公开(公告)号：US10777387B2

公开(公告)日：2020-09-15

申请号：US14039558

申请日：2013-09-27

Applicant: SEMES CO., LTD.

Inventor： Hyung Joon Kim ,  Seung Pyo Lee

IPC: H01J37/32

Abstract: The present invention disclosed herein relates to a substrate treating apparatus, and more particularly, to an apparatus for treating a substrate using plasma. Embodiments of the present invention provide substrate treating apparatuses including a chamber having a treating space defined therein, a support member disposed in the chamber to support a substrate, a gas supply unit supplying a gas into the chamber, a plasma source generating plasma from the gas supplied into the chamber, a baffle disposed to surround the support member in the chamber and having through holes to exhaust a gas in the treating space, and a shielding unit preventing an electromagnetic field from an inside of the chamber to an outside of the chamber.

公开(公告)号：US10692702B2

公开(公告)日：2020-06-23

申请号：US14663658

申请日：2015-03-20

Applicant: SEMES CO., LTD.

Inventor： Hyung Joon Kim ,  Hyungchul Moon

IPC: H01J37/32 ,  H01L21/67

Abstract: Disclosed is a substrate treating apparatus which includes a chamber, a support unit, a dielectric plate, a gas supplying unit, an antenna, and a heating unit. The chamber has a processing space therein, and an upper surface of the processing space is opened. The support unit is disposed in the chamber and supports a substrate. The dielectric plate is installed on the opened upper surface of the chamber to cover the opened upper surface. The gas supplying unit supplies a gas in the chamber. The antenna is disposed above the dielectric plate and creates plasma from the gas. The heating unit is disposed above the antenna and heats the dielectric plate.

公开(公告)号：US20180330925A1

公开(公告)日：2018-11-15

申请号：US15967736

申请日：2018-05-01

Applicant: SEMES CO., LTD.

Inventor： Jinwoo Sim ,  Hyung Joon Kim

IPC: H01J37/32

CPC classification number: H01J37/32642 ,  H01J37/3244 ,  H01J37/32724 ,  H01J2237/002

Abstract: An apparatus for treating a substrate comprises a chamber having a treatment space for treating the substrate; a supporting unit which supports the substrate, inside the treatment space; a gas supplying unit which supplies process gas into the treatment space; and a plasma source which generates plasma based on the process gas inside the treatment space. The supporting unit comprises a supporting plate on which the substrate is placed; a focus ring which is disposed to surround the substrate supported by the supporting plate; a temperature control unit which adjusts a temperature of the focus ring. The temperature control unit may include a first heater which is disposed to heat the focus ring under the focus ring and to be opposite to the focus ring; and a cooling member which is provided under the first heater.

公开(公告)号：US10103018B2

公开(公告)日：2018-10-16

申请号：US13953009

申请日：2013-07-29

Applicant: Semes Co., Ltd.

Inventor： Hyung Joon Kim ,  Seung Pyo Lee ,  Hyung Je Woo

IPC: H01J1/32 ,  C23C16/44 ,  H01L21/02 ,  H01J37/32

Abstract: Provided is a substrate treatment apparatus using plasma. The substrate treatment apparatus includes a housing having an inner space in which a substrate is treated, a support member disposed within the housing to support the substrate, a gas supply unit supplying a gas into the housing, a plasma source generating plasma from the gas supplied into the housing, and a baffle unit disposed to surround the support member within the housing, the baffle unit including a baffle in which through holes for exhausting the gas into the inner space of the housing are defined. The baffle is divided into a plurality of areas when viewed from an upper side, and each of portions of the plurality of areas is formed of a metallic material, and each of the other portions of the plurality of areas is formed of a nonmetallic material.

公开(公告)号：US12211675B2

公开(公告)日：2025-01-28

申请号：US18050711

申请日：2022-10-28

Applicant: SEMES CO., LTD.

Inventor： Ji Hun Kim ,  Hyung Joon Kim

IPC: H01J37/00 ,  H01J37/32 ,  H01L21/3065

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing having a treating space for treating a substrate; a support unit configured to support the substrate at the treating space; and a plasma source for generating a plasma from a process gas supplied into the treating space; an exhaust line connecting to the housing and exhausting an atmosphere of the treating space; and a pressure adjusting unit positioned between the support unit and the exhaust line and configured to adjust an exhaust pressure exhausted from the exhaust line, and wherein the pressure adjusting unit includes: an opening/closing member for opening and closing the exhaust line; a lifting/lowering member for moving the opening/closing member in an up/down direction; and an elastic member for providing a restoring force to the lifting/lowering member.

