure may be reduced. The semiconductor package may therefore have good operating characteristics and reliability.

摘要翻译： 在一个实施例中，半导体封装包括电路基板，堆叠在电路基板上的多个半导体芯片，插入在半导体芯片之间的绝缘粘合剂图案，设置在最上半导体芯片上的散热片，并通过 散热粘合剂图案，以及设置在电路基板上以覆盖半导体芯片的侧壁，绝缘粘合剂图案，散热粘合剂图案和热块的模具结构。 在模具结构的制造过程中半导体封装的故障可能会降低。 因此，半导体封装可具有良好的工作特性和可靠性。

公开(公告)号：US11894346B2

公开(公告)日：2024-02-06

申请号：US18182246

申请日：2023-03-10

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Ji-Hwan Hwang ,  Sang-Sick Park ,  Tae-Hong Min ,  Geol Nam

IPC分类号： H01L25/065 ,  H01L25/10 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00

CPC分类号： H01L25/0657 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50 ,  H01L21/563 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/13025 ,  H01L2224/13101 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/1703 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/8385 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06565 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/1434 ,  H01L2924/1435 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1441 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/73204 ,  H01L2224/32225 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L2224/73204 ,  H01L2224/32145 ,  H01L2224/16145 ,  H01L2924/00012 ,  H01L2224/13101 ,  H01L2924/014 ,  H01L2924/00014

摘要： A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of the plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.

公开(公告)号：US11018115B2

公开(公告)日：2021-05-25

申请号：US16824403

申请日：2020-03-19

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Ji-Hwan Hwang ,  Sang-Sick Park ,  Tae-Hong Min ,  Geol Nam

IPC分类号： H01L25/065 ,  H01L25/10 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00

摘要： A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of the plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.

公开(公告)号：US11664352B2

公开(公告)日：2023-05-30

申请号：US17329036

申请日：2021-05-24

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Ji-Hwan Hwang ,  Sang-Sick Park ,  Tae-Hong Min ,  Geol Nam

IPC分类号： H01L25/065 ,  H01L25/10 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00

CPC分类号： H01L25/0657 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50 ,  H01L21/563 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/13025 ,  H01L2224/13101 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/1703 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/8385 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06565 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/1434 ,  H01L2924/1435 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1441 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/73204 ,  H01L2224/32225 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L2224/73204 ,  H01L2224/32145 ,  H01L2224/16145 ,  H01L2924/00012 ,  H01L2224/13101 ,  H01L2924/014 ,  H01L2924/00014

摘要： A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of the plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.

公开(公告)号：US10153255B2

公开(公告)日：2018-12-11

申请号：US15439321

申请日：2017-02-22

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Ji-Hwan Hwang ,  Sang-Sick Park ,  Tae-Hong Min ,  Geol Nam

IPC分类号： H01L25/00 ,  H01L25/065 ,  H01L25/10 ,  H01L23/31 ,  H01L21/56

摘要： A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of the plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.

公开(公告)号：US09721926B2

公开(公告)日：2017-08-01

申请号：US14825403

申请日：2015-08-13

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Yeong-Hwan Choe ,  Tae-Joo Hwang ,  Tae-Hong Min ,  Young-Kun Jee ,  Sang-Uk Han

IPC分类号： H01L25/065 ,  H01L25/00 ,  H01L23/48 ,  H01L23/00

CPC分类号： H01L25/0657 ,  H01L23/481 ,  H01L24/05 ,  H01L24/06 ,  H01L24/10 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/71 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/06156 ,  H01L2224/10125 ,  H01L2224/131 ,  H01L2224/14156 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75305 ,  H01L2224/81007 ,  H01L2224/81191 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2924/014

摘要： A semiconductor device includes at least first and second semiconductor chips stacked on each other along a first direction, at least one silicon-through-via (TSV) through at least the first semiconductor chip of the first and second semiconductor chips, a contact pad on the at least one TSV of the first semiconductor chip, the contact pad electrically connecting the TSV of the first semiconductor chip to the second semiconductor chip, and a plurality of dummy pads on the first semiconductor chip, the plurality of dummy pads being spaced apart from each other and from the contact pad along a second direction, and the dummy pads having same heights as the contact pads as measured between respective top and bottom surfaces along the first direction.

公开(公告)号：US08884421B2

公开(公告)日：2014-11-11

申请号：US14143178

申请日：2013-12-30

申请人： Samsung Electronics Co., Ltd

发明人： Un-Byoung Kang ,  Jong-Joo Lee ,  Yong-Hoon Kim ,  Tae-Hong Min

IPC分类号： H01L23/02 ,  H01L23/367 ,  H01L25/00 ,  H01L23/498 ,  H01L25/065 ,  H01L23/31

CPC分类号： H01L23/49827 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3677 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/06181 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/16245 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/15311

摘要： A multi-chip package may include a package substrate, an interposer chip, a first semiconductor chip, a thermal dissipation structure and a second semiconductor chip. The interposer chip may be mounted on the package substrate. The first semiconductor chip may be mounted on the interposer chip. The first semiconductor chip may have a size smaller than that of the interposer chip. The thermal dissipation structure may be arranged on the interposer chip to surround the first semiconductor chip. The thermal dissipation structure may transfer heat in the first semiconductor chip to the interposer chip. The second semiconductor chip may be mounted on the first semiconductor chip. Thus, the heat in the first semiconductor chip may be effectively transferred to the interposer chip through the thermal dissipation line.