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    Gimbal test system
    3.
    发明授权
    Gimbal test system 有权

    公开(公告)号：US11495253B1

    公开(公告)日：2022-11-08

    申请号：US16193104

    申请日：2018-11-16

    Applicant: Seagate Technology LLC

    Inventor： Ravishankar Ajjanagadde Shivarama ,  Bradley J. Ver Meer

    IPC: G11B5/455 ,  G11B5/48

    Abstract: A data storage system may utilize a gimbal test system to find open circuits and short circuits in a head gimbal assembly. The gimbal test system can have a gimbal flexure suspended between a load beam and a data storage medium with a flex circuit physically attached to the gimbal flexure to electrically connect a transducing head to a controller. The flex circuit can be tested with a test via that continuously extends through the flex circuit to a probe portion and a test pad located on an air bearing side of the gimbal flexure. The probe portion can be backed by the gimbal flexure along a plane perpendicular to a recording surface of the data storage medium.

    FLEX CIRCUIT HAVING A MULTIPLE LAYERED STRUCTURE AND INTERCONNECT
    4.
    发明申请
    FLEX CIRCUIT HAVING A MULTIPLE LAYERED STRUCTURE AND INTERCONNECT 有权
    具有多层结构和互连的柔性电路

    公开(公告)号：US20150201493A1

    公开(公告)日：2015-07-16

    申请号：US14594606

    申请日：2015-01-12

    Applicant: Seagate Technology LLC

    Inventor： Ravishankar Ajjanagadde Shivarama ,  Bradley J. Ver Meer ,  Razman Zambri

    IPC: H05K1/11 ,  H05K1/02

    CPC classification number: H05K1/111 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  G11B5/4866 ,  G11B13/04 ,  H05K1/0277 ,  H05K1/0298 ,  H05K1/115

    Abstract: A flex circuit including a multiple layer structure is disclosed. The multiple layered structure includes a first or top layer and a second or base layer. Top traces and bond pads are fabricated on the top or obverse layer and interlayer traces and bond pads are fabricated between the first and second layers to provide an electrical interconnect to electrical components on a head assembly. In an illustrated embodiment, the flex circuit includes portions including the first or base layer and the second or top layer and one or more reduced thickness portion including the first or base layer and not the second layer. In one embodiment, the gimbal portion of the flex circuit includes the first layer and not the second layer of the multiple layer structure and in another embodiment a bending portion of the flex circuit includes the first base layer and not the second layer of the multiple layered structure to provide a reduced thickness to facilitate bending, for example in a micro-actuation region of the load beam.

    Abstract translation: 公开了一种包括多层结构的柔性电路。 多层结构包括第一或顶层和第二或基层。 顶部迹线和接合焊盘制造在顶部或正面层上，层间迹线和接合焊盘制造在第一和第二层之间，以提供与头部组件上的电气部件的电互连。 在所示的实施例中，柔性电路包括包括第一或第二层或第二层或顶层的部分和包括第一层或第二层而不是第二层的一个或多个减薄厚度部分。 在一个实施例中，柔性电路的万向节部分包括第一层而不是多层结构的第二层，在另一个实施例中，柔性电路的弯曲部分包括第一基底层而不是第二层的多层结构 结构以提供减小的厚度以便于弯曲，例如在负载梁的微致动区域中。

    TRACE-GIMBAL ASSEMBLY WITH EXTENSION THAT PREVENTS CONTACT BETWEEN SOLDER JOINTS
    5.
    发明申请
    TRACE-GIMBAL ASSEMBLY WITH EXTENSION THAT PREVENTS CONTACT BETWEEN SOLDER JOINTS 有权
    具有延伸性的TRACE-GIMBAL组件，预防焊接接头之间的联系

    公开(公告)号：US20130286803A1

    公开(公告)日：2013-10-31

    申请号：US13789184

    申请日：2013-03-07

    Applicant: SEAGATE TECHNOLOGY LLC

    Inventor： Ravishankar Ajjanagadde Shivarama ,  Christopher Unger

    IPC: G11B13/04

    CPC classification number: G11B13/04 ,  G11B5/4826 ,  G11B2005/0021

    Abstract: An apparatus has a slider body that includes an upper surface opposed to a media-facing surface. The slider body has an edge joined between the media-facing surface and the upper surface and facing a coupling region. The slider body includes a first bond pad on the edge and a laser submount coupled to the upper surface of the slider body. The laser submount has a second bond pad facing the coupling region. The apparatus includes a trace-gimbal assembly having first and second electrical traces facing the coupling region and electrically coupled to the respective first and second bond pad via first and second solder joints. An extension of the trace-gimbal assembly extends between the first and second solder joints preventing contact therebetween.

