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公开(公告)号：US10304483B1
公开(公告)日：2019-05-28
申请号：US15848312
申请日：2017-12-20
Applicant: Seagate Technology LLC
CPC classification number: G11B5/4826 , G11B5/483 , G11B5/6005
Abstract: A slider adhesion system can be practiced in a data storage device with a flexure suspended from a load beam and a slider mounted to a gimbal tongue of the flexure. The slider can be aligned with an aperture of the gimbal tongue and attached to an adhesion feature of the gimbal tongue with an adhesive layer. The adhesion feature may consist of a plurality of cantilevered tabs extending into the aperture of the gimbal tongue.
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公开(公告)号：US09253885B2
公开(公告)日：2016-02-02
申请号：US14594606
申请日：2015-01-12
Applicant: Seagate Technology LLC
CPC classification number: H05K1/111 , G11B5/484 , G11B5/4853 , G11B5/486 , G11B5/4866 , G11B13/04 , H05K1/0277 , H05K1/0298 , H05K1/115
Abstract: A flex circuit including a multiple layer structure is disclosed. The multiple layered structure includes a first or top layer and a second or base layer. Top traces and bond pads are fabricated on the top or obverse layer and interlayer traces and bond pads are fabricated between the first and second layers to provide an electrical interconnect to electrical components on a head assembly. In an illustrated embodiment, the flex circuit includes portions including the first or base layer and the second or top layer and one or more reduced thickness portion including the first or base layer and not the second layer. In one embodiment, the gimbal portion of the flex circuit includes the first layer and not the second layer of the multiple layer structure and in another embodiment a bending portion of the flex circuit includes the first base layer and not the second layer of the multiple layered structure to provide a reduced thickness to facilitate bending, for example in a micro-actuation region of the load beam.
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13.发明申请公开(公告)号：US20150332716A1
公开(公告)日：2015-11-19
申请号：US14277192
申请日：2014-05-14
Applicant: SEAGATE TECHNOLOGY LLC
Inventor： Jason B. Gadbois , Bradley Ver Meer , Joseph Stephan , Scott Matzke , Ravishankar Ajjanagadde Shivarama , Christopher Unger
CPC classification number: G11B5/4853 , G11B5/607 , G11B5/6082 , G11B2005/0021
Abstract: Assemblies and methods that include a flex circuit having a slider facing surface and an opposing back surface; a slider having a back surface and an opposing air bearing surface (ABS), the slider including an electrical connection region; and a through circuit electrical connection, that is in electrical connection with the electrical connection region of the slider, the back surface of the slider interfacing with the slider facing surface of the flex circuit.
Abstract translation: 包括具有滑动面对表面和相对背面的柔性电路的组件和方法; 具有后表面和相对的空气轴承表面（ABS）的滑块，所述滑块包括电连接区域; 以及与滑块的电连接区域电连接的贯穿电路电连接，滑块的后表面与柔性电路的面向滑块的表面相接。
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14.发明授权Trace-gimbal assembly with extension that prevents contact between solder joints 有权跟踪万向节组件，具有防止焊点接触的延伸部件公开(公告)号：US08705324B2
公开(公告)日：2014-04-22
申请号：US13789184
申请日：2013-03-07
Applicant: Seagate Technology LLC
Inventor： Ravishankar Ajjanagadde Shivarama , Christopher Unger
IPC: G11B11/00
CPC classification number: G11B13/04 , G11B5/4826 , G11B2005/0021
Abstract: An apparatus has a slider body that includes an upper surface opposed to a media-facing surface. The slider body has an edge joined between the media-facing surface and the upper surface and facing a coupling region. The slider body includes a first bond pad on the edge and a laser submount coupled to the upper surface of the slider body. The laser submount has a second bond pad facing the coupling region. The apparatus includes a trace-gimbal assembly having first and second electrical traces facing the coupling region and electrically coupled to the respective first and second bond pad via first and second solder joints. An extension of the trace-gimbal assembly extends between the first and second solder joints preventing contact therebetween.
