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公开(公告)号：US20150096372A1
公开(公告)日：2015-04-09
申请号：US14501583
申请日：2014-09-30
Applicant: Seiko Epson Corporation
Inventor： Masayasu SAKUMA , Taketo CHINO
Abstract: A sensor unit includes a sensor and a mount board on which the sensor is mounted. The mount board includes a mount terminal connected to a terminal provided in the sensor and a wiring extending from the mount terminal. The wiring is not provided in a region where the sensor and the mount board overlap each other when viewed in plan.
Abstract translation: 传感器单元包括安装传感器的传感器和安装板。 安装板包括连接到设置在传感器中的端子的安装端子和从安装端子延伸的布线。 当在平面图中观察时，传感器和安装板彼此重叠的区域中不设置布线。
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公开(公告)号：US20240393113A1
公开(公告)日：2024-11-28
申请号：US18672508
申请日：2024-05-23
Applicant: SEIKO EPSON CORPORATION
Inventor： Masayasu SAKUMA
IPC: G01C19/56 , G01P15/125 , G01P15/18
Abstract: An inertial sensor module includes a first inertial sensor that detects a physical quantity of a first axis; a second inertial sensor that detects the physical quantity of the first axis; a first substrate on which the first inertial sensor and the second inertial sensor are mounted; and a second substrate on which the first substrate is mounted and which includes a first terminal electrically coupled to the first inertial sensor via the first substrate and a second terminal electrically coupled to the second inertial sensor via the first substrate.
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公开(公告)号：US20160097660A1
公开(公告)日：2016-04-07
申请号：US14971007
申请日：2015-12-16
Applicant: Seiko Epson Corporation
Inventor： Masayasu SAKUMA , Yoshihiro KOBAYASHI , Shojiro KITAMURA , Taketo CHINO , Michiharu OGAMI
CPC classification number: G01D11/30 , G01C19/5783 , G01D11/245 , G01P1/00 , G01P1/02 , G01P1/023 , G01P1/026 , G01P15/18
Abstract: A module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having fixing faces, wherein the sensor device is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces, and the sensor device is disposed on the supporting member side.
Abstract translation: 模块包括传感器装置，具有多个安装面的安装基板，彼此相邻的安装面之间的可折叠的部分，具有固定面的支撑构件，其中传感器装置安装在至少一个 安装面，每个安装面沿着每个固定面设置，并且传感器装置设置在支撑构件侧。
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公开(公告)号：US20200149934A1
公开(公告)日：2020-05-14
申请号：US16743517
申请日：2020-01-15
Applicant: Seiko Epson Corporation
Inventor： Masayasu SAKUMA , Yoshihiro KOBAYASHI , Shojiro KITAMURA , Taketo CHINO
IPC: G01D11/24 , G01C21/16 , G01C19/5769
Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
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公开(公告)号：US20150040666A1
公开(公告)日：2015-02-12
申请号：US14448122
申请日：2014-07-31
Applicant: Seiko Epson Corporation
Inventor： Yoshikuni SAITO , Yusuke KINOSHITA , Yoshihiro KOBAYASHI , Masayasu SAKUMA
IPC: G01P15/02
CPC classification number: G01P1/023
Abstract: A sensor unit includes a substrate provided with a first sensor device as an inertia sensor and a connector connected to the first sensor device, and a mount on which the substrate is placed and which includes an opening through which the connector is exposed. A gap is provided between the substrate and the mount, and the first sensor device is provided in a position that falls within the gap in a plan view.
Abstract translation: 传感器单元包括设置有作为惯性传感器的第一传感器装置和连接到第一传感器装置的连接器的基板和其上放置基板的安装件，并且包括连接器暴露于该开口的开口。 在基板和安装座之间设有间隙，第一传感器装置设置在俯视图中位于间隙内的位置。
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Patent Agency Ranking
公开(公告)号：US20250076335A1
公开(公告)日：2025-03-06
申请号：US18820457
申请日：2024-08-30
Applicant: SEIKO EPSON CORPORATION
Inventor： Masayasu SAKUMA
Abstract: A sensor module includes: a substrate having a first surface and a second surface that are in a front-back relationship with each other, and side surfaces including a first side surface; a first relay substrate having a first front surface and a first back surface and mounted on the first side surface with the first back surface facing the first side surface, the first front surface and the first back surface being in a front-back relationship with each other; and a first inertial sensor including a first package mounted on the first front surface of the first relay substrate and a first sensor element housed in the first package.
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公开(公告)号：US20240302191A1
公开(公告)日：2024-09-12
申请号：US18665987
申请日：2024-05-16
Applicant: SEIKO EPSON CORPORATION
Inventor： Masayasu SAKUMA , Yoshihiro KOBAYASHI , Shojiro KITAMURA , Taketo CHINO
CPC classification number: G01D11/245 , G01C19/5769 , G01C21/166 , H01R12/72 , H05K1/148 , G01D11/30 , H05K2201/09163
Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
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公开(公告)号：US20210123943A1
公开(公告)日：2021-04-29
申请号：US17081044
申请日：2020-10-27
Applicant: Seiko Epson Corporation
Inventor： Masayasu SAKUMA
Abstract: An inertial measurement unit includes a sensor module including at least one inertial sensor and a printed substrate on which the inertia sensor is provided, and a lead group provided as a support member for supporting the printed substrate on an attachment surface, and leads of the lead group each have a first section coupled to the attachment surface, a second section extending from the first section toward the printed substrate in a direction that intersects the attachment surface, and a third section coupled to the printed substrate.
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公开(公告)号：US20160109238A1
公开(公告)日：2016-04-21
申请号：US14982700
申请日：2015-12-29
Applicant: Seiko Epson Corporation
Inventor： Masayasu SAKUMA , Yoshihiro KOBAYASHI , Shojiro KITAMURA , Taketo CHINO , Nobuyuki IMAI
IPC: G01C19/5783 , G01P15/02 , G01P1/00
CPC classification number: G01C19/5783 , G01P1/00 , G01P15/02 , G01P15/097 , G01P15/18
Abstract: A sensor device includes a mounting board having a first rigid board on which an angular velocity sensor is mounted and a third rigid board on which an angular velocity sensor is mounted, and a pedestal for fixing the mounting board. Further, the pedestal includes a base section having a first fixation surface along an x axis and a y axis, and projecting sections disposed on the base section, and having a second fixation surface along the x axis and a z axis, and a third fixation surface along the y axis and the z axis, each of the rigid boards is supported by at least two of the first fixation surface, the second fixation surface, and the third fixation surface, and the angular velocity sensors have respective detection axes intersecting with each other.
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公开(公告)号：US20150122020A1
公开(公告)日：2015-05-07
申请号：US14596853
申请日：2015-01-14
Applicant: Seiko Epson Corporation
Inventor： Masayasu SAKUMA , Yoshihiro KOBAYASHI , Shojiro KITAMURA , Taketo CHINO
IPC: G01D11/24
CPC classification number: G01D11/245 , G01C19/5769 , G01C21/16 , G01D11/30
Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
Abstract translation: 传感器装置包括具有固定表面的安装构件和至少一个直接或间接地固定到安装构件的固定表面的电子部件，并且安装构件构成用于容纳电子部件的壳体的一部分。 此外，固定面彼此垂直。
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