公开(公告)号：US20160097660A1

公开(公告)日：2016-04-07

申请号：US14971007

申请日：2015-12-16

Applicant: Seiko Epson Corporation

Inventor： Masayasu SAKUMA ,  Yoshihiro KOBAYASHI ,  Shojiro KITAMURA ,  Taketo CHINO ,  Michiharu OGAMI

IPC: G01D11/30 ,  G01P1/00

CPC classification number: G01D11/30 ,  G01C19/5783 ,  G01D11/245 ,  G01P1/00 ,  G01P1/02 ,  G01P1/023 ,  G01P1/026 ,  G01P15/18

Abstract: A module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having fixing faces, wherein the sensor device is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces, and the sensor device is disposed on the supporting member side.

Abstract translation: 模块包括传感器装置，具有多个安装面的安装基板，彼此相邻的安装面之间的可折叠的部分，具有固定面的支撑构件，其中传感器装置安装在至少一个 安装面，每个安装面沿着每个固定面设置，并且传感器装置设置在支撑构件侧。

公开(公告)号：US20230409052A1

公开(公告)日：2023-12-21

申请号：US18461598

申请日：2023-09-06

Applicant: SEIKO EPSON CORPORATION

Inventor： Fumikazu OTANI ,  Taketo CHINO

IPC: G05D1/08 ,  G01C9/02

CPC classification number: G05D1/0891 ,  G01C9/02 ,  B60W30/02

Abstract: A posture estimation device estimates a posture of a movable body based on acceleration information based on a posture change of the movable body and angular velocity information based on the posture change of the movable body. The posture estimation device includes a storage unit that stores the acceleration information, the angular velocity information, and a plurality of posture parameters related to a movement of the movable body, a parameter control unit that selects a selection posture parameter from the plurality of posture parameters, and a posture calculation unit that estimates the posture of the movable body by using the acceleration information, the angular velocity information, and the selection posture parameter.

公开(公告)号：US20210373577A1

公开(公告)日：2021-12-02

申请号：US17332094

申请日：2021-05-27

Applicant: Seiko Epson Corporation

Inventor： Fumikazu OTANI ,  Taketo CHINO

IPC: G05D1/08 ,  G01C9/02

Abstract: A posture estimation device estimates a posture of a movable body based on acceleration information based on a posture change of the movable body and angular velocity information based on the posture change of the movable body. The posture estimation device includes a storage unit that stores the acceleration information, the angular velocity information, and a plurality of posture parameters related to a movement of the movable body, a parameter control unit that selects a selection posture parameter from the plurality of posture parameters, and a posture calculation unit that estimates the posture of the movable body by using the acceleration information, the angular velocity information, and the selection posture parameter.

公开(公告)号：US20200149934A1

公开(公告)日：2020-05-14

申请号：US16743517

申请日：2020-01-15

Applicant: Seiko Epson Corporation

Inventor： Masayasu SAKUMA ,  Yoshihiro KOBAYASHI ,  Shojiro KITAMURA ,  Taketo CHINO

IPC: G01D11/24 ,  G01C21/16 ,  G01C19/5769

Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.

公开(公告)号：US20190285663A1

公开(公告)日：2019-09-19

申请号：US16356192

申请日：2019-03-18

Applicant: Seiko Epson Corporation

Inventor： Taketo CHINO ,  Yoshikuni SAITO ,  Nobuyuki IMAI

IPC: G01P15/18 ,  G01P15/125 ,  G01P15/08 ,  G01C21/16

Abstract: A sensor module includes an X-axis angular velocity sensor device that outputs digital X-axis angular velocity data, a Y-axis angular velocity sensor device that outputs digital Y-axis angular velocity data, a Z-axis angular velocity sensor device that outputs digital Z-axis angular velocity data, an acceleration sensor device that outputs digital X-axis, Y-axis, and Z-axis acceleration data, a microcontroller, a first digital interface bus that electrically connects the X-axis angular velocity sensor device, the Y-axis angular velocity sensor device, and the Z-axis angular velocity sensor device to a first digital interface, and a second digital interface bus that electrically connects the acceleration sensor device to a second digital interface.