Abstract translation: 一种装置具有滑动体，该滑块主体包括与面向介质的表面相对的上表面。 滑块体具有接合在面向介质的表面和上表面之间并且面向耦合区域的边缘。 滑块主体包括边缘上的第一接合焊盘和耦合到滑块主体的上表面的激光基座。 激光基座具有面向耦合区域的第二接合焊盘。 该装置包括跟踪万向节组件，其具有面向耦合区域的第一和第二电迹线，并且经由第一和第二焊点电耦合到相应的第一和第二接合焊盘。 跟踪万向节组件的延伸部在第一和第二焊点之间延伸，防止它们之间的接触。
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Patent Agency Ranking
公开(公告)号：US20190180777A1
公开(公告)日：2019-06-13
申请号：US15836151
申请日：2017-12-08
Applicant: Seagate Technology, LLC
CPC classification number: G11B5/484 , G11B5/3163 , G11B5/4826 , G11B5/4833
Abstract: A data storage system can employ at least one transducing head that is suspended above a data storage medium to access data. The transducing head suspension can be configured with a resonance system where a gimbal flexure is mounted to a load beam via a physical connection. The gimbal flexure may support a transducing head and contact the load beam via the physical connection, a dimple, and a first contact feature concurrently while the physical connection, dimple, and first contact feature are each separate and different points of physical contact.
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公开(公告)号：US09953669B1
公开(公告)日：2018-04-24
申请号：US15296510
申请日：2016-10-18
Applicant: Seagate Technology LLC
IPC: G11B5/48
CPC classification number: G11B5/4853
Abstract: A slider for use in a disk drive, the slider including a slider body having a leading surface and an opposite trailing surface, wherein the trailing surface includes portions with extensions or depressions. The extensions or depressions include a slider bond pad.
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公开(公告)号：US20180108374A1
公开(公告)日：2018-04-19
申请号：US15296510
申请日：2016-10-18
Applicant: Seagate Technology LLC
IPC: G11B5/48
CPC classification number: G11B5/4853
Abstract: A slider for use in a disk drive, the slider including a slider body having a leading surface and an opposite trailing surface, wherein the trailing surface includes portions with extensions or depressions. The extensions or depressions include a slider bond pad.
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公开(公告)号：US20130286801A1
公开(公告)日：2013-10-31
申请号：US13840197
申请日：2013-03-15
Applicant: SEAGATE TECHNOLOGY LLC
CPC classification number: H05K1/111 , G11B5/484 , G11B5/4853 , G11B5/486 , G11B5/4866 , G11B13/04 , H05K1/0277 , H05K1/0298 , H05K1/115
Abstract: A flex circuit including a multiple layer structure is disclosed. The multiple layered structure includes a first or top layer and a second or base layer. Top traces and bond pads are fabricated on the top or obverse layer and interlayer traces and bond pads are fabricated between the first and second layers to provide an electrical interconnect to electrical components on a head assembly. In an illustrated embodiment, the flex circuit includes portions including the first or base layer and the second or top layer and one or more reduced thickness portion including the first or base layer and not the second layer. In one embodiment, the gimbal portion of the flex circuit includes the first layer and not the second layer of the multiple layer structure and in another embodiment a bending portion of the flex circuit includes the first base layer and not the second layer of the multiple layered structure to provide a reduced thickness to facilitate bending, for example in a micro-actuation region of the load beam.
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公开(公告)号：US20130286800A1
公开(公告)日：2013-10-31
申请号：US13839342
申请日：2013-03-15
Applicant: SEAGATE TECHNOLOGY LLC
Inventor： Bradley J. Ver Meer , Ravishankar Ajjanagadde Shivarama
IPC: G11B13/04
CPC classification number: G11B13/04 , G11B5/4853 , G11B5/486 , G11B5/6088 , G11B2005/0021
Abstract: A flex circuit including a dual sided interconnect structure to connect electrical components on a head or suspension assembly to head circuitry is described. The dual sided interconnect structure described has application for providing an electrical connection to one or more transducer elements on a slider and one or more elements of a heat assisted magnetic recording HAMR unit. In an illustrated embodiment, a flexible structure or insulating base layer includes one or more slider and heat assisted magnetic recording traces coupled to one or more slider or HAMR bond pads on an interconnect portion. As disclosed, the slider bond pads are on the obverse side of the flexible structure and the HAMR bond pads include a reverse side bonding surface to form reverse side bond pads to connect to one or more electrical or heating elements on the HAMR unit.
Abstract translation: 描述了包括将头部或悬架组件上的电气部件连接到头部电路的双面互连结构的柔性电路。 所描述的双面互连结构适用于提供与滑块上的一个或多个换能器元件和热辅助磁记录HAMR单元的一个或多个元件的电连接。 在所示实施例中，柔性结构或绝缘基层包括耦合到互连部分上的一个或多个滑块或HAMR接合焊盘的一个或多个滑块和热辅助磁记录迹线。 如所公开的那样，滑块接合焊盘位于柔性结构的正面，并且HAMR焊盘包括反面接合表面，以形成反向接合焊盘，以连接到HAMR单元上的一个或多个电气或加热元件。
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