SEMICONDUCTOR PACKAGE
    11.
    发明申请

    公开(公告)号:US20220173076A1

    公开(公告)日:2022-06-02

    申请号:US17674337

    申请日:2022-02-17

    Inventor: Minsoo KIM

    Abstract: A semiconductor package includes a base substrate, a first semiconductor chip on the base substrate, a dam structure on the base substrate and surrounding the first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a non-conductive film, and a molding member. The non-conductive film may be between the base substrate, the first semiconductor chip, and the second semiconductor chip. The molding member may cover the base substrate, the first semiconductor chip, and the second semiconductor chip. A level of an upper surface of the first semiconductor chip and a level of an upper surface of the dam structure may be at a same level.

    ELECTRONIC DEVICE FOR SCREENING RISK DEGREE OF OBSTRUCTIVE SLEEP APNEA, AND OPERATION METHOD THEREFOR

    公开(公告)号:US20220015716A1

    公开(公告)日:2022-01-20

    申请号:US17485767

    申请日:2021-09-27

    Abstract: An electronic device and method are disclosed for sleep apnea detection. The electronic device includes a display, a photoplethysmogram (PPG) sensor, a memory and a processor. The processor implements the method, including: receiving, for a user, first data from a photoplethysmogram (PPG) sensor, the first data including a pulse signal measured during a first period, and associated with a heartbeat and respiration of the user, determining a first parameter associated with a high-frequency component of the pulse signal, and a second parameter associated with a low-frequency component of the pulse signal, based on at least a portion of the first data, determining fluctuation ranges for the high-frequency component and the low-frequency component, determining whether at least the determined fluctuation ranges are indicative of obstructive sleep apnea (OSA), and displaying information associated with the determination of whether the at least the determined fluctuation ranges are indicative of OSA through the display.

    SEMICONDUCTOR PACKAGE
    13.
    发明申请

    公开(公告)号:US20210111160A1

    公开(公告)日:2021-04-15

    申请号:US16886141

    申请日:2020-05-28

    Inventor: Minsoo KIM

    Abstract: A semiconductor package includes a base substrate, a first semiconductor chip on the base substrate, a dam structure on the base substrate and surrounding the first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a non-conductive film, and a molding member. The non-conductive film may be between the base substrate, the first semiconductor chip, and the second semiconductor chip. The molding member may cover the base substrate, the first semiconductor chip, and the second semiconductor chip. A level of an upper surface of the first semiconductor chip and a level of an upper surface of the dam structure may be at a same level.

    KEY STRUCTURE, KEY INPUT METHOD AND ELECTRONIC DEVICE USING THE SAME

    公开(公告)号:US20210105352A1

    公开(公告)日:2021-04-08

    申请号:US17063972

    申请日:2020-10-06

    Abstract: The disclosure relates to a key structure, a key input method, and an electronic device using the same, and an operating method of an electronic device includes: identifying an input operation, by comparing output values of at least two sensors provided on a side surface of the electronic device and a threshold value; determining whether a function corresponding to the identified input operation exists; and, based on the corresponding function existing, executing the corresponding function. Accordingly, the electronic device can receive various input operations under a keyless structure.

    METHOD OF SENSING PRESSURE BY TOUCH SENSOR AND ELECTRONIC DEVICE ADAPTED THERETO
    16.
    发明申请
    METHOD OF SENSING PRESSURE BY TOUCH SENSOR AND ELECTRONIC DEVICE ADAPTED THERETO 审中-公开
    通过触摸传感器感测压力的方法和适配器的电子设备

    公开(公告)号:US20170052630A1

    公开(公告)日:2017-02-23

    申请号:US15215155

    申请日:2016-07-20

    Abstract: A method of providing pressure and an electronic device adapted thereto is provided. The electronic device includes a display, a touch panel with a number of electrodes, placed on the display, a processor electrically connected to the display and the touch panel, and a memory electrically connected to the processor. The memory stores instructions which enable the processor to receive a user input applied to at least part of the touch panel, add changes in capacitance formed among at least part of the electrodes, in response to the user input, and determine a level of pressure of the user input against the touch panel, based on a sum of capacitance changes. Various embodiments are provided.

    Abstract translation: 提供一种提供压力的方法和适于其的电子装置。 电子设备包括显示器,具有多个电极的触摸面板,放置在显示器上,电连接到显示器和触摸面板的处理器以及电连接到处理器的存储器。 存储器存储使处理器能够接收应用于至少部分触摸面板的用户输入的指令,响应于用户输入增加在至少部分电极中形成的电容的变化,并且确定压力水平 基于电容变化的总和,触摸面板的用户输入。 提供了各种实施例。

    METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

    公开(公告)号:US20240038549A1

    公开(公告)日:2024-02-01

    申请号:US18125958

    申请日:2023-03-24

    Abstract: A method of manufacturing a semiconductor package includes forming a plurality of conductive patterns on a substrate, forming a photoresist film over the substrate to cover the plurality of conductive patterns, forming a photoresist pattern from the photoresist film by a photolithography process using a photomask that includes a transparent area, a light-shielding area, and a semi-transparent area transmitting only a portion of light incident thereon, wherein the photoresist pattern includes a via hole, which exposes one conductive pattern, and a recessed portion, which has a lower surface exposing a portion of the photoresist pattern, forming a conductive post in the via hole, and removing the photoresist pattern by using a photoresist stripping composition.

    UWB ANTENNA AND ELECTRONIC DEVICE INCLUDING SAME

    公开(公告)号:US20230178901A1

    公开(公告)日:2023-06-08

    申请号:US18106245

    申请日:2023-02-06

    CPC classification number: H01Q21/065 H01Q9/0414

    Abstract: An ultra-wide band (UWB) antenna including a dielectric substrate, and first and second conductive layers arranged on opposite sides of the dielectric substrate. The first conductive layer includes a first, second and third patch antennae, each configured to receive a first UWB signal and a second UWB signal, wherein the second and third patch antennae are spaced apart from the first patch antenna in specific directions. The first conductive layer also includes first, second, and third transmission lines connecting, respectively, the first, second, and third patch antennae to a connector. The second conductive layer includes a ground pattern overlapping the first, second, and third patch antennae and the first, second, and third transmission lines, when facing the second conductive layer in a third direction that is perpendicular to the first direction and the second direction.

    ELECTRONIC DEVICE INCLUDING HAPTIC ACTUATOR

    公开(公告)号:US20230048158A1

    公开(公告)日:2023-02-16

    申请号:US17973014

    申请日:2022-10-25

    Abstract: According to one aspect of the disclosure an electronic device comprises a foldable housing including: a hinge structure, a first housing structure connected to the hinge structure, and including a first face and a second face opposite the first face, and a second housing structure connected to the hinge structure and including a third face and a fourth face opposite the third face, the second housing structure being configured to be rotated about the hinge structure; a flexible display extending over the first face and over the third face; at least one sensor disposed within the foldable housing, and configured to sense an angle formed between the first face and the third face; a first haptic actuator disposed within the first housing structure; a second haptic actuator disposed within the second housing structure; at least one processor disposed within the first housing structure or the second housing structure, and operatively connected to the flexible display, the at least one sensor, the first haptic actuator, and the second haptic actuator. The at least one processor may detect a folding state of the foldable housing using the at least one sensor, and independently control the first haptic actuator and the second haptic actuator based on at least part of the detected folding state.

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