公开(公告)号：US20230035940A1

公开(公告)日：2023-02-02

申请号：US17874933

申请日：2022-07-27

Applicant: SEMES CO., LTD.

Inventor： Jong Doo LEE ,  Seung Hoon OH ,  Jin Mo JAE ,  Ki Bong KIM ,  Young Hun LEE

IPC: H01L21/67

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a body; a fluid supply unit for supplying a treating fluid to a treating space within the body; and a fluid exhaust line for exhausting the treating fluid from the treating space, and wherein the body includes: a first body; a second body relatively moving with respect to the first body; and an anti-friction member for preventing a friction between the first body and the second body, and wherein the anti-friction member is configured continuously cover at least two surfaces among surfaces of the first body and the second body.

公开(公告)号：US20210249278A1

公开(公告)日：2021-08-12

申请号：US17244722

申请日：2021-04-29

Applicant: SEMES CO., LTD.

Inventor： Young Hun LEE ,  Jae Myoung LEE

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  B08B3/04 ,  B08B3/08 ,  B08B3/14

Abstract: Disclosed are an apparatus and a method for liquid-treating a substrate. An apparatus for treating a substrate includes a liquid treatment chamber that supplies a liquid onto the substrate to liquid-treat the substrate, a drying chamber that removes the remained liquid on the substrate, and a transfer unit that transfers the substrate between the liquid treatment chamber and the drying chamber, wherein the transfer unit includes a hand that supports the substrate, and a weight measuring unit that measures a weight of the remained liquid on the substrate. A weight of a remained liquid on a substrate may be measured by measuring a weight of the substrate while the substrate is transferred.

公开(公告)号：US20240145263A1

公开(公告)日：2024-05-02

申请号：US18099856

申请日：2023-01-20

Applicant: SEMES CO., LTD.

Inventor： Seung Hoon OH ,  Ki Bong KIM ,  Jong Doo LEE ,  Young Hun LEE ,  Mi So PARK ,  Jin Se PARK ,  Yong Sun KO

IPC: H01L21/67

CPC classification number: H01L21/67034

Abstract: According to an aspect of the present disclosure, there is provided a substrate treating apparatus comprising: a vessel part having a substrate treatment region formed therein and including a supply port through which a treating fluid is supplied to the substrate treatment region and an exhaust port through which the treating fluid is exhausted from the substrate treatment region; a fluid supply unit configured to supply the treating fluid to the substrate treatment region; an exhaust unit configured to exhaust the treating fluid from the vessel part. The exhaust unit comprises: a main line connected to the exhaust port; an extension line branched from at least one of first and second nodes of the main line and including at least one of a first orifice or a first check valve to control an exhaust speed; and an auxiliary line branched from a third node of the main line, where an orifice and a check valve are not formed. During a first process time, the treating fluid is discharged through the extension line, and the treating fluid is not discharged through the auxiliary line, and during a second process time, the treating fluid is discharged through the auxiliary line.

公开(公告)号：US20210104417A1

公开(公告)日：2021-04-08

申请号：US17063820

申请日：2020-10-06

Applicant: SEMES CO., LTD.

Inventor： Eui Sang LIM ,  Young Hun LEE ,  Jinwoo JUNG ,  Miso PARK ,  Byongwook AHN ,  Young Hee LEE

IPC: H01L21/67 ,  H01J37/32

Abstract: The apparatus includes a support unit to support the substrate in a treatment space of a process chamber, a first fluid supply unit to supply a supercritical fluid having an organic solvent dissolved in the supercritical fluid, to the treatment space, a second fluid supply unit to supply the supercritical fluid having no organic solvent dissolved in the supercritical fluid, to the treatment space, an exhaust unit to exhaust the treatment space, a controller to control the first fluid supply unit, the second fluid supply unit, and the exhaust unit. The controller controls the first and second fluid supply units such that the supercritical fluid having no organic solvent dissolved in the supercritical fluid is supplied to the treatment space through the second fluid supply unit, after the supercritical fluid mixed with the organic solvent is supplied to the treatment space through the first fluid supply unit.

公开(公告)号：US20210008606A1

公开(公告)日：2021-01-14

申请号：US16924633

申请日：2020-07-09

Applicant: SEMES CO., LTD.

Inventor： Inhwang PARK ,  Gui Su PARK ,  Young Hun LEE ,  Youngseop CHOI ,  Seung Hoon OH ,  Jonghyeon WOO ,  Jin Mo JAE

IPC: B08B7/00 ,  H01L21/67

Abstract: An apparatus for treating a substrate includes a process chamber having a treatment space for treating the substrate; a fluid supply unit for supplying fluid to the treatment space, wherein the fluid supply unit includes: a supply pipe connected to the treatment space to supply the fluid to the treatment space; a pump installed in the supply pipe to provide flow pressure to the fluid; a vent line installed between the pump and the process chamber to discharge pressure in the fluid to an outside; a relief valve installed in the vent line to open and close the vent line; and a reservoir installed between the pump and a branch point wherein the vent line branches from the supply pipe, wherein the reservoir has a cross-sectional area larger than a cross-sectional area of a portion of the supply pipe located between the pump and the branch point.

公开(公告)号：US20200185217A1

公开(公告)日：2020-06-11

申请号：US16791147

申请日：2020-02-14

Applicant: SEMES CO., LTD.

Inventor： Jinwoo JUNG ,  Young Hun LEE

IPC: H01L21/02 ,  B08B7/00 ,  B08B9/08 ,  H01L21/67 ,  H01L21/687

Abstract: An apparatus and a method for cleaning a chamber are provided. A method for cleaning a chamber having a treatment space for treating a substrate includes cleaning the chamber by supplying a cleaning medium into the treatment space. The cleaning medium includes a supercritical fluid having a non-polar property and an organic solvent having a polar property. The cleaning efficiency of the chamber is improved with respect to a non-polar contaminant and a polar contaminant.