公开(公告)号：US20250020686A1

公开(公告)日：2025-01-16

申请号：US18904550

申请日：2024-10-02

Applicant: SEIKO EPSON CORPORATION

Inventor： Taketo CHINO ,  Yoshikuni SAITO ,  Nobuyuki IMAI

IPC: G01P15/18 ,  G01C19/56 ,  G01C21/16 ,  G01P15/08 ,  G01P15/125

Abstract: A sensor module includes an X-axis angular velocity sensor device that outputs digital X-axis angular velocity data, a Y-axis angular velocity sensor device that outputs digital Y-axis angular velocity data, a Z-axis angular velocity sensor device that outputs digital Z-axis angular velocity data, an acceleration sensor device that outputs digital X-axis, Y-axis, and Z-axis acceleration data, a microcontroller, a first digital interface bus that electrically connects the X-axis angular velocity sensor device, the Y-axis angular velocity sensor device, and the Z-axis angular velocity sensor device to a first digital interface, and a second digital interface bus that electrically connects the acceleration sensor device to a second digital interface.

公开(公告)号：US20230258481A1

公开(公告)日：2023-08-17

申请号：US18307274

申请日：2023-04-26

Applicant: SEIKO EPSON CORPORATION

Inventor： Masayasu SAKUMA ,  Yoshihiro KOBAYASHI ,  Shojiro KITAMURA ,  Taketo CHINO

IPC: G01D11/24 ,  G01C19/5769 ,  G01C21/16 ,  H01R12/72 ,  H05K1/14

CPC classification number: G01D11/245 ,  G01C19/5769 ,  G01C21/166 ,  H01R12/72 ,  H05K1/148 ,  G01D11/30

Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.

公开(公告)号：US20210364330A1

公开(公告)日：2021-11-25

申请号：US17395519

申请日：2021-08-06

Applicant: Seiko Epson Corporation

Inventor： Masayasu SAKUMA ,  Yoshihiro KOBAYASHI ,  Shojiro KITAMURA ,  Taketo CHINO

IPC: G01D11/24 ,  G01C19/5769 ,  G01C21/16

Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.

公开(公告)号：US20210349124A1

公开(公告)日：2021-11-11

申请号：US17382448

申请日：2021-07-22

Applicant: Seiko Epson Corporation

Inventor： Taketo CHINO ,  Yoshikuni SAITO ,  Nobuyuki IMAI

IPC: G01P15/18 ,  G01P15/125 ,  G01C21/16 ,  G01P15/08

Abstract: A sensor module includes an X-axis angular velocity sensor device that outputs digital X-axis angular velocity data, a Y-axis angular velocity sensor device that outputs digital Y-axis angular velocity data, a Z-axis angular velocity sensor device that outputs digital Z-axis angular velocity data, an acceleration sensor device that outputs digital X-axis, Y-axis, and Z-axis acceleration data, a microcontroller, a first digital interface bus that electrically connects the X-axis angular velocity sensor device, the Y-axis angular velocity sensor device, and the Z-axis angular velocity sensor device to a first digital interface, and a second digital interface bus that electrically connects the acceleration sensor device to a second digital interface.

公开(公告)号：US20200033825A1

公开(公告)日：2020-01-30

申请号：US16524481

申请日：2019-07-29

Applicant: SEIKO EPSON CORPORATION

Inventor： Fumikazu OTANI ,  Yoshikuni SAITO ,  Taketo CHINO ,  Nobuyuki IMAI

IPC: G05B19/042 ,  G05D1/00

Abstract: A sensor module includes a first sensor device that outputs first measurement data from a first measurement circuit receiving a signal from a first sensor element and performing a measurement process, a second sensor device that outputs a second measurement circuit receiving a signal from a second sensor element and performing a measurement process, and a microcontroller that receives the first measurement data and the second measurement data, in which the first sensor device includes a first terminal that is used for input of an external synchronization signal or a synchronization signal which is a signal based on the external synchronization signal, and input or output of a communication signal, and the second sensor device includes a second terminal that is used for input of the synchronization signal, and input or output of the communication signal.