公开(公告)号：US20210354236A1

公开(公告)日：2021-11-18

申请号：US17388356

申请日：2021-07-29

Applicant: SEMES Co., Ltd.

Inventor： Duk Hyun Son ,  Hyung Joon Kim

IPC: B23K26/042 ,  B25J9/04 ,  B25J9/08 ,  B25J9/10 ,  G03F9/00

Abstract: A substrate treatment apparatus includes a transport part to transport a transparent rectangular substrate, a substrate support part to support the substrate, light generators to irradiate two different lights onto the moving substrate, and sense the irradiated lights, and a controller to determine a posture of the substrate with reference to the sensed lights and control the transport part such that the substrate is seated on the substrate support part in a default posture that is preset. The controller determines the posture of the transparent rectangular substrate with respect to the default posture using a time difference between a time point at which a first light of the two different lights is not transmitted through an edge of the transparent rectangular substrate and a time point at which a second light of the two different lights is not transmitted through the edge of the transparent rectangular substrate.

公开(公告)号：US11145534B2

公开(公告)日：2021-10-12

申请号：US16194014

申请日：2018-11-16

Applicant: SEMES CO., LTD.

Inventor： Seung Pyo Lee ,  Hyung Joon Kim

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687

Abstract: Disclosed are a support unit and a substrate treating apparatus comprising the same. The inventive concept provides a support unit that may prove temperature uniformity between facing areas on a substrate the other areas of the substrate and may solve a problem of not easily separating a substrate by a negative pressure in a pin hole when the substrate is separated from the support unit, and a substrate treating apparatus.

公开(公告)号：US20210035782A1

公开(公告)日：2021-02-04

申请号：US16924513

申请日：2020-07-09

Applicant: SEMES CO., LTD.

Inventor： So Hyung Jiong ,  Hyung Joon Kim

IPC: H01J37/32 ,  H01L21/3065 ,  H01L21/687

Abstract: Provided is an apparatus for a substrate supporting apparatus fixing a focus ring without using a clamp ring. The substrate supporting apparatus comprise a supporting plate for supporting a substrate; a side ring arranged to surround at least a part of a side surface of the supporting plate and including a first through hole; a focus ring arranged on the side ring and including a first circulation channel for circulation of a first temperature control fluid and a second through hole connecting the first circulation channel and a bottom surface therein; and a coupling bolt fixed to the focus ring penetrating through the first through hole and the second through hole from below the side ring and fixing the side ring and the focus ring to each other.

公开(公告)号：US20200168496A1

公开(公告)日：2020-05-28

申请号：US16682333

申请日：2019-11-13

Applicant: SEMES CO., LTD

Inventor： Duk Hyun Son ,  Hyung Joon Kim

IPC: H01L21/68 ,  H01L21/687 ,  B65G47/90

Abstract: A substrate treatment apparatus includes a transport part to transport a transparent rectangular substrate, a substrate support part to support the substrate, light generators to irradiate two different lights onto the moving substrate, and sense the irradiated lights, and a control device to determine a posture of the substrate with reference to the sensed lights and control the transport part such that the substrate is seated on the substrate support part in a default posture that is preset. The control device determines the posture of the transparent rectangular substrate with respect to the default posture using a time difference between a time point at which a first light of the two different lights is not transmitted through an edge of the transparent rectangular substrate and a time point at which a second light of the two different lights is not transmitted through the edge of the transparent rectangular substrate.

公开(公告)号：US10510511B2

公开(公告)日：2019-12-17

申请号：US14528120

申请日：2014-10-30

Applicant: SEMES CO., LTD.

Inventor： Hyung Joon Kim ,  Seung Kue Kim

IPC: H01J37/32

Abstract: Provided is an apparatus for treating a substrate which is capable of uniformly controlling a temperature of a support plate. The apparatus for treating the substrate includes a chamber having a treating space with an opened top surface, a support unit disposed within the chamber to support the substrate, a dielectric assembly disposed on the opened top surface of the chamber to cover the opened top surface, and a plasma source disposed above the dielectric assembly, the plasma source including an antenna generating plasma from a gas supplied into the chamber. The dielectric assembly includes a dielectric window, and heating units each of which is formed of a non-metallic material, the heating units being disposed on a top surface of the dielectric window to heat the dielectric window.