    Abstract translation: 一种装置具有滑动体，该滑块主体包括与面向介质的表面相对的上表面。 滑块体具有接合在面向介质的表面和上表面之间并且面向耦合区域的边缘。 滑块主体包括边缘上的第一接合焊盘和耦合到滑块主体的上表面的激光基座。 激光基座具有面向耦合区域的第二接合焊盘。 该装置包括跟踪万向节组件，其具有面向耦合区域的第一和第二电迹线，并且经由第一和第二焊点电耦合到相应的第一和第二接合焊盘。 跟踪万向节组件的延伸部在第一和第二焊点之间延伸，防止它们之间的接触。

    Transducing head suspension with resonance system
    6.
    发明授权
    Transducing head suspension with resonance system 有权

    公开(公告)号：US10395679B2

    公开(公告)日：2019-08-27

    申请号：US15836151

    申请日：2017-12-08

    Applicant: Seagate Technology, LLC

    Inventor： Ravishankar Ajjanagadde Shivarama ,  Bradley J. Ver Meer ,  Razman Zambri

    IPC: G11B5/48 ,  G11B5/31

    Abstract: A data storage system can employ at least one transducing head that is suspended above a data storage medium to access data. The transducing head suspension can be configured with a resonance system where a gimbal flexure is mounted to a load beam via a physical connection. The gimbal flexure may support a transducing head and contact the load beam via the physical connection, a dimple, and a first contact feature concurrently while the physical connection, dimple, and first contact feature are each separate and different points of physical contact.

    Flex circuit with dual sided interconnect structure
    9.
    发明授权
    Flex circuit with dual sided interconnect structure 有权
    Flex电路采用双面互连结构

    公开(公告)号：US09013963B2

    公开(公告)日：2015-04-21

    申请号：US13839342

    申请日：2013-03-15

    Applicant: Seagate Technology LLC

    Inventor： Bradley J. Ver Meer ,  Ravishankar Ajjanagadde Shivarama

    IPC: G11B11/00 ,  G11B5/48 ,  G11B5/60 ,  G11B13/04 ,  G11B5/00

    CPC classification number: G11B13/04 ,  G11B5/4853 ,  G11B5/486 ,  G11B5/6088 ,  G11B2005/0021

    Abstract: A flex circuit including a dual sided interconnect structure to connect electrical components on a head or suspension assembly to head circuitry is described. The dual sided interconnect structure described has application for providing an electrical connection to one or more transducer elements on a slider and one or more elements of a heat assisted magnetic recording HAMR unit. In an illustrated embodiment, a flexible structure or insulating base layer includes one or more slider and heat assisted magnetic recording traces coupled to one or more slider or HAMR bond pads on an interconnect portion. As disclosed, the slider bond pads are on the obverse side of the flexible structure and the HAMR bond pads include a reverse side bonding surface to form reverse side bond pads to connect to one or more electrical or heating elements on the HAMR unit.

    Abstract translation: 描述了包括将头部或悬架组件上的电气部件连接到头部电路的双面互连结构的柔性电路。 所描述的双面互连结构适用于提供与滑块上的一个或多个换能器元件和热辅助磁记录HAMR单元的一个或多个元件的电连接。 在所示实施例中，柔性结构或绝缘基层包括耦合到互连部分上的一个或多个滑块或HAMR接合焊盘的一个或多个滑块和热辅助磁记录迹线。 如所公开的那样，滑块接合焊盘位于柔性结构的正面，并且HAMR焊盘包括反面接合表面，以形成反向接合焊盘，以连接到HAMR单元上的一个或多个电气或加热元件。

    Flex circuit having a multiple layered structure and interconnect
    10.
    发明授权
    Flex circuit having a multiple layered structure and interconnect 有权
    Flex电路具有多层结构和互连

    公开(公告)号：US08934200B2

    公开(公告)日：2015-01-13

    申请号：US13840197

    申请日：2013-03-15

    Applicant: Seagate Technology LLC

    Inventor： Ravishankar Ajjanagadde Shivarama ,  Bradley J. Ver Meer ,  Razman Zambri

    IPC: G11B5/48 ,  H05K1/00 ,  G11B13/04 ,  H05K1/02

    CPC classification number: H05K1/111 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  G11B5/4866 ,  G11B13/04 ,  H05K1/0277 ,  H05K1/0298 ,  H05K1/115

    Abstract: A flex circuit including a multiple layer structure is disclosed. The multiple layered structure includes a first or top layer and a second or base layer. Top traces and bond pads are fabricated on the top or obverse layer and interlayer traces and bond pads are fabricated between the first and second layers to provide an electrical interconnect to electrical components on a head assembly. In an illustrated embodiment, the flex circuit includes portions including the first or base layer and the second or top layer and one or more reduced thickness portion including the first or base layer and not the second layer. In one embodiment, the gimbal portion of the flex circuit includes the first layer and not the second layer of the multiple layer structure and in another embodiment a bending portion of the flex circuit includes the first base layer and not the second layer of the multiple layered structure to provide a reduced thickness to facilitate bending, for example in a micro-actuation region of the load beam.

    Abstract translation: 公开了一种包括多层结构的柔性电路。 多层结构包括第一或顶层和第二或基层。 顶部迹线和接合焊盘制造在顶部或正面层上，层间迹线和接合焊盘制造在第一和第二层之间，以提供与头部组件上的电气部件的电互连。 在所示的实施例中，柔性电路包括包括第一或第二层或第二层或顶层的部分和包括第一层或第二层而不是第二层的一个或多个减薄厚度部分。 在一个实施例中，柔性电路的万向节部分包括第一层而不是多层结构的第二层，在另一个实施例中，柔性电路的弯曲部分包括第一基底层而不是第二层的多层结构 结构以提供减小的厚度以便于弯曲，例如在负载梁的微致动区域中。

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